1MX18 CACHE SRAM, 3.1ns, PQFP100, TQFP-100
| 参数名称 | 属性值 |
| 是否无铅 | 含铅 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | Integrated Silicon Solution ( ISSI ) |
| 零件包装代码 | QFP |
| 包装说明 | TQFP-100 |
| 针数 | 100 |
| Reach Compliance Code | compliant |
| ECCN代码 | 3A991.B.2.A |
| Factory Lead Time | 12 weeks |
| 最长访问时间 | 3.1 ns |
| 其他特性 | PIPELINED ARCHITECTURE |
| 最大时钟频率 (fCLK) | 200 MHz |
| I/O 类型 | COMMON |
| JESD-30 代码 | R-PQFP-G100 |
| JESD-609代码 | e0 |
| 长度 | 20 mm |
| 内存密度 | 18874368 bit |
| 内存集成电路类型 | CACHE SRAM |
| 内存宽度 | 18 |
| 功能数量 | 1 |
| 端子数量 | 100 |
| 字数 | 1048576 words |
| 字数代码 | 1000000 |
| 工作模式 | SYNCHRONOUS |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 组织 | 1MX18 |
| 输出特性 | 3-STATE |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | LQFP |
| 封装等效代码 | QFP100,.63X.87 |
| 封装形状 | RECTANGULAR |
| 封装形式 | FLATPACK, LOW PROFILE |
| 并行/串行 | PARALLEL |
| 峰值回流温度(摄氏度) | 240 |
| 电源 | 2.5 V |
| 认证状态 | Not Qualified |
| 座面最大高度 | 1.6 mm |
| 最大待机电流 | 0.125 A |
| 最小待机电流 | 2.38 V |
| 最大压摆率 | 0.475 mA |
| 最大供电电压 (Vsup) | 2.625 V |
| 最小供电电压 (Vsup) | 2.375 V |
| 标称供电电压 (Vsup) | 2.5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | GULL WING |
| 端子节距 | 0.65 mm |
| 端子位置 | QUAD |
| 处于峰值回流温度下的最长时间 | 30 |
| 宽度 | 14 mm |
| Base Number Matches | 1 |

| IS61VPS102418A-200TQI | IS61VPS102418A-200TQ | IS61LPS25672A-250B1L | IS61LPS102418A-250TQLI | IS61LPS51236A-200B2LI | IS61VPS102418A-250B2 | |
|---|---|---|---|---|---|---|
| 描述 | 1MX18 CACHE SRAM, 3.1ns, PQFP100, TQFP-100 | 1MX18 CACHE SRAM, 3.1ns, PQFP100, TQFP-100 | Cache SRAM, 256KX72, 2.6ns, CMOS, PBGA209, 14 X 22 MM, 1 MM PITCH, LEAD FREE, PLASTIC, BGA-209 | Cache SRAM, 1MX18, 2.6ns, CMOS, PQFP100, LEAD FREE, TQFP-100 | Cache SRAM, 512KX36, 3.1ns, CMOS, PBGA119, 14 X 22 MM, 1 MM PITCH, LEAD FREE, PLASTIC, BGA-119 | Cache SRAM, 1MX18, 2.6ns, CMOS, PBGA119, 14 X 22 MM, 1 MM PITCH, PLASTIC, BGA-119 |
| 是否无铅 | 含铅 | 含铅 | 不含铅 | 不含铅 | 不含铅 | 含铅 |
| 是否Rohs认证 | 不符合 | 不符合 | 符合 | 符合 | 符合 | 不符合 |
| 厂商名称 | Integrated Silicon Solution ( ISSI ) | Integrated Silicon Solution ( ISSI ) | Integrated Silicon Solution ( ISSI ) | Integrated Silicon Solution ( ISSI ) | Integrated Silicon Solution ( ISSI ) | Integrated Silicon Solution ( ISSI ) |
| 零件包装代码 | QFP | QFP | BGA | QFP | BGA | BGA |
| 包装说明 | TQFP-100 | TQFP-100 | BGA, BGA209,11X19,40 | LQFP, QFP100,.63X.87 | BGA, BGA119,7X17,50 | BGA, BGA119,7X17,50 |
| 针数 | 100 | 100 | 209 | 100 | 119 | 119 |
| Reach Compliance Code | compliant | compliant | compliant | compliant | compliant | compliant |
| ECCN代码 | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A |
| 最长访问时间 | 3.1 ns | 3.1 ns | 2.6 ns | 2.6 ns | 3.1 ns | 2.6 ns |
| 其他特性 | PIPELINED ARCHITECTURE | PIPELINED ARCHITECTURE | PIPELINED ARCHITECTURE | PIPELINED ARCHITECTURE | PIPELINED ARCHITECTURE | PIPELINED ARCHITECTURE |
