Decade Counter, HC/UH Series, Synchronous, Positive Edge Triggered, 4-Bit, Bidirectional, CMOS, CDFP16
参数名称 | 属性值 |
是否Rohs认证 | 不符合 |
厂商名称 | Harris |
包装说明 | DFP, FL16,.3 |
Reach Compliance Code | unknown |
计数方向 | BIDIRECTIONAL |
系列 | HC/UH |
JESD-30 代码 | R-CDFP-F16 |
JESD-609代码 | e0 |
负载电容(CL) | 50 pF |
负载/预设输入 | YES |
逻辑集成电路类型 | DECADE COUNTER |
最大频率@ Nom-Sup | 20000000 Hz |
工作模式 | SYNCHRONOUS |
位数 | 4 |
功能数量 | 1 |
端子数量 | 16 |
最高工作温度 | 125 °C |
最低工作温度 | -55 °C |
封装主体材料 | CERAMIC, METAL-SEALED COFIRED |
封装代码 | DFP |
封装等效代码 | FL16,.3 |
封装形状 | RECTANGULAR |
封装形式 | FLATPACK |
峰值回流温度(摄氏度) | NOT SPECIFIED |
电源 | 5 V |
传播延迟(tpd) | 34 ns |
认证状态 | Not Qualified |
筛选级别 | 38535V;38534K;883S |
最大供电电压 (Vsup) | 5.5 V |
最小供电电压 (Vsup) | 4.5 V |
标称供电电压 (Vsup) | 5 V |
表面贴装 | YES |
技术 | CMOS |
温度等级 | MILITARY |
端子面层 | Tin/Lead (Sn/Pb) |
端子形式 | FLAT |
端子节距 | 1.27 mm |
端子位置 | DUAL |
处于峰值回流温度下的最长时间 | NOT SPECIFIED |
总剂量 | 200k Rad(Si) V |
触发器类型 | POSITIVE EDGE |
Base Number Matches | 1 |
HCS190KMSR | 5962R9580801VXC | 5962R9580801VEC | HCS190K/SAMPLE | 5962R9580801V9A | HCS190DMSR | HCS190HMSR | |
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描述 | Decade Counter, HC/UH Series, Synchronous, Positive Edge Triggered, 4-Bit, Bidirectional, CMOS, CDFP16 | Decade Counter, HC/UH Series, Synchronous, Positive Edge Triggered, 4-Bit, Bidirectional, CMOS, CDFP16 | Decade Counter, HC/UH Series, Synchronous, Positive Edge Triggered, 4-Bit, Bidirectional, CMOS, CDIP16 | Decade Counter, HC/UH Series, Synchronous, Positive Edge Triggered, 4-Bit, Bidirectional, CMOS, CDFP16 | Decade Counter, HC/UH Series, Synchronous, Positive Edge Triggered, 4-Bit, Bidirectional, CMOS | Decade Counter, HC/UH Series, Synchronous, Positive Edge Triggered, 4-Bit, Bidirectional, CMOS, CDIP16 | Decade Counter, HC/UH Series, Synchronous, Positive Edge Triggered, 4-Bit, Bidirectional, CMOS |
包装说明 | DFP, FL16,.3 | , | , | , | DIE, | DIP, DIP16,.3 | DIE, |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
计数方向 | BIDIRECTIONAL | BIDIRECTIONAL | BIDIRECTIONAL | BIDIRECTIONAL | BIDIRECTIONAL | BIDIRECTIONAL | BIDIRECTIONAL |
系列 | HC/UH | HC/UH | HC/UH | HC/UH | HC/UH | HC/UH | HC/UH |
JESD-30 代码 | R-CDFP-F16 | R-CDFP-F16 | R-CDIP-T16 | R-CDFP-F16 | X-XUUC-N16 | R-CDIP-T16 | X-XUUC-N16 |
负载电容(CL) | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF |
负载/预设输入 | YES | YES | YES | YES | YES | YES | YES |
逻辑集成电路类型 | DECADE COUNTER | DECADE COUNTER | DECADE COUNTER | DECADE COUNTER | DECADE COUNTER | DECADE COUNTER | DECADE COUNTER |
工作模式 | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
位数 | 4 | 4 | 4 | 4 | 4 | 4 | 4 |
功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
端子数量 | 16 | 16 | 16 | 16 | 16 | 16 | 16 |
封装主体材料 | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | UNSPECIFIED | CERAMIC, METAL-SEALED COFIRED | UNSPECIFIED |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | UNSPECIFIED | RECTANGULAR | UNSPECIFIED |
封装形式 | FLATPACK | FLATPACK | IN-LINE | FLATPACK | UNCASED CHIP | IN-LINE | UNCASED CHIP |
传播延迟(tpd) | 34 ns | 34 ns | 34 ns | 34 ns | 34 ns | 34 ns | 34 ns |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
表面贴装 | YES | YES | NO | YES | YES | NO | YES |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
端子形式 | FLAT | FLAT | THROUGH-HOLE | FLAT | NO LEAD | THROUGH-HOLE | NO LEAD |
端子位置 | DUAL | DUAL | DUAL | DUAL | UPPER | DUAL | UPPER |
触发器类型 | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE |
Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
JESD-609代码 | e0 | e4 | e4 | - | e0 | e0 | - |
最高工作温度 | 125 °C | 125 °C | 125 °C | - | 125 °C | 125 °C | 125 °C |
最低工作温度 | -55 °C | -55 °C | -55 °C | - | -55 °C | -55 °C | -55 °C |
封装代码 | DFP | - | - | - | DIE | DIP | DIE |
温度等级 | MILITARY | MILITARY | MILITARY | - | MILITARY | MILITARY | MILITARY |
端子面层 | Tin/Lead (Sn/Pb) | GOLD | GOLD | - | TIN LEAD | Tin/Lead (Sn/Pb) | - |
总剂量 | 200k Rad(Si) V | 100k Rad(Si) V | 100k Rad(Si) V | - | 100k Rad(Si) V | 200k Rad(Si) V | - |
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