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1N5995CUR-1E3

产品描述Zener Diode, 6.2V V(Z), 2%, 0.5W, Silicon, Unidirectional, DO-213AA, HERMETIC SEALED, GLASS, SOD-80, MELF-2
产品类别分立半导体    二极管   
文件大小232KB,共5页
制造商Microsemi
官网地址https://www.microsemi.com
下载文档 详细参数 全文预览

1N5995CUR-1E3概述

Zener Diode, 6.2V V(Z), 2%, 0.5W, Silicon, Unidirectional, DO-213AA, HERMETIC SEALED, GLASS, SOD-80, MELF-2

1N5995CUR-1E3规格参数

参数名称属性值
包装说明O-LELF-R2
Reach Compliance Codecompli
ECCN代码EAR99
外壳连接ISOLATED
配置SINGLE
二极管元件材料SILICON
二极管类型ZENER DIODE
JEDEC-95代码DO-213AA
JESD-30 代码O-LELF-R2
元件数量1
端子数量2
封装主体材料GLASS
封装形状ROUND
封装形式LONG FORM
极性UNIDIRECTIONAL
最大功率耗散0.5 W
标称参考电压6.2 V
表面贴装YES
技术ZENER
端子形式WRAP AROUND
端子位置END
最大电压容差2%
工作测试电流5 mA
Base Number Matches1

文档预览

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1N5985BUR-1 thru 1N6031BUR-1
Available on
commercial
versions
Surface Mount 500 mW Zener Diodes
DESCRIPTION
Screening in
reference to
MIL-PRF-19500
available
The popular 1N5985BUR-1 thru 1N6031BUR-1 series of 0.5 watt Zener voltage regulators
provides a selection from 2.4 to 200 volts in 10%, 5%, 2% and 1% tolerances. These glass
surface mount DO-213AA Zeners are also available in various military equivalent screening
levels by adding a prefix identifier as described in the “part nomenclature” section. Microsemi
also offers numerous other Zener products to meet higher and lower power applications.
Important:
For the latest information, visit our website
http://www.microsemi.com.
FEATURES
Surface mount equivalents to JEDEC registered 1N5985 to 1N6031 series.
Similar to operating current conditions of the BZX55 Pro Electron series of Zener products in
Europe.
Multiple voltage tolerances are available (see
part nomenclature).
Internal metallurgical bonds.
High-reliability screened equivalents in reference to MIL-PRF-19500 are available.
RoHS compliant versions available (commercial grade only).
DO-213AA
Package
Also available in:
(DO204AH)
(axial-leaded)
1N5985B-1 – 1N6031B-1
DO-35
APPLICATIONS / BENEFITS
Regulates voltage over a broad operating current and temperature range.
Extensive selection from 2.4 to 200 volts.
Non-sensitive to ESD (MIL-STD-750, method 1020).
Minimal capacitance (see
Figure 2).
Inherently radiation hard as described in Microsemi “MicroNote
050”.
MAXIMUM RATINGS
Parameters/Test Conditions
Power Dissipation at 25 C
(Also see derating in
Figure 1)
Junction and Storage Temperature
(2)
Thermal Resistance Junction-to-End Cap
(2)
Thermal Resistance Junction-to-Ambient
Forward Voltage @ 200mA
Solder Temperature @ 10 s
o
(1)
Symbol
P
D
T
J
and T
STG
R
ӨJL
R
ӨJA
V
F
T
SP
Value
0.5
-65 to +175
150
300
1.1
260
Unit
Watts
C
C/W
o
C/W
Volts
o
C
o
o
MSC – Lawrence
6 Lake Street,
Lawrence, MA 01841
Tel: 1-800-446-1158 or
(978) 620-2600
Fax: (978) 689-0803
MSC – Ireland
Gort Road Business Park,
Ennis, Co. Clare, Ireland
Tel: +353 (0) 65 6840044
Fax: +353 (0) 65 6822298
Website:
www.microsemi.com
Notes:
1. At end cap temperatures T
EC
< 100
o
C or 0.5 watts at ambient T
A
< 25
º
C when mounted on FR4 PC
board as described for thermal resistance.
2. When mounted on FR4 PC board (1 oz Cu) with recommended footprint (see
last page).
T4-LDS-0228-1, Rev. 1 (111898)
©2011 Microsemi Corporation
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