Programmable Logic Device, 30ns, PAL-Type, CMOS, PQCC28
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | Intel(英特尔) |
| 包装说明 | QCCJ, LDCC28,.5SQ |
| Reach Compliance Code | compliant |
| 架构 | PAL-TYPE |
| 最大时钟频率 | 23.8 MHz |
| JESD-30 代码 | S-PQCC-J28 |
| JESD-609代码 | e0 |
| 输入次数 | 22 |
| 输出次数 | 12 |
| 产品条款数 | 200 |
| 端子数量 | 28 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | QCCJ |
| 封装等效代码 | LDCC28,.5SQ |
| 封装形状 | SQUARE |
| 封装形式 | CHIP CARRIER |
| 电源 | 5 V |
| 传播延迟 | 30 ns |
| 认证状态 | Not Qualified |
| 标称供电电压 | 5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | J BEND |
| 端子节距 | 1.27 mm |
| 端子位置 | QUAD |
| Base Number Matches | 1 |
| TN5AC312-30 | D5AC312-30/S6030 | MD5AC312-30 | D5AC312-30/S6022 | D5AC312-25/S6029 | D5AC312-25/S6021 | MD5AC312-35 | |
|---|---|---|---|---|---|---|---|
| 描述 | Programmable Logic Device, 30ns, PAL-Type, CMOS, PQCC28 | IC,SIMPLE-EPLD,PAL-TYPE,CMOS,DIP,24PIN,CERAMIC | Programmable Logic Device, 30ns, PAL-Type, CMOS, CDIP24 | IC,SIMPLE-EPLD,PAL-TYPE,CMOS,DIP,24PIN,CERAMIC | IC,SIMPLE-EPLD,PAL-TYPE,CMOS,DIP,24PIN,CERAMIC | IC,SIMPLE-EPLD,PAL-TYPE,CMOS,DIP,24PIN,CERAMIC | Programmable Logic Device, 35ns, PAL-Type, CMOS, CDIP24 |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 厂商名称 | Intel(英特尔) | Intel(英特尔) | Intel(英特尔) | Intel(英特尔) | Intel(英特尔) | Intel(英特尔) | Intel(英特尔) |
| Reach Compliance Code | compliant | compliant | compliant | compliant | compliant | compliant | compliant |
| 架构 | PAL-TYPE | PAL-TYPE | PAL-TYPE | PAL-TYPE | PAL-TYPE | PAL-TYPE | PAL-TYPE |
| JESD-30 代码 | S-PQCC-J28 | R-XDIP-T24 | R-XDIP-T24 | R-XDIP-T24 | R-XDIP-T24 | R-XDIP-T24 | R-XDIP-T24 |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
| 输入次数 | 22 | 22 | 22 | 22 | 22 | 22 | 22 |
| 输出次数 | 12 | 12 | 12 | 12 | 12 | 12 | 12 |
| 产品条款数 | 200 | 200 | 200 | 200 | 200 | 200 | 200 |
| 端子数量 | 28 | 24 | 24 | 24 | 24 | 24 | 24 |
| 最高工作温度 | 85 °C | 70 °C | 125 °C | 70 °C | 70 °C | 70 °C | 125 °C |
| 封装主体材料 | PLASTIC/EPOXY | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC |
| 封装代码 | QCCJ | DIP | DIP | DIP | DIP | DIP | DIP |
| 封装等效代码 | LDCC28,.5SQ | DIP24,.3 | DIP24,.3 | DIP24,.3 | DIP24,.3 | DIP24,.3 | DIP24,.3 |
| 封装形状 | SQUARE | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | CHIP CARRIER | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE |
| 电源 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 标称供电电压 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | NO | NO | NO | NO | NO | NO |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | COMMERCIAL | MILITARY | COMMERCIAL | COMMERCIAL | COMMERCIAL | MILITARY |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | J BEND | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
| 端子节距 | 1.27 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm |
| 端子位置 | QUAD | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| 包装说明 | QCCJ, LDCC28,.5SQ | - | DIP, DIP24,.3 | DIP, DIP24,.3 | - | DIP, DIP24,.3 | DIP, DIP24,.3 |
| 最大时钟频率 | 23.8 MHz | - | 23.8 MHz | - | 18.2 MHz | 18.2 MHz | 22.2 MHz |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 | - |
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