Hot Swap Power Manager For Redundant -48V Supplies 14-SOIC -40 to 85
| 参数名称 | 属性值 |
| Brand Name | Texas Instruments |
| 是否无铅 | 不含铅 |
| 是否Rohs认证 | 符合 |
| 厂商名称 | Texas Instruments(德州仪器) |
| 零件包装代码 | SOIC |
| 包装说明 | SOIC-14 |
| 针数 | 14 |
| Reach Compliance Code | compli |
| ECCN代码 | EAR99 |
| Factory Lead Time | 1 week |
| 其他特性 | IT OPERATES FROM A -12V TO -80V SUPPLY |
| 可调阈值 | YES |
| 模拟集成电路 - 其他类型 | POWER SUPPLY SUPPORT CIRCUIT |
| JESD-30 代码 | R-PDSO-G14 |
| JESD-609代码 | e4 |
| 长度 | 8.65 mm |
| 湿度敏感等级 | 1 |
| 标称负供电电压 (Vsup) | -48 V |
| 信道数量 | 1 |
| 功能数量 | 1 |
| 端子数量 | 14 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 最大输出电流 | 500 A |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | SOP |
| 封装等效代码 | SOP14,.25 |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE |
| 峰值回流温度（摄氏度） | 260 |
| 电源 | -48 V |
| 认证状态 | Not Qualified |
| 座面最大高度 | 1.75 mm |
| 最大供电电流 (Isup) | 2 mA |
| 最大供电电压 (Vsup) | -12 V |
| 表面贴装 | YES |
| 温度等级 | INDUSTRIAL |
| 端子面层 | Nickel/Palladium/Gold (Ni/Pd/Au) |
| 端子形式 | GULL WING |
| 端子节距 | 1.27 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 3.9 mm |
| TPS2350D | TPS2350PW | TPS2350DR | TPS2350PWR | |
|---|---|---|---|---|
| 描述 | Hot Swap Power Manager For Redundant -48V Supplies 14-SOIC -40 to 85 | Hot Swap Power Manager For Redundant -48V Supplies 14-TSSOP -40 to 85 | Hot Swap Power Manager For Redundant -48V Supplies 14-SOIC -40 to 85 | Hot Swap Power Manager For Redundant -48V Supplies 14-TSSOP -40 to 85 |
| Brand Name | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments |
| 是否无铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 |
| 是否Rohs认证 | 符合 | 符合 | 符合 | 符合 |
| 厂商名称 | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) |
| 零件包装代码 | SOIC | TSSOP | SOIC | TSSOP |
| 包装说明 | SOIC-14 | TSSOP-14 | SOIC-14 | TSSOP-14 |
| 针数 | 14 | 14 | 14 | 14 |
| Reach Compliance Code | compli | compli | compli | compli |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 |
| Factory Lead Time | 1 week | 6 weeks | 6 weeks | 6 weeks |
| 其他特性 | IT OPERATES FROM A -12V TO -80V SUPPLY | IT OPERATES FROM A -12V TO -80V SUPPLY | IT OPERATES FROM A -12V TO -80V SUPPLY | IT OPERATES FROM A -12V TO -80V SUPPLY |
| 可调阈值 | YES | YES | YES | YES |
| 模拟集成电路 - 其他类型 | POWER SUPPLY SUPPORT CIRCUIT | POWER SUPPLY SUPPORT CIRCUIT | POWER SUPPLY SUPPORT CIRCUIT | POWER SUPPLY SUPPORT CIRCUIT |
| JESD-30 代码 | R-PDSO-G14 | R-PDSO-G14 | R-PDSO-G14 | R-PDSO-G14 |
| JESD-609代码 | e4 | e4 | e4 | e4 |
| 长度 | 8.65 mm | 5 mm | 8.65 mm | 5 mm |
| 湿度敏感等级 | 1 | 1 | 1 | 1 |
| 标称负供电电压 (Vsup) | -48 V | -48 V | -48 V | -48 V |
| 信道数量 | 1 | 1 | 1 | 1 |
| 功能数量 | 1 | 1 | 1 | 1 |
| 端子数量 | 14 | 14 | 14 | 14 |
| 最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C |
| 最大输出电流 | 500 A | 500 A | 500 A | 500 A |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | SOP | TSSOP | SOP | TSSOP |
| 封装等效代码 | SOP14,.25 | TSSOP14,.25 | SOP14,.25 | TSSOP14,.25 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | SMALL OUTLINE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| 峰值回流温度（摄氏度） | 260 | 260 | 260 | 260 |
| 电源 | -48 V | -48 V | -48 V | -48 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 1.75 mm | 1.2 mm | 1.75 mm | 1.2 mm |
| 最大供电电流 (Isup) | 2 mA | 2 mA | 2 mA | 2 mA |
| 最大供电电压 (Vsup) | -12 V | -12 V | -12 V | -12 V |
| 表面贴装 | YES | YES | YES | YES |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子面层 | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) |
| 端子形式 | GULL WING | GULL WING | GULL WING | GULL WING |
| 端子节距 | 1.27 mm | 0.65 mm | 1.27 mm | 0.65 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 宽度 | 3.9 mm | 4.4 mm | 3.9 mm | 4.4 mm |
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