IC DUAL, PARALLEL, 8 BITS INPUT LOADING, 0.18 us SETTLING TIME, 8-BIT DAC, CQCC20, CERAMIC, LCC-20, Digital to Analog Converter
| 参数名称 | 属性值 |
| 厂商名称 | ADI(亚德诺半导体) |
| 零件包装代码 | QLCC |
| 包装说明 | CERAMIC, LCC-20 |
| 针数 | 20 |
| Reach Compliance Code | compliant |
| ECCN代码 | 3A001.A.2.C |
| 转换器类型 | D/A CONVERTER |
| 输入位码 | BINARY, OFFSET BINARY |
| 输入格式 | PARALLEL, 8 BITS |
| JESD-30 代码 | S-CQCC-N20 |
| 长度 | 8.89 mm |
| 位数 | 8 |
| 功能数量 | 2 |
| 端子数量 | 20 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | QCCN |
| 封装形状 | SQUARE |
| 封装形式 | CHIP CARRIER |
| 峰值回流温度（摄氏度） | NOT SPECIFIED |
| 认证状态 | Qualified |
| 筛选级别 | MIL-STD-883 |
| 座面最大高度 | 2.54 mm |
| 标称安定时间 (tstl) | 0.18 µs |
| 标称供电电压 | 5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | MILITARY |
| 端子形式 | NO LEAD |
| 端子节距 | 1.27 mm |
| 端子位置 | QUAD |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 8.89 mm |
| Base Number Matches | 1 |
| 5962-87701022X | 5962-8770101RX | 5962-8770103RX | 5962-8770102RX | 5962-87701032X | |
|---|---|---|---|---|---|
| 描述 | IC DUAL, PARALLEL, 8 BITS INPUT LOADING, 0.18 us SETTLING TIME, 8-BIT DAC, CQCC20, CERAMIC, LCC-20, Digital to Analog Converter | IC DUAL, PARALLEL, 8 BITS INPUT LOADING, 0.18 us SETTLING TIME, 8-BIT DAC, CDIP20, 0.300 INCH, GLASS SEALED, SKINNY, CERDIP-20, Digital to Analog Converter | IC DUAL, PARALLEL, 8 BITS INPUT LOADING, 0.18 us SETTLING TIME, 8-BIT DAC, CDIP20, 0.300 INCH, GLASS SEALED, SKINNY, CERDIP-20, Digital to Analog Converter | IC DUAL, PARALLEL, 8 BITS INPUT LOADING, 0.18 us SETTLING TIME, 8-BIT DAC, CDIP20, 0.300 INCH, GLASS SEALED, SKINNY, CERDIP-20, Digital to Analog Converter | IC DUAL, PARALLEL, 8 BITS INPUT LOADING, 0.18 us SETTLING TIME, 8-BIT DAC, CQCC20, CERAMIC, LCC-20, Digital to Analog Converter |
| 零件包装代码 | QLCC | DIP | DIP | DIP | QLCC |
| 包装说明 | CERAMIC, LCC-20 | 0.300 INCH, GLASS SEALED, SKINNY, CERDIP-20 | DIP, | 0.300 INCH, GLASS SEALED, SKINNY, CERDIP-20 | LCC-20 |
| 针数 | 20 | 20 | 20 | 20 | 20 |
| Reach Compliance Code | compliant | compliant | compliant | compliant | compliant |
| ECCN代码 | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C |
| 转换器类型 | D/A CONVERTER | D/A CONVERTER | D/A CONVERTER | D/A CONVERTER | D/A CONVERTER |
| 输入位码 | BINARY, OFFSET BINARY | BINARY, OFFSET BINARY | BINARY, OFFSET BINARY | BINARY, OFFSET BINARY | BINARY, OFFSET BINARY |
| 输入格式 | PARALLEL, 8 BITS | PARALLEL, 8 BITS | PARALLEL, 8 BITS | PARALLEL, 8 BITS | PARALLEL, 8 BITS |
| JESD-30 代码 | S-CQCC-N20 | R-GDIP-T20 | R-GDIP-T20 | R-GDIP-T20 | S-CQCC-N20 |
| 长度 | 8.89 mm | 24.195 mm | 24.195 mm | 24.195 mm | 8.89 mm |
| 位数 | 8 | 8 | 8 | 8 | 8 |
| 功能数量 | 2 | 2 | 2 | 2 | 2 |
| 端子数量 | 20 | 20 | 20 | 20 | 20 |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | QCCN | DIP | DIP | DIP | QCCN |
| 封装形状 | SQUARE | RECTANGULAR | RECTANGULAR | RECTANGULAR | SQUARE |
| 封装形式 | CHIP CARRIER | IN-LINE | IN-LINE | IN-LINE | CHIP CARRIER |
| 峰值回流温度（摄氏度） | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 认证状态 | Qualified | Qualified | Qualified | Qualified | Qualified |
| 筛选级别 | MIL-STD-883 | MIL-STD-883 | MIL-STD-883 | MIL-STD-883 | 38535Q/M;38534H;883B |
| 座面最大高度 | 2.54 mm | 5.08 mm | 5.08 mm | 5.08 mm | 2.54 mm |
| 标称安定时间 (tstl) | 0.18 µs | 0.18 µs | 0.18 µs | 0.18 µs | 0.35 µs |
| 标称供电电压 | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | NO | NO | NO | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY |
| 端子形式 | NO LEAD | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | NO LEAD |
| 端子节距 | 1.27 mm | 2.54 mm | 2.54 mm | 2.54 mm | 1.27 mm |
| 端子位置 | QUAD | DUAL | DUAL | DUAL | QUAD |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 宽度 | 8.89 mm | 7.62 mm | 7.62 mm | 7.62 mm | 8.89 mm |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 |
| 厂商名称 | ADI(亚德诺半导体) | ADI(亚德诺半导体) | - | ADI(亚德诺半导体) | ADI(亚德诺半导体) |
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