Hot Swap Controller
LTC1421-2.5 | LTC1421CSW | LTC1421-2.5CSW | LTC1421CG | CCR-38SX60-DM | |
---|---|---|---|---|---|
描述 | Hot Swap Controller | Hot Swap Controller | Hot Swap Controller | Hot Swap Controller | Normally Open Coaxial Switch |
是否Rohs认证 | - | 不符合 | 不符合 | 不符合 | - |
零件包装代码 | - | SOIC | SOIC | SSOP | - |
包装说明 | - | SOP, SOP24,.4 | SOP, SOP24,.4 | SSOP, SSOP24,.3 | - |
针数 | - | 24 | 24 | 24 | - |
Reach Compliance Code | - | not_compliant | compli | not_compliant | - |
ECCN代码 | - | EAR99 | EAR99 | EAR99 | - |
可调阈值 | - | NO | NO | NO | - |
模拟集成电路 - 其他类型 | - | POWER SUPPLY SUPPORT CIRCUIT | POWER SUPPLY SUPPORT CIRCUIT | POWER SUPPLY SUPPORT CIRCUIT | - |
JESD-30 代码 | - | R-PDSO-G24 | R-PDSO-G24 | R-PDSO-G24 | - |
JESD-609代码 | - | e0 | e0 | e0 | - |
长度 | - | 15.4 mm | 15.4 mm | 8.2 mm | - |
湿度敏感等级 | - | 1 | 1 | 1 | - |
信道数量 | - | 1 | 1 | 1 | - |
功能数量 | - | 1 | 1 | 1 | - |
端子数量 | - | 24 | 24 | 24 | - |
最高工作温度 | - | 70 °C | 70 °C | 70 °C | - |
封装主体材料 | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | - |
封装代码 | - | SOP | SOP | SSOP | - |
封装等效代码 | - | SOP24,.4 | SOP24,.4 | SSOP24,.3 | - |
封装形状 | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | - |
封装形式 | - | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE, SHRINK PITCH | - |
峰值回流温度(摄氏度) | - | 235 | 255 | 235 | - |
电源 | - | 5,12 V | 5,12 V | 5,12 V | - |
认证状态 | - | Not Qualified | Not Qualified | Not Qualified | - |
座面最大高度 | - | 2.65 mm | 2.65 mm | 2 mm | - |
最大供电电压 (Vsup) | - | 12 V | 12 V | 12 V | - |
最小供电电压 (Vsup) | - | 3 V | 3 V | 3 V | - |
标称供电电压 (Vsup) | - | 5 V | 5 V | 5 V | - |
表面贴装 | - | YES | YES | YES | - |
技术 | - | CMOS | CMOS | CMOS | - |
温度等级 | - | COMMERCIAL | COMMERCIAL | COMMERCIAL | - |
端子面层 | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - |
端子形式 | - | GULL WING | GULL WING | GULL WING | - |
端子节距 | - | 1.27 mm | 1.27 mm | 0.65 mm | - |
端子位置 | - | DUAL | DUAL | DUAL | - |
处于峰值回流温度下的最长时间 | - | 20 | 40 | 20 | - |
宽度 | - | 7.5 mm | 7.5 mm | 5.3 mm | - |
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