IGBT Gate Drivers, High-Current, Stand-Alone With VEE, 2500-REEL
| 参数名称 | 属性值 |
| Brand Name | ON Semiconductor |
| 是否无铅 | 不含铅 |
| 厂商名称 | ON Semiconductor(安森美) |
| 包装说明 | SOP, SOP8,.25 |
| 制造商包装代码 | 751-07 |
| Reach Compliance Code | unknown |
| Factory Lead Time | 4 weeks |
| Samacsys Description | ORDERABLE PART NUMBER OF |
| 高边驱动器 | YES |
| 接口集成电路类型 | BUFFER OR INVERTER BASED IGBT DRIVER |
| JESD-30 代码 | R-PDSO-G8 |
| JESD-609代码 | e3 |
| 长度 | 4.9 mm |
| 湿度敏感等级 | 1 |
| 标称负供电电压 | -10 V |
| 功能数量 | 1 |
| 端子数量 | 8 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | SOP |
| 封装等效代码 | SOP8,.25 |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE |
| 筛选级别 | AEC-Q100 |
| 座面最大高度 | 1.75 mm |
| 最大压摆率 | 1.5 mA |
| 最大供电电压 | 30 V |
| 最小供电电压 | 13.2 V |
| 标称供电电压 | 15 V |
| 表面贴装 | YES |
| 温度等级 | AUTOMOTIVE |
| 端子面层 | Matte Tin (Sn) - annealed |
| 端子形式 | GULL WING |
| 端子节距 | 1.27 mm |
| 端子位置 | DUAL |
| 断开时间 | 0.075 µs |
| 接通时间 | 0.075 µs |
| 宽度 | 3.9 mm |
| Base Number Matches | 1 |

| NCV5703BDR2G | NCV5703ADR2G | NCV5703CDR2G | |
|---|---|---|---|
| 描述 | IGBT Gate Drivers, High-Current, Stand-Alone With VEE, 2500-REEL | IGBT Gate Drivers, High-Current, Stand-Alone With Active Miller Clamp, 2500-REEL | IGBT Gate Drivers, High-Current, Stand-Alone With Split Gate Outputs, 2500-REEL |
| Brand Name | ON Semiconductor | ON Semiconductor | ON Semiconductor |
| 是否无铅 | 不含铅 | 不含铅 | 不含铅 |
| 厂商名称 | ON Semiconductor(安森美) | ON Semiconductor(安森美) | ON Semiconductor(安森美) |
| 包装说明 | SOP, SOP8,.25 | SOP, SOP8,.25 | SOP, SOP8,.25 |
| 制造商包装代码 | 751-07 | 751-07 | 751-07 |
| Reach Compliance Code | unknown | unknown | unknown |
| Factory Lead Time | 4 weeks | 6 weeks | 4 weeks |
| Samacsys Description | ORDERABLE PART NUMBER OF | ORDERABLE PART NUMBER OF | ORDERABLE PART NUMBER OF |
| 高边驱动器 | YES | YES | YES |
| 接口集成电路类型 | BUFFER OR INVERTER BASED IGBT DRIVER | BUFFER OR INVERTER BASED IGBT DRIVER | BUFFER OR INVERTER BASED IGBT DRIVER |
| JESD-30 代码 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 |
| 长度 | 4.9 mm | 4.9 mm | 4.9 mm |
| 湿度敏感等级 | 1 | 1 | 1 |
| 功能数量 | 1 | 1 | 1 |
| 端子数量 | 8 | 8 | 8 |
| 最高工作温度 | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | SOP | SOP | SOP |
| 封装等效代码 | SOP8,.25 | SOP8,.25 | SOP8,.25 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE |
| 筛选级别 | AEC-Q100 | AEC-Q100 | AEC-Q100 |
| 座面最大高度 | 1.75 mm | 1.75 mm | 1.75 mm |
| 最大压摆率 | 1.5 mA | 1.5 mA | 1.5 mA |
| 最大供电电压 | 30 V | 30 V | 30 V |
| 最小供电电压 | 13.2 V | 13.2 V | 13.2 V |
| 标称供电电压 | 15 V | 15 V | 15 V |
| 表面贴装 | YES | YES | YES |
| 温度等级 | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE |
| 端子形式 | GULL WING | GULL WING | GULL WING |
| 端子节距 | 1.27 mm | 1.27 mm | 1.27 mm |
| 端子位置 | DUAL | DUAL | DUAL |
| 断开时间 | 0.075 µs | 0.075 µs | 0.075 µs |
| 接通时间 | 0.075 µs | 0.075 µs | 0.075 µs |
| 宽度 | 3.9 mm | 3.9 mm | 3.9 mm |
| Base Number Matches | 1 | 1 | 1 |
| 端子面层 | Matte Tin (Sn) - annealed | Nickel/Gold/Palladium (Ni/Au/Pd) | - |
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