OT PLD, 25ns, PAL-Type, CMOS, CDIP24, CERAMIC, DIP-24
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 零件包装代码 | DIP |
| 包装说明 | DIP, DIP24,.3 |
| 针数 | 24 |
| Reach Compliance Code | not_compliant |
| ECCN代码 | 3A001.A.2.C |
| 其他特性 | 10 MACROCELLS; 1 EXTERNAL CLOCK; SHARED INPUT/CLOCK; VARIABLE PRODUCT TERMS |
| 架构 | PAL-TYPE |
| 最大时钟频率 | 30.3 MHz |
| JESD-30 代码 | R-GDIP-T24 |
| JESD-609代码 | e0 |
| 长度 | 31.877 mm |
| 专用输入次数 | 11 |
| I/O 线路数量 | 10 |
| 输入次数 | 22 |
| 输出次数 | 10 |
| 产品条款数 | 132 |
| 端子数量 | 24 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 组织 | 11 DEDICATED INPUTS, 10 I/O |
| 输出函数 | MACROCELL |
| 封装主体材料 | CERAMIC, GLASS-SEALED |
| 封装代码 | DIP |
| 封装等效代码 | DIP24,.3 |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 峰值回流温度（摄氏度） | NOT SPECIFIED |
| 电源 | 5 V |
| 可编程逻辑类型 | OT PLD |
| 传播延迟 | 25 ns |
| 认证状态 | Not Qualified |
| 筛选级别 | MIL-STD-883 |
| 座面最大高度 | 5.08 mm |
| 最大供电电压 | 5.5 V |
| 最小供电电压 | 4.5 V |
| 标称供电电压 | 5 V |
| 表面贴装 | NO |
| 技术 | CMOS |
| 温度等级 | MILITARY |
| 端子面层 | Tin/Lead (Sn/Pb) - hot dipped |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 7.62 mm |
| Base Number Matches | 1 |
| 5962-8867001LA | 5962-88670013A | 5962-8753901LA | 5962-87539013A | 5962-8867002LA | 5962-88670023A | |
|---|---|---|---|---|---|---|
| 描述 | OT PLD, 25ns, PAL-Type, CMOS, CDIP24, CERAMIC, DIP-24 | OT PLD, 25ns, PAL-Type, CMOS, CQCC28, CERAMIC, LCC-28 | UV PLD, 25ns, PAL-Type, CMOS, CDIP24, CERAMIC, DIP-24 | UV PLD, 25ns, PAL-Type, CMOS, CQCC28, WINDOWED, CERAMIC, LCC-28 | OT PLD, 30ns, PAL-Type, CMOS, CDIP24, CERAMIC, DIP-24 | OT PLD, 30ns, PAL-Type, CMOS, CQCC28, CERAMIC, LCC-28 |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 零件包装代码 | DIP | QLCC | DIP | QLCC | DIP | QLCC |
| 包装说明 | DIP, DIP24,.3 | CERAMIC, LCC-28 | DIP, DIP24,.3 | WINDOWED, CERAMIC, LCC-28 | DIP, DIP24,.3 | CERAMIC, LCC-28 |
| 针数 | 24 | 28 | 24 | 28 | 24 | 28 |
| Reach Compliance Code | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant |
| ECCN代码 | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C |
| 其他特性 | 10 MACROCELLS; 1 EXTERNAL CLOCK; SHARED INPUT/CLOCK; VARIABLE PRODUCT TERMS | 10 MACROCELLS; 1 EXTERNAL CLOCK; SHARED INPUT/CLOCK; VARIABLE PRODUCT TERMS | 10 MACROCELLS; 1 EXTERNAL CLOCK; SHARED INPUT/CLOCK; VARIABLE PRODUCT TERMS | 10 MACROCELLS; 1 EXTERNAL CLOCK; SHARED INPUT/CLOCK; VARIABLE PRODUCT TERMS | 10 MACROCELLS; 1 EXTERNAL CLOCK; SHARED INPUT/CLOCK; VARIABLE PRODUCT TERMS | 10 MACROCELLS; 1 EXTERNAL CLOCK; SHARED INPUT/CLOCK; VARIABLE PRODUCT TERMS |
| 架构 | PAL-TYPE | PAL-TYPE | PAL-TYPE | PAL-TYPE | PAL-TYPE | PAL-TYPE |
