IDT70927S55G概述

Multi-Port SRAM, 32KX16, 55ns, CMOS, CPGA108, CAVITY UP, PGA-108

IDT70927S55G规格参数

参数名称	属性值
是否无铅	不含铅
是否Rohs认证	符合
厂商名称	IDT (Integrated Device Technology)
零件包装代码	PGA
包装说明	PGA,
针数	108
Reach Compliance Code	compliant
ECCN代码	EAR99
最长访问时间	55 ns
其他特性	AUTOMATIC POWER-DOWN
JESD-30 代码	S-CPGA-P108
JESD-609代码	e3
长度	30.48 mm
内存密度	524288 bit
内存集成电路类型	MULTI-PORT SRAM
内存宽度	16
功能数量	1
端口数量	2
端子数量	108
字数	32768 words
字数代码	32000
工作模式	SYNCHRONOUS
最高工作温度	70 °C
最低工作温度
组织	32KX16
输出特性	3-STATE
可输出	YES
封装主体材料	CERAMIC, METAL-SEALED COFIRED
封装代码	PGA
封装形状	SQUARE
封装形式	GRID ARRAY
并行/串行	PARALLEL
峰值回流温度（摄氏度）	260
认证状态	Not Qualified
座面最大高度	5.207 mm
最大供电电压 (Vsup)	5.5 V
最小供电电压 (Vsup)	4.5 V
标称供电电压 (Vsup)	5 V
表面贴装	NO
技术	CMOS
温度等级	COMMERCIAL
端子面层	Matte Tin (Sn)
端子形式	PIN/PEG
端子节距	2.54 mm
端子位置	PERPENDICULAR
处于峰值回流温度下的最长时间	30
宽度	30.48 mm
Base Number Matches	1

