4000/14000/40000 SERIES, 6-BIT DRIVER, TRUE OUTPUT, CDFP16, CERAMIC, FP-16
参数名称 | 属性值 |
是否无铅 | 不含铅 |
是否Rohs认证 | 符合 |
厂商名称 | Renesas(瑞萨电子) |
零件包装代码 | DFP |
包装说明 | DFP, FL16,.3 |
针数 | 16 |
Reach Compliance Code | compliant |
其他特性 | ONE FUNCTION WITH TWO BITS; RADIATION HARDENED; IOH = 3MA @ VOH = 2.5V |
控制类型 | ENABLE LOW |
系列 | 4000/14000/40000 |
JESD-30 代码 | R-CDFP-F16 |
JESD-609代码 | e4 |
逻辑集成电路类型 | BUS DRIVER |
最大I(ol) | 0.0026 A |
位数 | 6 |
功能数量 | 1 |
端口数量 | 2 |
端子数量 | 16 |
最高工作温度 | 125 °C |
最低工作温度 | -55 °C |
输出特性 | 3-STATE |
输出极性 | TRUE |
封装主体材料 | CERAMIC, METAL-SEALED COFIRED |
封装代码 | DFP |
封装等效代码 | FL16,.3 |
封装形状 | RECTANGULAR |
封装形式 | FLATPACK |
峰值回流温度(摄氏度) | NOT SPECIFIED |
电源 | 5/15 V |
Prop。Delay @ Nom-Sup | 203 ns |
传播延迟(tpd) | 203 ns |
认证状态 | Not Qualified |
筛选级别 | MIL-PRF-38535 Class V |
座面最大高度 | 2.92 mm |
最大供电电压 (Vsup) | 18 V |
最小供电电压 (Vsup) | 3 V |
标称供电电压 (Vsup) | 5 V |
表面贴装 | YES |
技术 | CMOS |
温度等级 | MILITARY |
端子面层 | GOLD |
端子形式 | FLAT |
端子节距 | 1.27 mm |
端子位置 | DUAL |
处于峰值回流温度下的最长时间 | NOT SPECIFIED |
总剂量 | 100k Rad(Si) V |
宽度 | 6.73 mm |
Base Number Matches | 1 |
5962R9664301VXC | 5962R9664301VEC | 5962R9664302V9A | 5962R9664301V9A | 5962R9664302VXC | 5962R9664302VEC | |
---|---|---|---|---|---|---|
描述 | 4000/14000/40000 SERIES, 6-BIT DRIVER, TRUE OUTPUT, CDFP16, CERAMIC, FP-16 | 4000/14000/40000 SERIES, 6-BIT DRIVER, TRUE OUTPUT, CDIP16, CERAMIC, DIP-16 | 4000/14000/40000 SERIES, 6-BIT DRIVER, TRUE OUTPUT, UUC16, DIE-16 | 4000/14000/40000 SERIES, 6-BIT DRIVER, TRUE OUTPUT, UUC16 | 4000/14000/40000 SERIES, 6-BIT DRIVER, TRUE OUTPUT, CDFP16, CERAMIC, FP-16 | 4000/14000/40000 SERIES, 6-BIT DRIVER, TRUE OUTPUT, CDIP16, CERAMIC, DIP-16 |
零件包装代码 | DFP | DIP | DIE | DIE | DFP | DIP |
包装说明 | DFP, FL16,.3 | DIP, DIP16,.3 | DIE, | DIE, | DFP, FL16,.3 | DIP, DIP16,.3 |
针数 | 16 | 16 | 16 | 16 | 16 | 16 |
Reach Compliance Code | compliant | compliant | unknown | unknown | compliant | not_compliant |
系列 | 4000/14000/40000 | 4000/14000/40000 | 4000/14000/40000 | 4000/14000/40000 | 4000/14000/40000 | 4000/14000/40000 |
JESD-30 代码 | R-CDFP-F16 | R-CDIP-T16 | X-XUUC-N16 | X-XUUC-N16 | R-CDFP-F16 | R-CDIP-T16 |
逻辑集成电路类型 | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER |
位数 | 6 | 6 | 6 | 6 | 6 | 6 |
功能数量 | 1 | 1 | 1 | 1 | 1 | 1 |
端口数量 | 2 | 2 | 2 | 2 | 2 | 2 |
端子数量 | 16 | 16 | 16 | 16 | 16 | 16 |
最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
最低工作温度 | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C |
输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
输出极性 | TRUE | TRUE | TRUE | TRUE | TRUE | TRUE |
封装主体材料 | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | UNSPECIFIED | UNSPECIFIED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED |
封装代码 | DFP | DIP | DIE | DIE | DFP | DIP |
封装形状 | RECTANGULAR | RECTANGULAR | UNSPECIFIED | UNSPECIFIED | RECTANGULAR | RECTANGULAR |
封装形式 | FLATPACK | IN-LINE | UNCASED CHIP | UNCASED CHIP | FLATPACK | IN-LINE |
传播延迟(tpd) | 203 ns | 203 ns | 203 ns | 203 ns | 203 ns | 203 ns |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
筛选级别 | MIL-PRF-38535 Class V | MIL-PRF-38535 Class V | MIL-PRF-38535 Class V | MIL-PRF-38535 Class V | MIL-PRF-38535 Class V | MIL-PRF-38535 Class V |
最大供电电压 (Vsup) | 18 V | 18 V | 18 V | 18 V | 18 V | 18 V |
最小供电电压 (Vsup) | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V |
标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
表面贴装 | YES | NO | YES | YES | YES | NO |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY |
端子形式 | FLAT | THROUGH-HOLE | NO LEAD | NO LEAD | FLAT | THROUGH-HOLE |
端子位置 | DUAL | DUAL | UPPER | UPPER | DUAL | DUAL |
总剂量 | 100k Rad(Si) V | 100k Rad(Si) V | 100k Rad(Si) V | 100k Rad(Si) V | 100k Rad(Si) V | 100k Rad(Si) V |
Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 |
是否Rohs认证 | 符合 | 符合 | - | - | 符合 | 不符合 |
控制类型 | ENABLE LOW | ENABLE LOW | - | - | ENABLE LOW | ENABLE LOW |
JESD-609代码 | e4 | - | e0 | e0 | e4 | - |
最大I(ol) | 0.0026 A | 0.0026 A | - | - | 0.0026 A | 0.0026 A |
封装等效代码 | FL16,.3 | DIP16,.3 | - | - | FL16,.3 | DIP16,.3 |
峰值回流温度(摄氏度) | NOT SPECIFIED | NOT SPECIFIED | - | - | NOT SPECIFIED | 225 |
电源 | 5/15 V | 5/15 V | - | - | 5/15 V | 5/15 V |
Prop。Delay @ Nom-Sup | 203 ns | 203 ns | - | - | 203 ns | 203 ns |
端子面层 | GOLD | - | TIN LEAD | TIN LEAD | GOLD | - |
端子节距 | 1.27 mm | 2.54 mm | - | - | 1.27 mm | 2.54 mm |
处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | - | - | NOT SPECIFIED | NOT SPECIFIED |
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