REVISIONS
LTR
E
F
DESCRIPTION
Added changes in accordance with NOR 5962-R085-93
Added device types 45, 46, and 47. Removed CAGE code 34168 for
case outline 8, and added cage code 34168 for case outline 9.
Editorial changes throughout.
Added device types 48-68. ICC1 changes for device types 18, 19,
46, and 47. Updated boilerplate. glg
Updated boilerplate paragraphs as part of a 5 year review. ksr
DATE (YR-MO-DA)
93-03-16
95-11-14
APPROVED
M. A. Frye
M. A. Frye
G
H
98-02-20
05-05-18
Raymond Monnin
Raymond Monnin
REV
SHEET
REV
SHEET
REV STATUS
OF SHEETS
PMIC N/A
H
35
H
15
H
36
H
16
H
37
H
17
H
38
H
18
REV
H
39
H
19
H
40
H
20
H
41
H
21
H
1
H
42
H
22
H
2
H
43
H
23
H
3
H
44
H
24
H
4
H
45
H
25
H
5
H
46
H
26
H
6
H
47
H
27
H
7
H
48
H
28
H
8
H
29
H
9
H
30
H
10
H
31
H
11
H
32
H
12
H
33
H
13
H
34
H
14
SHEET
PREPARED BY
Kenneth Rice
CHECKED BY
Charles Reusing
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
http://www.dscc.dla.mil
STANDARD
MICROCIRCUIT
DRAWING
THIS DRAWING IS
AVAILABLE
FOR USE BY All
DEPARTMENTS
AND AGENCIES OF THE
DEPARTMENT OF DEFENSE
APPROVED BY
Michael A. Frye
DRAWING APPROVAL DATE
90-10-29
MICROCIRCUIT, MEMORY,
DIGITAL, CMOS, 8K x 8 STATIC
RANDOM ACCESS MEMORY
(SRAM), MONOLITHIC SILICON
SIZE
CAGE CODE
REVISION LEVEL
AMSC N/A
H
A
SHEET
67268
1 OF
48
5962-38294
DSCC FORM 2233
APR 97
5962-E335-05
1. SCOPE
1.1 Scope. This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M)
and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part or
Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN.
1.2 PIN. The PIN is as shown in the following example:
5962
|
|
|
|
Federal
stock class
designator
\
-
|
|
|
|
RHA
designator
(see 1.2.1)
\/
Drawing number
1.2.1 RHA designator. Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are
marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A
specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.
1.2.2 Device type(s). The device type(s) identify the circuit function as follows:
Device type
01
02
03
04
05
06
07
08
09
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
Generic number 1/
Circuit function
Data retention
No
Yes
No
Yes
No
Yes
No
Yes
No
Yes
No
Yes
No
Yes
No
Yes
No
Yes
No
Yes
No
Yes
No
Yes
No
Yes
No
Yes
No
No
Yes
Yes
Yes
Yes
Access time
150 ns
120 ns
120 ns
100 ns
100 ns
70 ns
70 ns
55 ns
55 ns
45 ns
45 ns
35 ns
35 ns
25 ns
25 ns
20 ns
20 ns
15 ns
15 ns
70 ns
70 ns
55 ns
55 ns
45 ns
45 ns
35 ns
35 ns
25 ns
25 ns
20 ns
100 ns
70 ns
55 ns
45 ns
38294
01
|
|
|
|
Device
type
(see 1.2.2)
/
Q
|
|
|
|
Device
class
designator
(see 1.2.3)
X
|
|
|
|
Case
outline
(see 1.2.4)
A
|
|
|
|
Lead
finish
(see 1.2.5)
8K x 8 CMOS SRAM
1/ Generic numbers are listed on the Standard Microcircuit Drawing Source Approval Bulletin at the end of this document and
will also be listed in MIL-HDBK-103 and QML-38535.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
5962-38294
SHEET
H
2
Device type
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
51
52
53
54
55
56
57
58
59
60
61
62
63
64
65
66
67
68
Generic number 1/
Circuit function
Data retention
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
No
Yes
Yes
No
No
Yes
No
Yes
No
Yes
No
Yes
No
Yes
No
No
Yes
No
Yes
No
Yes
No
Yes
No
No
Access time
85 ns
70 ns
55 ns
120 ns
70 ns
120 ns
70 ns
55 ns
55 ns
55 ns
120 ns
12 ns
12 ns
70 ns
55 ns
55 ns
45 ns
45 ns
35 ns
35 ns
25 ns
25 ns
20 ns
20 ns
70 ns
55 ns
55 ns
45 ns
45 ns
35 ns
35 ns
25 ns
25 ns
20 ns
8K x 8 CMOS SRAM
1.2.3 Device class designator. The device class designator is a single letter identifying the product assurance level as
follows:
Device class
M
Q or V
Device requirements documentation
Vendor self-certification to the requirements for MIL-STD-883 compliant, non-JAN
class level B microcircuits in accordance with MIL-PRF-38535, appendix A
Certification and qualification to MIL-PRF-38535
1.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows:
Outline letter
X
Y
Z
U
T
M
N
9
8
1/ See footnote 1/, page 2.
