8-BIT, 2MHz, MICROPROCESSOR, CDIP40, SIDE BRAZED, METAL SEALED, CERAMIC, DIP-40
参数名称 | 属性值 |
零件包装代码 | DIP |
包装说明 | DIP, |
针数 | 40 |
Reach Compliance Code | unknown |
ECCN代码 | 3A001.A.2.C |
地址总线宽度 | 16 |
位大小 | 8 |
边界扫描 | NO |
最大时钟频率 | 4 MHz |
外部数据总线宽度 | 8 |
格式 | FIXED POINT |
集成缓存 | NO |
JESD-30 代码 | R-CDIP-T40 |
低功率模式 | YES |
端子数量 | 40 |
最高工作温度 | 125 °C |
最低工作温度 | -55 °C |
封装主体材料 | CERAMIC, METAL-SEALED COFIRED |
封装代码 | DIP |
封装形状 | RECTANGULAR |
封装形式 | IN-LINE |
认证状态 | Not Qualified |
筛选级别 | MIL-PRF-38535 Class V |
座面最大高度 | 5.72 mm |
速度 | 2 MHz |
标称供电电压 | 5 V |
表面贴装 | NO |
技术 | CMOS |
温度等级 | MILITARY |
端子形式 | THROUGH-HOLE |
端子节距 | 2.54 mm |
端子位置 | DUAL |
总剂量 | 100k Rad(Si) V |
宽度 | 15.24 mm |
uPs/uCs/外围集成电路类型 | MICROPROCESSOR |
Base Number Matches | 1 |
5962R9582401VQX | 5962R9582401QXX | 5962R9582401QQX | 5962R9582401VXX | |
---|---|---|---|---|
描述 | 8-BIT, 2MHz, MICROPROCESSOR, CDIP40, SIDE BRAZED, METAL SEALED, CERAMIC, DIP-40 | 8-BIT, 2MHz, MICROPROCESSOR, CDFP42, METAL SEALED, CERAMIC, DFP-42 | 8-BIT, 2MHz, MICROPROCESSOR, CDIP40, SIDE BRAZED, METAL SEALED, CERAMIC, DIP-40 | 8-BIT, 2MHz, MICROPROCESSOR, CDFP42, METAL SEALED, CERAMIC, DFP-42 |
零件包装代码 | DIP | DFP | DIP | DFP |
包装说明 | DIP, | DFP, | DIP, | DFP, |
针数 | 40 | 42 | 40 | 42 |
Reach Compliance Code | unknown | unknown | unknown | unknown |
ECCN代码 | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C |
地址总线宽度 | 16 | 16 | 16 | 16 |
位大小 | 8 | 8 | 8 | 8 |
边界扫描 | NO | NO | NO | NO |
最大时钟频率 | 4 MHz | 4 MHz | 4 MHz | 4 MHz |
外部数据总线宽度 | 8 | 8 | 8 | 8 |
格式 | FIXED POINT | FIXED POINT | FIXED POINT | FIXED POINT |
集成缓存 | NO | NO | NO | NO |
JESD-30 代码 | R-CDIP-T40 | R-CDFP-F42 | R-CDIP-T40 | R-CDFP-F42 |
低功率模式 | YES | YES | YES | YES |
端子数量 | 40 | 42 | 40 | 42 |
最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C |
最低工作温度 | -55 °C | -55 °C | -55 °C | -55 °C |
封装主体材料 | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED |
封装代码 | DIP | DFP | DIP | DFP |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | IN-LINE | FLATPACK | IN-LINE | FLATPACK |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
筛选级别 | MIL-PRF-38535 Class V | MIL-PRF-38535 Class Q | MIL-PRF-38535 Class Q | MIL-PRF-38535 Class V |
座面最大高度 | 5.72 mm | 2.54 mm | 5.72 mm | 2.54 mm |
速度 | 2 MHz | 2 MHz | 2 MHz | 2 MHz |
标称供电电压 | 5 V | 5 V | 5 V | 5 V |
表面贴装 | NO | YES | NO | YES |
技术 | CMOS | CMOS | CMOS | CMOS |
温度等级 | MILITARY | MILITARY | MILITARY | MILITARY |
端子形式 | THROUGH-HOLE | FLAT | THROUGH-HOLE | FLAT |
端子节距 | 2.54 mm | 1.27 mm | 2.54 mm | 1.27 mm |
端子位置 | DUAL | DUAL | DUAL | DUAL |
总剂量 | 100k Rad(Si) V | 100k Rad(Si) V | 100k Rad(Si) V | 100k Rad(Si) V |
宽度 | 15.24 mm | 16.255 mm | 15.24 mm | 16.255 mm |
uPs/uCs/外围集成电路类型 | MICROPROCESSOR | MICROPROCESSOR | MICROPROCESSOR | MICROPROCESSOR |
Base Number Matches | 1 | 1 | 1 | 1 |
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