High-Performance Impact Programmable Array Logic Circuits 24-CFP -55 to 125
| 参数名称 | 属性值 |
| Brand Name | Texas Instruments |
| 是否Rohs认证 | 不符合 |
| 零件包装代码 | DFP |
| 包装说明 | DFP, FL24,.4 |
| 针数 | 24 |
| Reach Compliance Code | not_compliant |
| ECCN代码 | 3A001.A.2.C |
| 架构 | PAL-TYPE |
| 最大时钟频率 | 22 MHz |
| JESD-30 代码 | R-GDFP-F24 |
| 长度 | 14.355 mm |
| 专用输入次数 | 11 |
| I/O 线路数量 | 10 |
| 输入次数 | 22 |
| 输出次数 | 10 |
| 产品条款数 | 132 |
| 端子数量 | 24 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 组织 | 11 DEDICATED INPUTS, 10 I/O |
| 输出函数 | MACROCELL |
| 封装主体材料 | CERAMIC, GLASS-SEALED |
| 封装代码 | DFP |
| 封装等效代码 | FL24,.4 |
| 封装形状 | RECTANGULAR |
| 封装形式 | FLATPACK |
| 峰值回流温度（摄氏度） | NOT SPECIFIED |
| 电源 | 5 V |
| 可编程逻辑类型 | OT PLD |
| 传播延迟 | 30 ns |
| 认证状态 | Qualified |
| 筛选级别 | MIL-STD-883 |
| 座面最大高度 | 2.29 mm |
| 最大供电电压 | 5.5 V |
| 最小供电电压 | 4.5 V |
| 标称供电电压 | 5 V |
| 表面贴装 | YES |
| 技术 | TTL |
| 温度等级 | MILITARY |
| 端子形式 | FLAT |
| 端子节距 | 1.27 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 9.085 mm |
| Base Number Matches | 1 |
| 5962-8605301KA | 5962-86053013A | 5962-8605301LA | TIBPAL22V10AMJTB | TIBPAL22V10AMJT | TIBPAL22V10AMFKB | TIBPAL22V10AMWB | |
|---|---|---|---|---|---|---|---|
| 描述 | High-Performance Impact Programmable Array Logic Circuits 24-CFP -55 to 125 | High-Performance Impact Programmable Array Logic Circuits 28-LCCC -55 to 125 | High-Performance Impact Programmable Array Logic Circuits 24-CDIP -55 to 125 | High-Performance Impact Programmable Array Logic Circuits 24-CDIP -55 to 125 | High-Performance Impact Programmable Array Logic Circuits 24-CDIP -55 to 125 | High-Performance Impact Programmable Array Logic Circuits 28-LCCC -55 to 125 | High-Performance Impact Programmable Array Logic Circuits 24-CFP -55 to 125 |
| Brand Name | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 零件包装代码 | DFP | QLCC | DIP | DIP | DIP | QLCC | DFP |
| 包装说明 | DFP, FL24,.4 | QCCN, LCC28,.45SQ | DIP, DIP24,.3 | DIP, DIP24,.3 | DIP, DIP24,.3 | QCCN, LCC28,.45SQ | DFP, FL24,.4 |
| 针数 | 24 | 28 | 24 | 24 | 24 | 28 | 24 |
| Reach Compliance Code | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant |
| ECCN代码 | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C |
| 架构 | PAL-TYPE | PAL-TYPE | PAL-TYPE | PAL-TYPE | PAL-TYPE | PAL-TYPE | PAL-TYPE |
| 最大时钟频率 | 22 MHz | 22 MHz | 22 MHz | 22 MHz | 22 MHz | 22 MHz | 22 MHz |
| JESD-30 代码 | R-GDFP-F24 | S-CQCC-N28 | R-GDIP-T24 | R-GDIP-T24 | R-GDIP-T24 | S-CQCC-N28 | R-GDFP-F24 |
| 长度 | 14.355 mm | 11.43 mm | 32.005 mm | 32.005 mm | 32.005 mm | 11.43 mm | 14.355 mm |
| 专用输入次数 | 11 | 11 | 11 | 11 | 11 | 11 | 11 |
| I/O 线路数量 | 10 | 10 | 10 | 10 | 10 | 10 | 10 |
| 输入次数 | 22 | 22 | 22 | 22 | 22 | 22 | 22 |
| 输出次数 | 10 | 10 | 10 | 10 | 10 | 10 | 10 |
| 产品条款数 | 132 | 132 | 132 | 132 | 132 | 132 | 132 |
| 端子数量 | 24 | 28 | 24 | 24 | 24 | 28 | 24 |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C |
| 组织 | 11 DEDICATED INPUTS, 10 I/O | 11 DEDICATED INPUTS, 10 I/O | 11 DEDICATED INPUTS, 10 I/O | 11 DEDICATED INPUTS, 10 I/O | 11 DEDICATED INPUTS, 10 I/O | 11 DEDICATED INPUTS, 10 I/O | 11 DEDICATED INPUTS, 10 I/O |
| 输出函数 | MACROCELL | MACROCELL | MACROCELL | MACROCELL | MACROCELL | MACROCELL | MACROCELL |
| 封装主体材料 | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, GLASS-SEALED |
| 封装代码 | DFP | QCCN | DIP | DIP | DIP | QCCN | DFP |
| 封装等效代码 | FL24,.4 | LCC28,.45SQ | DIP24,.3 | DIP24,.3 | DIP24,.3 | LCC28,.45SQ | FL24,.4 |
| 封装形状 | RECTANGULAR | SQUARE | RECTANGULAR | RECTANGULAR | RECTANGULAR | SQUARE | RECTANGULAR |
| 封装形式 | FLATPACK | CHIP CARRIER | IN-LINE | IN-LINE | IN-LINE | CHIP CARRIER | FLATPACK |
| 峰值回流温度（摄氏度） | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 电源 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 可编程逻辑类型 | OT PLD | OT PLD | OT PLD | OT PLD | OT PLD | OT PLD | OT PLD |
| 传播延迟 | 30 ns | 30 ns | 30 ns | 30 ns | 30 ns | 30 ns | 30 ns |
| 认证状态 | Qualified | Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 2.29 mm | 2.03 mm | 5.08 mm | 5.08 mm | 5.08 mm | 2.03 mm | 2.29 mm |
| 最大供电电压 | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| 标称供电电压 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | YES | NO | NO | NO | YES | YES |
| 技术 | TTL | TTL | TTL | TTL | TTL | TTL | TTL |
| 温度等级 | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY |
| 端子形式 | FLAT | NO LEAD | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | NO LEAD | FLAT |
| 端子节距 | 1.27 mm | 1.27 mm | 2.54 mm | 2.54 mm | 2.54 mm | 1.27 mm | 1.27 mm |
| 端子位置 | DUAL | QUAD | DUAL | DUAL | DUAL | QUAD | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 宽度 | 9.085 mm | 11.43 mm | 7.62 mm | 7.62 mm | 7.62 mm | 11.43 mm | 9.085 mm |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 筛选级别 | MIL-STD-883 | MIL-STD-883 | MIL-STD-883 | MIL-PRF-38535 | - | MIL-PRF-38535 | MIL-PRF-38535 |
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