D Flip-Flop, F/FAST Series, 1-Func, Positive Edge Triggered, 4-Bit, Complementary Output, TTL, CDIP16, CERAMIC, DIP-16
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | Fairchild |
| 零件包装代码 | DIP |
| 包装说明 | CERAMIC, DIP-16 |
| 针数 | 16 |
| Reach Compliance Code | unknown |
| 系列 | F/FAST |
| JESD-30 代码 | R-GDIP-T16 |
| JESD-609代码 | e0 |
| 长度 | 19.43 mm |
| 负载电容（CL） | 50 pF |
| 逻辑集成电路类型 | D FLIP-FLOP |
| 位数 | 4 |
| 功能数量 | 1 |
| 端子数量 | 16 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 输出极性 | COMPLEMENTARY |
| 封装主体材料 | CERAMIC, GLASS-SEALED |
| 封装代码 | DIP |
| 封装等效代码 | DIP16,.3 |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 电源 | 5 V |
| 最大电源电流（ICC） | 34 mA |
| 传播延迟（tpd） | 10.5 ns |
| 认证状态 | Not Qualified |
| 座面最大高度 | 5.08 mm |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | NO |
| 技术 | TTL |
| 温度等级 | MILITARY |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| 触发器类型 | POSITIVE EDGE |
| 宽度 | 7.62 mm |
| 最小 fmax | 80 MHz |
| Base Number Matches | 1 |
| 54F175DM | 54F175FM | 54F175DMQB | 54F175LM | 54F175LMQB | 54F175FMQB | |
|---|---|---|---|---|---|---|
| 描述 | D Flip-Flop, F/FAST Series, 1-Func, Positive Edge Triggered, 4-Bit, Complementary Output, TTL, CDIP16, CERAMIC, DIP-16 | D Flip-Flop, F/FAST Series, 1-Func, Positive Edge Triggered, 4-Bit, Complementary Output, TTL, CDFP16, CERPACK-16 | D Flip-Flop, F/FAST Series, 1-Func, Positive Edge Triggered, 4-Bit, Complementary Output, TTL, CDIP16, CERAMIC, DIP-16 | D Flip-Flop, F/FAST Series, 1-Func, Positive Edge Triggered, 4-Bit, Complementary Output, TTL, CQCC20, CERAMIC, LCC-20 | D Flip-Flop, F/FAST Series, 1-Func, Positive Edge Triggered, 4-Bit, Complementary Output, TTL, CQCC20, CERAMIC, LCC-20 | D Flip-Flop, F/FAST Series, 1-Func, Positive Edge Triggered, 4-Bit, Complementary Output, TTL, CDFP16, CERPACK-16 |
| 零件包装代码 | DIP | DFP | DIP | QLCC | QLCC | DFP |
| 包装说明 | CERAMIC, DIP-16 | DFP, FL16,.3 | DIP, DIP16,.3 | QCCN, | QCCN, LCC20,.35SQ | DFP, FL16,.3 |
| 针数 | 16 | 16 | 16 | 20 | 20 | 16 |
| Reach Compliance Code | unknown | compliant | unknown | unknown | compliant | compliant |
| 系列 | F/FAST | F/FAST | F/FAST | F/FAST | F/FAST | F/FAST |
| JESD-30 代码 | R-GDIP-T16 | R-GDFP-F16 | R-GDIP-T16 | S-CQCC-N20 | S-CQCC-N20 | R-GDFP-F16 |
| 长度 | 19.43 mm | 9.6645 mm | 19.43 mm | 8.89 mm | 8.89 mm | 9.6645 mm |
| 负载电容（CL） | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF |
| 逻辑集成电路类型 | D FLIP-FLOP | D FLIP-FLOP | D FLIP-FLOP | D FLIP-FLOP | D FLIP-FLOP | D FLIP-FLOP |
| 位数 | 4 | 4 | 4 | 4 | 4 | 4 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 16 | 16 | 16 | 20 | 20 | 16 |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C |
| 输出极性 | COMPLEMENTARY | COMPLEMENTARY | COMPLEMENTARY | COMPLEMENTARY | COMPLEMENTARY | COMPLEMENTARY |
| 封装主体材料 | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, GLASS-SEALED |
| 封装代码 | DIP | DFP | DIP | QCCN | QCCN | DFP |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | SQUARE | SQUARE | RECTANGULAR |
| 封装形式 | IN-LINE | FLATPACK | IN-LINE | CHIP CARRIER | CHIP CARRIER | FLATPACK |
| 最大电源电流（ICC） | 34 mA | 34 mA | 34 mA | 34 mA | 34 mA | 34 mA |
| 传播延迟（tpd） | 10.5 ns | 10.5 ns | 10.5 ns | 10.5 ns | 10.5 ns | 10.5 ns |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 5.08 mm | 2.032 mm | 5.08 mm | 1.905 mm | 1.905 mm | 2.032 mm |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | NO | YES | NO | YES | YES | YES |
| 技术 | TTL | TTL | TTL | TTL | TTL | TTL |
| 温度等级 | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY |
| 端子形式 | THROUGH-HOLE | FLAT | THROUGH-HOLE | NO LEAD | NO LEAD | FLAT |
| 端子节距 | 2.54 mm | 1.27 mm | 2.54 mm | 1.27 mm | 1.27 mm | 1.27 mm |
| 端子位置 | DUAL | DUAL | DUAL | QUAD | QUAD | DUAL |
| 触发器类型 | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE |
| 宽度 | 7.62 mm | 6.604 mm | 7.62 mm | 8.89 mm | 8.89 mm | 6.604 mm |
| 最小 fmax | 80 MHz | 80 MHz | 80 MHz | 80 MHz | 80 MHz | 80 MHz |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | - | 不符合 | 不符合 |
| JESD-609代码 | e0 | e0 | e0 | - | e0 | e0 |
| 封装等效代码 | DIP16,.3 | FL16,.3 | DIP16,.3 | - | LCC20,.35SQ | FL16,.3 |
| 电源 | 5 V | 5 V | 5 V | - | 5 V | 5 V |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
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