Descriptive designator
GDIP1-T28 or CDIP2-T28
CQCC1-N32
CDIP3-T28 or GDIP4-T28
CQCC4-N28
GDFP2-F28
CDFP4-F28
See figure 1
See figure 1
See figure 1
Terminals
28
32
28
28
28
28
28
36
36
Package style
Dual-in-line
Rectangular chip carrier
Dual-in-line
Rectangular chip carrier
Flat pack
Flat pack
Flat pack
Flat pack
Flat pack
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
5962-38294
SHEET
H
3
1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535,
appendix A for device class M.
1.3 Absolute maximum ratings. 2/ 3/
Supply voltage range (VCC)-------------------------------------------
DC input voltage range (VIN)------------------------------------------
DC output voltage range (VOUT) ------------------------------------
Storage temperature range --------------------------------------------
Lead temperature (soldering, 10 seconds) ------------------------
Thermal resistance, junction-to-case (ΘJC):
Cases X, Y, Z, U, T, and M ------------------------------------------
Case N
Case 9
Case 8
--------------------------------------------------------------
--------------------------------------------------------------
--------------------------------------------------------------
See MIL-STD-1835
10°C/W 5/
2.0°C/W 5/
3.3°C/W 5/
-0.5 V dc to VCC+0.5 V dc
1.0 W
+150°C 6/
-0.5 V dc to +7.0 V dc
-0.5 V dc to VCC +0.5 V dc 4/
-0.5 V dc to VCC +0.5 V dc 4/
-65°C to +150°C
+260°C
Output voltage applied in high-Z state ------------------------------
Maximum power dissipation, (PD) -----------------------------------
Maximum junction temperature (TJ) --------------------------------
1.4 Recommended operating conditions.
Supply voltage range (VCC)-------------------------------------------
Supply voltage (VSS)----------------------------------------------------
High level input voltage range (VIH):
Device types 1-39,46-68,42,44 (TTL levels)--------------------
Device types 40,41,43,45 (CMOS levels) -----------------------
Low level input voltage range (VIL)
Device types 1-39,46-68,42,44 (TTL levels)--------------------
Device types 40,41,43,45 (CMOS levels) -----------------------
Case operating temperature range (TC) ---------------------------
1.5 Digital logic testing for device classes Q and V.
Fault coverage measurement of manufacturing
logic tests (MIL-STD-883, test method 5012) ----------------
4.5 V dc minimum to 5.5 V dc maximum
0.0 V dc
-2.2 V dc to VCC + 0.5 V dc
0.8 x VCC to VCC + 0.5 V dc
-0.5 V dc to 0.8 V dc
-0.5 V dc to 0.2 x VCC
-55°C to +125°C
100 percent
2/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the
maximum levels may degrade performance and affect reliability.
3/ All voltages referenced to VSS (VSS = ground) unless otherwise specified.
4/ Negative undershoots to a minimum of -3.0 V are allowed with a maximum of 20 ns pulse width.
5/ When the thermal resistance for this case is specified in MIL-STD-1835 that value shall supersede the value indicated herein.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
5962-38294
SHEET
H
4
2. APPLICABLE DOCUMENTS
2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part
of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the
solicitation or contract.
DEPARTMENT OF DEFENSE SPECIFICATION
MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for.
DEPARTMENT OF DEFENSE STANDARDS
MIL-STD-883 -
MIL-STD-1835 -
Test Method Standard Microcircuits.
Interface Standard Electronic Component Case Outlines.
DEPARTMENT OF DEFENSE HANDBOOKS
MIL-HDBK-103 -
MIL-HDBK-780 -
List of Standard Microcircuit Drawings.
Standard Microcircuit Drawings.
(Copies of these documents are available online at
http://assist.daps.dla.mil/quicksearch/
or
http://assist.daps.dla.mil
or from
the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)
2.2 Non-Government publications. The following document(s) form a part of this document to the extent specified herein.
Unless otherwise specified, the issues of the documents are the issues of the documents cited in the solicitation.
AMERICAN SOCIETY FOR TESTING AND MATERIALS (ASTM)
ASTM Standard F1192-95
-
Standard Guide for the Measurement of Single Event Phenomena from
Heavy Ion Irradiation of Semiconductor Devices.
(Applications for copies of ASTM publications should be addressed to:
ASTM International, PO Box C700, 100 Barr
Harbor Drive, West Conshohocken, PA 19428-2959;
http://www.astm.org.)
ELECTRONICS INDUSTRIES ASSOCIATION (EIA)
JEDEC Standard EIA/JESD78
-
IC Latch-Up Test.
(Applications for copies should be addressed to the Electronics Industries Association, 2500 Wilson Boulevard, Arlington, VA
22201;
http://www.jedec.org.)
(Non-Government standards and other publications are normally available from the organizations that prepare or distribute the
documents. These documents also may be available in or through libraries or other informational services.)
2.3 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of
this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a
specific exemption has been obtained.
3. REQUIREMENTS
3.1 Item requirements. The individual item requirements for device classes Q and V shall be in accordance with
MIL-PRF-38535 and as specified herein or as modified in the device manufacturer's Quality Management (QM) plan. The
modification in the QM plan shall not affect the form, fit, or function as described herein. The individual item requirements for
device class M shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified
herein.
3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in
MIL-PRF-38535 and herein for device classes Q and V or MIL-PRF-38535, appendix A and herein for device class M.
3.2.1 Case outline(s). The case outline(s) shall be in accordance with 1.2.4 herein and figure 1.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
5962-38294
SHEET
H
5
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