4000/14000/40000 SERIES, 6-BIT DRIVER, TRUE OUTPUT, CDFP16, CERAMIC, FP-16
| 参数名称 | 属性值 |
| 是否无铅 | 不含铅 |
| 是否Rohs认证 | 符合 |
| 厂商名称 | Renesas(瑞萨电子) |
| 零件包装代码 | DFP |
| 包装说明 | DFP, FL16,.3 |
| 针数 | 16 |
| Reach Compliance Code | compliant |
| 控制类型 | ENABLE LOW |
| 系列 | 4000/14000/40000 |
| JESD-30 代码 | R-CDFP-F16 |
| JESD-609代码 | e4 |
| 逻辑集成电路类型 | BUS DRIVER |
| 最大I（ol） | 0.0026 A |
| 位数 | 6 |
| 功能数量 | 1 |
| 端口数量 | 2 |
| 端子数量 | 16 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 输出特性 | 3-STATE |
| 输出极性 | TRUE |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | DFP |
| 封装等效代码 | FL16,.3 |
| 封装形状 | RECTANGULAR |
| 封装形式 | FLATPACK |
| 峰值回流温度（摄氏度） | NOT SPECIFIED |
| 电源 | 5/15 V |
| Prop。Delay @ Nom-Sup | 203 ns |
| 传播延迟（tpd） | 203 ns |
| 认证状态 | Not Qualified |
| 筛选级别 | MIL-PRF-38535 Class V |
| 最大供电电压 (Vsup) | 18 V |
| 最小供电电压 (Vsup) | 3 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | MILITARY |
| 端子面层 | GOLD |
| 端子形式 | FLAT |
| 端子节距 | 1.27 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 总剂量 | 100k Rad(Si) V |
| Base Number Matches | 1 |
| 5962R9664302VXC | 5962R9664301VEC | 5962R9664301VXC | 5962R9664302V9A | 5962R9664301V9A | 5962R9664302VEC | |
|---|---|---|---|---|---|---|
| 描述 | 4000/14000/40000 SERIES, 6-BIT DRIVER, TRUE OUTPUT, CDFP16, CERAMIC, FP-16 | 4000/14000/40000 SERIES, 6-BIT DRIVER, TRUE OUTPUT, CDIP16, CERAMIC, DIP-16 | 4000/14000/40000 SERIES, 6-BIT DRIVER, TRUE OUTPUT, CDFP16, CERAMIC, FP-16 | 4000/14000/40000 SERIES, 6-BIT DRIVER, TRUE OUTPUT, UUC16, DIE-16 | 4000/14000/40000 SERIES, 6-BIT DRIVER, TRUE OUTPUT, UUC16 | 4000/14000/40000 SERIES, 6-BIT DRIVER, TRUE OUTPUT, CDIP16, CERAMIC, DIP-16 |
| 零件包装代码 | DFP | DIP | DFP | DIE | DIE | DIP |
| 包装说明 | DFP, FL16,.3 | DIP, DIP16,.3 | DFP, FL16,.3 | DIE, | DIE, | DIP, DIP16,.3 |
| 针数 | 16 | 16 | 16 | 16 | 16 | 16 |
| Reach Compliance Code | compliant | compliant | compliant | unknown | unknown | not_compliant |
| 系列 | 4000/14000/40000 | 4000/14000/40000 | 4000/14000/40000 | 4000/14000/40000 | 4000/14000/40000 | 4000/14000/40000 |
| JESD-30 代码 | R-CDFP-F16 | R-CDIP-T16 | R-CDFP-F16 | X-XUUC-N16 | X-XUUC-N16 | R-CDIP-T16 |
| 逻辑集成电路类型 | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER |
| 位数 | 6 | 6 | 6 | 6 | 6 | 6 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端口数量 | 2 | 2 | 2 | 2 | 2 | 2 |
| 端子数量 | 16 | 16 | 16 | 16 | 16 | 16 |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| 输出极性 | TRUE | TRUE | TRUE | TRUE | TRUE | TRUE |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | UNSPECIFIED | UNSPECIFIED | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | DFP | DIP | DFP | DIE | DIE | DIP |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | UNSPECIFIED | UNSPECIFIED | RECTANGULAR |
| 封装形式 | FLATPACK | IN-LINE | FLATPACK | UNCASED CHIP | UNCASED CHIP | IN-LINE |
| 传播延迟（tpd） | 203 ns | 203 ns | 203 ns | 203 ns | 203 ns | 203 ns |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 筛选级别 | MIL-PRF-38535 Class V | MIL-PRF-38535 Class V | MIL-PRF-38535 Class V | MIL-PRF-38535 Class V | MIL-PRF-38535 Class V | MIL-PRF-38535 Class V |
| 最大供电电压 (Vsup) | 18 V | 18 V | 18 V | 18 V | 18 V | 18 V |
| 最小供电电压 (Vsup) | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | NO | YES | YES | YES | NO |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY |
| 端子形式 | FLAT | THROUGH-HOLE | FLAT | NO LEAD | NO LEAD | THROUGH-HOLE |
| 端子位置 | DUAL | DUAL | DUAL | UPPER | UPPER | DUAL |
| 总剂量 | 100k Rad(Si) V | 100k Rad(Si) V | 100k Rad(Si) V | 100k Rad(Si) V | 100k Rad(Si) V | 100k Rad(Si) V |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 |
| 是否Rohs认证 | 符合 | 符合 | 符合 | - | - | 不符合 |
| 控制类型 | ENABLE LOW | ENABLE LOW | ENABLE LOW | - | - | ENABLE LOW |
| JESD-609代码 | e4 | - | e4 | e0 | e0 | - |
| 最大I（ol） | 0.0026 A | 0.0026 A | 0.0026 A | - | - | 0.0026 A |
| 封装等效代码 | FL16,.3 | DIP16,.3 | FL16,.3 | - | - | DIP16,.3 |
| 峰值回流温度（摄氏度） | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - | - | 225 |
| 电源 | 5/15 V | 5/15 V | 5/15 V | - | - | 5/15 V |
| Prop。Delay @ Nom-Sup | 203 ns | 203 ns | 203 ns | - | - | 203 ns |
| 端子面层 | GOLD | - | GOLD | TIN LEAD | TIN LEAD | - |
| 端子节距 | 1.27 mm | 2.54 mm | 1.27 mm | - | - | 2.54 mm |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - | - | NOT SPECIFIED |
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