D Flip-Flop, F/FAST Series, 1-Func, Positive Edge Triggered, 4-Bit, Complementary Output, TTL, CQCC20, CERAMIC, LCC-20
参数名称 | 属性值 |
零件包装代码 | QLCC |
包装说明 | QCCN, |
针数 | 20 |
Reach Compliance Code | unknown |
系列 | F/FAST |
JESD-30 代码 | S-CQCC-N20 |
长度 | 8.89 mm |
负载电容(CL) | 50 pF |
逻辑集成电路类型 | D FLIP-FLOP |
位数 | 4 |
功能数量 | 1 |
端子数量 | 20 |
最高工作温度 | 125 °C |
最低工作温度 | -55 °C |
输出极性 | COMPLEMENTARY |
封装主体材料 | CERAMIC, METAL-SEALED COFIRED |
封装代码 | QCCN |
封装形状 | SQUARE |
封装形式 | CHIP CARRIER |
最大电源电流(ICC) | 34 mA |
传播延迟(tpd) | 10.5 ns |
认证状态 | Not Qualified |
座面最大高度 | 1.905 mm |
最大供电电压 (Vsup) | 5.5 V |
最小供电电压 (Vsup) | 4.5 V |
标称供电电压 (Vsup) | 5 V |
表面贴装 | YES |
技术 | TTL |
温度等级 | MILITARY |
端子形式 | NO LEAD |
端子节距 | 1.27 mm |
端子位置 | QUAD |
触发器类型 | POSITIVE EDGE |
宽度 | 8.89 mm |
最小 fmax | 80 MHz |
Base Number Matches | 1 |
54F175LM | 54F175FM | 54F175DMQB | 54F175LMQB | 54F175DM | 54F175FMQB | |
---|---|---|---|---|---|---|
描述 | D Flip-Flop, F/FAST Series, 1-Func, Positive Edge Triggered, 4-Bit, Complementary Output, TTL, CQCC20, CERAMIC, LCC-20 | D Flip-Flop, F/FAST Series, 1-Func, Positive Edge Triggered, 4-Bit, Complementary Output, TTL, CDFP16, CERPACK-16 | D Flip-Flop, F/FAST Series, 1-Func, Positive Edge Triggered, 4-Bit, Complementary Output, TTL, CDIP16, CERAMIC, DIP-16 | D Flip-Flop, F/FAST Series, 1-Func, Positive Edge Triggered, 4-Bit, Complementary Output, TTL, CQCC20, CERAMIC, LCC-20 | D Flip-Flop, F/FAST Series, 1-Func, Positive Edge Triggered, 4-Bit, Complementary Output, TTL, CDIP16, CERAMIC, DIP-16 | D Flip-Flop, F/FAST Series, 1-Func, Positive Edge Triggered, 4-Bit, Complementary Output, TTL, CDFP16, CERPACK-16 |
零件包装代码 | QLCC | DFP | DIP | QLCC | DIP | DFP |
包装说明 | QCCN, | DFP, FL16,.3 | DIP, DIP16,.3 | QCCN, LCC20,.35SQ | CERAMIC, DIP-16 | DFP, FL16,.3 |
针数 | 20 | 16 | 16 | 20 | 16 | 16 |
Reach Compliance Code | unknown | compliant | unknown | compliant | unknown | compliant |
系列 | F/FAST | F/FAST | F/FAST | F/FAST | F/FAST | F/FAST |
JESD-30 代码 | S-CQCC-N20 | R-GDFP-F16 | R-GDIP-T16 | S-CQCC-N20 | R-GDIP-T16 | R-GDFP-F16 |
长度 | 8.89 mm | 9.6645 mm | 19.43 mm | 8.89 mm | 19.43 mm | 9.6645 mm |
负载电容(CL) | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF |
逻辑集成电路类型 | D FLIP-FLOP | D FLIP-FLOP | D FLIP-FLOP | D FLIP-FLOP | D FLIP-FLOP | D FLIP-FLOP |
位数 | 4 | 4 | 4 | 4 | 4 | 4 |
功能数量 | 1 | 1 | 1 | 1 | 1 | 1 |
端子数量 | 20 | 16 | 16 | 20 | 16 | 16 |
最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
最低工作温度 | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C |
输出极性 | COMPLEMENTARY | COMPLEMENTARY | COMPLEMENTARY | COMPLEMENTARY | COMPLEMENTARY | COMPLEMENTARY |
封装主体材料 | CERAMIC, METAL-SEALED COFIRED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED |
封装代码 | QCCN | DFP | DIP | QCCN | DIP | DFP |
封装形状 | SQUARE | RECTANGULAR | RECTANGULAR | SQUARE | RECTANGULAR | RECTANGULAR |
封装形式 | CHIP CARRIER | FLATPACK | IN-LINE | CHIP CARRIER | IN-LINE | FLATPACK |
最大电源电流(ICC) | 34 mA | 34 mA | 34 mA | 34 mA | 34 mA | 34 mA |
传播延迟(tpd) | 10.5 ns | 10.5 ns | 10.5 ns | 10.5 ns | 10.5 ns | 10.5 ns |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | 1.905 mm | 2.032 mm | 5.08 mm | 1.905 mm | 5.08 mm | 2.032 mm |
最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
表面贴装 | YES | YES | NO | YES | NO | YES |
技术 | TTL | TTL | TTL | TTL | TTL | TTL |
温度等级 | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY |
端子形式 | NO LEAD | FLAT | THROUGH-HOLE | NO LEAD | THROUGH-HOLE | FLAT |
端子节距 | 1.27 mm | 1.27 mm | 2.54 mm | 1.27 mm | 2.54 mm | 1.27 mm |
端子位置 | QUAD | DUAL | DUAL | QUAD | DUAL | DUAL |
触发器类型 | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE |
宽度 | 8.89 mm | 6.604 mm | 7.62 mm | 8.89 mm | 7.62 mm | 6.604 mm |
最小 fmax | 80 MHz | 80 MHz | 80 MHz | 80 MHz | 80 MHz | 80 MHz |
Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 |
是否Rohs认证 | - | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
JESD-609代码 | - | e0 | e0 | e0 | e0 | e0 |
封装等效代码 | - | FL16,.3 | DIP16,.3 | LCC20,.35SQ | DIP16,.3 | FL16,.3 |
电源 | - | 5 V | 5 V | 5 V | 5 V | 5 V |
端子面层 | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
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