| 最大时钟频率 (fCLK) | 200 MHz | 200 MHz | 250 MHz | 250 MHz | 200 MHz | 250 MHz |
| I/O 类型 | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON |
| JESD-30 代码 | R-PQFP-G100 | R-PQFP-G100 | R-PBGA-B209 | R-PQFP-G100 | R-PBGA-B119 | R-PBGA-B119 |
| JESD-609代码 | e0 | e0 | e1 | e3 | e1 | e0 |
| 长度 | 20 mm | 20 mm | 22 mm | 20 mm | 22 mm | 22 mm |
| 内存密度 | 18874368 bit | 18874368 bit | 18874368 bit | 18874368 bit | 18874368 bit | 18874368 bit |
| 内存集成电路类型 | CACHE SRAM | CACHE SRAM | CACHE SRAM | CACHE SRAM | CACHE SRAM | CACHE SRAM |
| 内存宽度 | 18 | 18 | 72 | 18 | 36 | 18 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 100 | 100 | 209 | 100 | 119 | 119 |
| 字数 | 1048576 words | 1048576 words | 262144 words | 1048576 words | 524288 words | 1048576 words |
| 字数代码 | 1000000 | 1000000 | 256000 | 1000000 | 512000 | 1000000 |
| 工作模式 | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
| 最高工作温度 | 85 °C | 70 °C | 70 °C | 85 °C | 85 °C | 70 °C |
| 组织 | 1MX18 | 1MX18 | 256KX72 | 1MX18 | 512KX36 | 1MX18 |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | LQFP | LQFP | BGA | LQFP | BGA | BGA |
| 封装等效代码 | QFP100,.63X.87 | QFP100,.63X.87 | BGA209,11X19,40 | QFP100,.63X.87 | BGA119,7X17,50 | BGA119,7X17,50 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | FLATPACK, LOW PROFILE | FLATPACK, LOW PROFILE | GRID ARRAY | FLATPACK, LOW PROFILE | GRID ARRAY | GRID ARRAY |
| 并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| 峰值回流温度(摄氏度) | 240 | NOT SPECIFIED | 260 | 260 | 260 | NOT SPECIFIED |
| 电源 | 2.5 V | 2.5 V | 2.5/3.3,3.3 V | 2.5/3.3,3.3 V | 2.5/3.3,3.3 V | 2.5 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 1.6 mm | 1.6 mm | 1.95 mm | 1.6 mm | 3.5 mm | 3.5 mm |
| 最大待机电流 | 0.125 A | 0.11 A | 0.11 A | 0.125 A | 0.125 A | 0.11 A |
| 最小待机电流 | 2.38 V | 2.38 V | 3.14 V | 3.14 V | 3.14 V | 2.38 V |
| 最大压摆率 | 0.475 mA | 0.425 mA | 0.45 mA | 0.5 mA | 0.475 mA | 0.45 mA |
| 最大供电电压 (Vsup) | 2.625 V | 2.625 V | 3.465 V | 3.465 V | 3.465 V | 2.625 V |
| 最小供电电压 (Vsup) | 2.375 V | 2.375 V | 3.135 V | 3.135 V | 3.135 V | 2.375 V |
| 标称供电电压 (Vsup) | 2.5 V | 2.5 V | 3.3 V | 3.3 V | 3.3 V | 2.5 V |
| 表面贴装 | YES | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | COMMERCIAL | COMMERCIAL | INDUSTRIAL | INDUSTRIAL | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Silver/Copper (Sn/Ag/Cu) | Matte Tin (Sn) - annealed | TIN SILVER COPPER | Tin/Lead (Sn/Pb) |
| 端子形式 | GULL WING | GULL WING | BALL | GULL WING | BALL | BALL |
| 端子节距 | 0.65 mm | 0.65 mm | 1 mm | 0.65 mm | 1.27 mm | 1.27 mm |
| 端子位置 | QUAD | QUAD | BOTTOM | QUAD | BOTTOM | BOTTOM |
| 处于峰值回流温度下的最长时间 | 30 | NOT SPECIFIED | 10 | 40 | 40 | NOT SPECIFIED |
| 宽度 | 14 mm | 14 mm | 14 mm | 14 mm | 14 mm | 14 mm |
| Base Number Matches | 1 | 1 | 1 | 1 | - | - |
| 湿度敏感等级 | - | - | 3 | 3 | 3 | 3 |
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