S SERIES, 12-INPUT NAND GATE, PQCC20
| 参数名称 | 属性值 |
| 是否无铅 | 含铅 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | Texas Instruments(德州仪器) |
| Reach Compliance Code | not_compliant |
| 系列 | S |
| JESD-30 代码 | S-PQCC-J20 |
| 长度 | 8.9662 mm |
| 负载电容（CL） | 15 pF |
| 逻辑集成电路类型 | NAND GATE |
| 功能数量 | 1 |
| 输入次数 | 12 |
| 端子数量 | 20 |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 输出特性 | 3-STATE |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | QCCJ |
| 封装等效代码 | LDCC20,.4SQ |
| 封装形状 | SQUARE |
| 封装形式 | CHIP CARRIER |
| 峰值回流温度（摄氏度） | NOT SPECIFIED |
| 电源 | 5 V |
| 最大电源电流（ICC） | 16 mA |
| 传播延迟（tpd） | 7.5 ns |
| 认证状态 | Not Qualified |
| 施密特触发器 | NO |
| 座面最大高度 | 4.57 mm |
| 最大供电电压 (Vsup) | 5.25 V |
| 最小供电电压 (Vsup) | 4.75 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | YES |
| 技术 | TTL |
| 温度等级 | COMMERCIAL |
| 端子形式 | J BEND |
| 端子节距 | 1.27 mm |
| 端子位置 | QUAD |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 8.9662 mm |
| Base Number Matches | 1 |
| SN74S134FN | SN54S134FK | SN54S134J-00 | SN54S134W-10 | SN54S134W-00 | SN74S134N-00 | SN74S134N-10 | SN74S134DR | SN74S134J | SN74S134J-00 | |
|---|---|---|---|---|---|---|---|---|---|---|
| 描述 | S SERIES, 12-INPUT NAND GATE, PQCC20 | S SERIES, 12-INPUT NAND GATE, CQCC20, CERAMIC, CC-20 | S SERIES, 12-INPUT NAND GATE, CDIP16 | IC S SERIES, 12-INPUT NAND GATE, CDFP16, Gate | S SERIES, 12-INPUT NAND GATE, CDFP16 | S SERIES, 12-INPUT NAND GATE, PDIP16 | S SERIES, 12-INPUT NAND GATE, PDIP16 | S SERIES, 12-INPUT NAND GATE, PDSO16, PLASTIC, SO-16 | S SERIES, 12-INPUT NAND GATE, CDIP16 | S SERIES, 12-INPUT NAND GATE, CDIP16 |
| 厂商名称 | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) |
| Reach Compliance Code | not_compliant | not_compliant | unknown | unknown | unknown | unknown | unknown | unknown | not_compliant | unknown |
| 系列 | S | S | S | S | S | S | S | S | S | S |
| JESD-30 代码 | S-PQCC-J20 | S-CQCC-N20 | R-GDIP-T16 | R-GDFP-F16 | R-GDFP-F16 | R-PDIP-T16 | R-PDIP-T16 | R-PDSO-G16 | R-GDIP-T16 | R-GDIP-T16 |
| 长度 | 8.9662 mm | 8.89 mm | 19.56 mm | 10.2 mm | 10.2 mm | 19.305 mm | 19.305 mm | 9.9 mm | 19.56 mm | 19.56 mm |
| 负载电容（CL） | 15 pF | 15 pF | 15 pF | 15 pF | 15 pF | 15 pF | 15 pF | 15 pF | 15 pF | 15 pF |
| 逻辑集成电路类型 | NAND GATE | NAND GATE | NAND GATE | NAND GATE | NAND GATE | NAND GATE | NAND GATE | NAND GATE | NAND GATE | NAND GATE |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 输入次数 | 12 | 12 | 12 | 12 | 12 | 12 | 12 | 12 | 12 | 12 |
| 端子数量 | 20 | 20 | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 |
| 最高工作温度 | 70 °C | 125 °C | 125 °C | 125 °C | 125 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| 封装主体材料 | PLASTIC/EPOXY | CERAMIC, METAL-SEALED COFIRED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED |
| 封装代码 | QCCJ | QCCN | DIP | DFP | DFP | DIP | DIP | SOP | DIP | DIP |
| 封装形状 | SQUARE | SQUARE | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | CHIP CARRIER | CHIP CARRIER | IN-LINE | FLATPACK | FLATPACK | IN-LINE | IN-LINE | SMALL OUTLINE | IN-LINE | IN-LINE |
| 最大电源电流（ICC） | 16 mA | 16 mA | 25 mA | 25 mA | 25 mA | 25 mA | 25 mA | 16 mA | 16 mA | 25 mA |
| 传播延迟（tpd） | 7.5 ns | 7.5 ns | 7.5 ns | 7.5 ns | 7.5 ns | 7.5 ns | 7.5 ns | 7.5 ns | 7.5 ns | 7.5 ns |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 4.57 mm | 2.03 mm | 5.08 mm | 2.03 mm | 2.03 mm | 5.08 mm | 5.08 mm | 1.75 mm | 5.08 mm | 5.08 mm |
| 最大供电电压 (Vsup) | 5.25 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.25 V | 5.25 V | 5.25 V | 5.25 V | 5.25 V |
| 最小供电电压 (Vsup) | 4.75 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.75 V | 4.75 V | 4.75 V | 4.75 V | 4.75 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | YES | NO | YES | YES | NO | NO | YES | NO | NO |
| 技术 | TTL | TTL | TTL | TTL | TTL | TTL | TTL | TTL | TTL | TTL |
| 温度等级 | COMMERCIAL | MILITARY | MILITARY | MILITARY | MILITARY | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| 端子形式 | J BEND | NO LEAD | THROUGH-HOLE | FLAT | FLAT | THROUGH-HOLE | THROUGH-HOLE | GULL WING | THROUGH-HOLE | THROUGH-HOLE |
| 端子节距 | 1.27 mm | 1.27 mm | 2.54 mm | 1.27 mm | 1.27 mm | 2.54 mm | 2.54 mm | 1.27 mm | 2.54 mm | 2.54 mm |
| 端子位置 | QUAD | QUAD | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| 宽度 | 8.9662 mm | 8.89 mm | 7.62 mm | 6.73 mm | 6.73 mm | 7.62 mm | 7.62 mm | 3.9 mm | 7.62 mm | 7.62 mm |
| 包装说明 | - | QCCN, LCC20,.35SQ | DIP, | DFP, | DFP, | DIP, | DIP, | SOP, | DIP, DIP16,.3 | DIP, |
NXP MCU
嵌入式系统
FPGA/CPLD
电子竞赛
DSP 与 ARM 处理器
微控制器 MCU
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