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IDT70927S55G相似产品对比

	IDT70927S55G	IDT70927S25PFT/R	IDT70927L55PF8	IDT70927L35PF8	IDT70927L35G	IDT70927L25PFT/R	IDT70927S55PF8	IDT70927S35G	IDT70927L55G	IDT70927S35PF8
描述	Multi-Port SRAM, 32KX16, 55ns, CMOS, CPGA108, CAVITY UP, PGA-108	Multi-Port SRAM, 32KX16, 25ns, CMOS, PQFP100, TQFP-100	Multi-Port SRAM, 32KX16, 55ns, CMOS, PQFP100, TQFP-100	Multi-Port SRAM, 32KX16, 35ns, CMOS, PQFP100, TQFP-100	Multi-Port SRAM, 32KX16, 35ns, CMOS, CPGA108, CAVITY UP, PGA-108	Multi-Port SRAM, 32KX16, 25ns, CMOS, PQFP100, TQFP-100	Multi-Port SRAM, 32KX16, 55ns, CMOS, PQFP100, TQFP-100	Multi-Port SRAM, 32KX16, 35ns, CMOS, CPGA108, CAVITY UP, PGA-108	Multi-Port SRAM, 32KX16, 55ns, CMOS, CPGA108, CAVITY UP, PGA-108	Multi-Port SRAM, 32KX16, 35ns, CMOS, PQFP100, TQFP-100
是否无铅	不含铅	含铅	含铅	含铅	不含铅	含铅	含铅	不含铅	不含铅	含铅
是否Rohs认证	符合	不符合	不符合	不符合	符合	不符合	不符合	符合	符合	不符合
零件包装代码	PGA	QFP	QFP	QFP	PGA	QFP	QFP	PGA	PGA	QFP
包装说明	PGA,	LFQFP,	LFQFP,	LFQFP,	PGA,	LFQFP,	LFQFP,	PGA,	PGA,	LFQFP,
针数	108	100	100	100	108	100	100	108	108	100
Reach Compliance Code	compliant	compliant	compliant	compliant	compliant	compliant	compliant	compliant	compliant	compli
ECCN代码	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99
最长访问时间	55 ns	25 ns	55 ns	35 ns	35 ns	25 ns	55 ns	35 ns	55 ns	35 ns
其他特性	AUTOMATIC POWER-DOWN	AUTOMATIC POWER-DOWN	AUTOMATIC POWER-DOWN	AUTOMATIC POWER-DOWN	AUTOMATIC POWER-DOWN	AUTOMATIC POWER-DOWN	AUTOMATIC POWER-DOWN	AUTOMATIC POWER-DOWN	AUTOMATIC POWER-DOWN	AUTOMATIC POWER-DOWN
JESD-30 代码	S-CPGA-P108	S-PQFP-G100	S-PQFP-G100	S-PQFP-G100	S-CPGA-P108	S-PQFP-G100	S-PQFP-G100	S-CPGA-P108	S-CPGA-P108	S-PQFP-G100
JESD-609代码	e3	e0	e0	e0	e3	e0	e0	e3	e3	e0
长度	30.48 mm	14 mm	14 mm	14 mm	30.48 mm	14 mm	14 mm	30.48 mm	30.48 mm	14 mm
内存密度	524288 bit	524288 bit	524288 bit	524288 bit	524288 bit	524288 bit	524288 bit	524288 bit	524288 bit	524288 bi
内存集成电路类型	MULTI-PORT SRAM	MULTI-PORT SRAM	MULTI-PORT SRAM	MULTI-PORT SRAM	MULTI-PORT SRAM	MULTI-PORT SRAM	MULTI-PORT SRAM	MULTI-PORT SRAM	MULTI-PORT SRAM	MULTI-PORT SRAM
内存宽度	16	16	16	16	16	16	16	16	16	16
功能数量	1	1	1	1	1	1	1	1	1	1
端口数量	2	2	2	2	2	2	2	2	2	2
端子数量	108	100	100	100	108	100	100	108	108	100
字数	32768 words	32768 words	32768 words	32768 words	32768 words	32768 words	32768 words	32768 words	32768 words	32768 words
字数代码	32000	32000	32000	32000	32000	32000	32000	32000	32000	32000
工作模式	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS
最高工作温度	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C
组织	32KX16	32KX16	32KX16	32KX16	32KX16	32KX16	32KX16	32KX16	32KX16	32KX16
输出特性	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE
可输出	YES	YES	YES	YES	YES	YES	YES	YES	YES	YES
封装主体材料	CERAMIC, METAL-SEALED COFIRED	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	CERAMIC, METAL-SEALED COFIRED	PLASTIC/EPOXY	PLASTIC/EPOXY	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	PLASTIC/EPOXY
封装代码	PGA	LFQFP	LFQFP	LFQFP	PGA	LFQFP	LFQFP	PGA	PGA	LFQFP
封装形状	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE
封装形式	GRID ARRAY	FLATPACK, LOW PROFILE, FINE PITCH	FLATPACK, LOW PROFILE, FINE PITCH	FLATPACK, LOW PROFILE, FINE PITCH	GRID ARRAY	FLATPACK, LOW PROFILE, FINE PITCH	FLATPACK, LOW PROFILE, FINE PITCH	GRID ARRAY	GRID ARRAY	FLATPACK, LOW PROFILE, FINE PITCH
并行/串行	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
峰值回流温度（摄氏度）	260	240	240	240	260	240	240	260	260	240
认证状态	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
座面最大高度	5.207 mm	1.6 mm	1.6 mm	1.6 mm	5.207 mm	1.6 mm	1.6 mm	5.207 mm	5.207 mm	1.6 mm
最大供电电压 (Vsup)	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V
最小供电电压 (Vsup)	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V
标称供电电压 (Vsup)	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V
表面贴装	NO	YES	YES	YES	NO	YES	YES	NO	NO	YES
技术	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
温度等级	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
端子面层	Matte Tin (Sn)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Matte Tin (Sn)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Matte Tin (Sn)	Matte Tin (Sn)	Tin/Lead (Sn/Pb)
端子形式	PIN/PEG	GULL WING	GULL WING	GULL WING	PIN/PEG	GULL WING	GULL WING	PIN/PEG	PIN/PEG	GULL WING
端子节距	2.54 mm	0.5 mm	0.5 mm	0.5 mm	2.54 mm	0.5 mm	0.5 mm	2.54 mm	2.54 mm	0.5 mm
端子位置	PERPENDICULAR	QUAD	QUAD	QUAD	PERPENDICULAR	QUAD	QUAD	PERPENDICULAR	PERPENDICULAR	QUAD
处于峰值回流温度下的最长时间	30	20	20	20	30	20	20	30	30	20
宽度	30.48 mm	14 mm	14 mm	14 mm	30.48 mm	14 mm	14 mm	30.48 mm	30.48 mm	14 mm
厂商名称	IDT (Integrated Device Technology)	-	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)
湿度敏感等级	-	3	3	3	-	3	3	-	-	3

IDT70927S55G

IDT70927S55G概述

IDT70927S55G规格参数

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IDT70927S55G相似产品对比

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