| 最大时钟频率 | 30.3 MHz | 30.3 MHz | 30.3 MHz | 30.3 MHz | 25 MHz | 25 MHz |
| JESD-30 代码 | R-GDIP-T24 | S-CQCC-N28 | R-GDIP-T24 | S-CQCC-N28 | R-GDIP-T24 | S-CQCC-N28 |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 |
| 长度 | 31.877 mm | 11.43 mm | 31.877 mm | 11.43 mm | 31.877 mm | 11.43 mm |
| 专用输入次数 | 11 | 11 | 11 | 11 | 11 | 11 |
| I/O 线路数量 | 10 | 10 | 10 | 10 | 10 | 10 |
| 输入次数 | 22 | 22 | 22 | 22 | 22 | 22 |
| 输出次数 | 10 | 10 | 10 | 10 | 10 | 10 |
| 产品条款数 | 132 | 132 | 132 | 132 | 132 | 132 |
| 端子数量 | 24 | 28 | 24 | 28 | 24 | 28 |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C |
| 组织 | 11 DEDICATED INPUTS, 10 I/O | 11 DEDICATED INPUTS, 10 I/O | 11 DEDICATED INPUTS, 10 I/O | 11 DEDICATED INPUTS, 10 I/O | 11 DEDICATED INPUTS, 10 I/O | 11 DEDICATED INPUTS, 10 I/O |
| 输出函数 | MACROCELL | MACROCELL | MACROCELL | MACROCELL | MACROCELL | MACROCELL |
| 封装主体材料 | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | DIP | QCCN | DIP | WQCCN | DIP | QCCN |
| 封装等效代码 | DIP24,.3 | LCC28,.45SQ | DIP24,.3 | LCC28,.45SQ | DIP24,.3 | LCC28,.45SQ |
| 封装形状 | RECTANGULAR | SQUARE | RECTANGULAR | SQUARE | RECTANGULAR | SQUARE |
| 封装形式 | IN-LINE | CHIP CARRIER | IN-LINE | CHIP CARRIER, WINDOW | IN-LINE | CHIP CARRIER |
| 峰值回流温度（摄氏度） | NOT SPECIFIED | 240 | NOT SPECIFIED | 225 | NOT SPECIFIED | 240 |
| 电源 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 可编程逻辑类型 | OT PLD | OT PLD | UV PLD | UV PLD | OT PLD | OT PLD |
| 传播延迟 | 25 ns | 25 ns | 25 ns | 25 ns | 30 ns | 30 ns |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 筛选级别 | MIL-STD-883 | MIL-STD-883 | MIL-STD-883 | 38535Q/M;38534H;883B | MIL-STD-883 | 38535Q/M;38534H;883B |
| 座面最大高度 | 5.08 mm | 1.9812 mm | 5.08 mm | 2.8956 mm | 5.08 mm | 1.9812 mm |
| 最大供电电压 | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| 标称供电电压 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | NO | YES | NO | YES | NO | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY |
| 端子面层 | Tin/Lead (Sn/Pb) - hot dipped | Tin/Lead (Sn/Pb) - hot dipped | Tin/Lead (Sn/Pb) - hot dipped | Tin/Lead (Sn/Pb) - hot dipped | Tin/Lead (Sn/Pb) - hot dipped | Tin/Lead (Sn/Pb) - hot dipped |
| 端子形式 | THROUGH-HOLE | NO LEAD | THROUGH-HOLE | NO LEAD | THROUGH-HOLE | NO LEAD |
| 端子节距 | 2.54 mm | 1.27 mm | 2.54 mm | 1.27 mm | 2.54 mm | 1.27 mm |
| 端子位置 | DUAL | QUAD | DUAL | QUAD | DUAL | QUAD |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | 30 | NOT SPECIFIED | 30 | NOT SPECIFIED | 30 |
| 宽度 | 7.62 mm | 11.43 mm | 7.62 mm | 11.43 mm | 7.62 mm | 11.43 mm |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 |
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