Hot Swap Power Manager For Redundant -48V Supplies 14-TSSOP -40 to 85
参数名称 | 属性值 |
Brand Name | Texas Instruments |
是否无铅 | 不含铅 |
是否Rohs认证 | 符合 |
厂商名称 | Texas Instruments(德州仪器) |
零件包装代码 | TSSOP |
包装说明 | TSSOP-14 |
针数 | 14 |
Reach Compliance Code | compli |
ECCN代码 | EAR99 |
Factory Lead Time | 6 weeks |
其他特性 | IT OPERATES FROM A -12V TO -80V SUPPLY |
可调阈值 | YES |
模拟集成电路 - 其他类型 | POWER SUPPLY SUPPORT CIRCUIT |
JESD-30 代码 | R-PDSO-G14 |
JESD-609代码 | e4 |
长度 | 5 mm |
湿度敏感等级 | 1 |
标称负供电电压 (Vsup) | -48 V |
信道数量 | 1 |
功能数量 | 1 |
端子数量 | 14 |
最高工作温度 | 85 °C |
最低工作温度 | -40 °C |
最大输出电流 | 500 A |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | TSSOP |
封装等效代码 | TSSOP14,.25 |
封装形状 | RECTANGULAR |
封装形式 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
峰值回流温度(摄氏度) | 260 |
电源 | -48 V |
认证状态 | Not Qualified |
座面最大高度 | 1.2 mm |
最大供电电流 (Isup) | 2 mA |
最大供电电压 (Vsup) | -12 V |
表面贴装 | YES |
温度等级 | INDUSTRIAL |
端子面层 | Nickel/Palladium/Gold (Ni/Pd/Au) |
端子形式 | GULL WING |
端子节距 | 0.65 mm |
端子位置 | DUAL |
处于峰值回流温度下的最长时间 | NOT SPECIFIED |
宽度 | 4.4 mm |
TPS2350PWR | TPS2350PW | TPS2350D | TPS2350DR | |
---|---|---|---|---|
描述 | Hot Swap Power Manager For Redundant -48V Supplies 14-TSSOP -40 to 85 | Hot Swap Power Manager For Redundant -48V Supplies 14-TSSOP -40 to 85 | Hot Swap Power Manager For Redundant -48V Supplies 14-SOIC -40 to 85 | Hot Swap Power Manager For Redundant -48V Supplies 14-SOIC -40 to 85 |
Brand Name | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments |
是否无铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 |
是否Rohs认证 | 符合 | 符合 | 符合 | 符合 |
厂商名称 | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) |
零件包装代码 | TSSOP | TSSOP | SOIC | SOIC |
包装说明 | TSSOP-14 | TSSOP-14 | SOIC-14 | SOIC-14 |
针数 | 14 | 14 | 14 | 14 |
Reach Compliance Code | compli | compli | compli | compli |
ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 |
Factory Lead Time | 6 weeks | 6 weeks | 1 week | 6 weeks |
其他特性 | IT OPERATES FROM A -12V TO -80V SUPPLY | IT OPERATES FROM A -12V TO -80V SUPPLY | IT OPERATES FROM A -12V TO -80V SUPPLY | IT OPERATES FROM A -12V TO -80V SUPPLY |
可调阈值 | YES | YES | YES | YES |
模拟集成电路 - 其他类型 | POWER SUPPLY SUPPORT CIRCUIT | POWER SUPPLY SUPPORT CIRCUIT | POWER SUPPLY SUPPORT CIRCUIT | POWER SUPPLY SUPPORT CIRCUIT |
JESD-30 代码 | R-PDSO-G14 | R-PDSO-G14 | R-PDSO-G14 | R-PDSO-G14 |
JESD-609代码 | e4 | e4 | e4 | e4 |
长度 | 5 mm | 5 mm | 8.65 mm | 8.65 mm |
湿度敏感等级 | 1 | 1 | 1 | 1 |
标称负供电电压 (Vsup) | -48 V | -48 V | -48 V | -48 V |
信道数量 | 1 | 1 | 1 | 1 |
功能数量 | 1 | 1 | 1 | 1 |
端子数量 | 14 | 14 | 14 | 14 |
最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C |
最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C |
最大输出电流 | 500 A | 500 A | 500 A | 500 A |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | TSSOP | TSSOP | SOP | SOP |
封装等效代码 | TSSOP14,.25 | TSSOP14,.25 | SOP14,.25 | SOP14,.25 |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE | SMALL OUTLINE |
峰值回流温度(摄氏度) | 260 | 260 | 260 | 260 |
电源 | -48 V | -48 V | -48 V | -48 V |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | 1.2 mm | 1.2 mm | 1.75 mm | 1.75 mm |
最大供电电流 (Isup) | 2 mA | 2 mA | 2 mA | 2 mA |
最大供电电压 (Vsup) | -12 V | -12 V | -12 V | -12 V |
表面贴装 | YES | YES | YES | YES |
温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
端子面层 | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) |
端子形式 | GULL WING | GULL WING | GULL WING | GULL WING |
端子节距 | 0.65 mm | 0.65 mm | 1.27 mm | 1.27 mm |
端子位置 | DUAL | DUAL | DUAL | DUAL |
处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
宽度 | 4.4 mm | 4.4 mm | 3.9 mm | 3.9 mm |
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