MASK ROM, 512KX8, 200ns, CMOS, PDIP40, 0.600 INCH, PLASTIC, DIP-40
参数名称 | 属性值 |
厂商名称 | SHARP |
包装说明 | 0.600 INCH, PLASTIC, DIP-40 |
Reach Compliance Code | unknown |
最长访问时间 | 200 ns |
备用内存宽度 | 16 |
JESD-30 代码 | R-PDIP-T40 |
长度 | 52 mm |
内存密度 | 4194304 bit |
内存集成电路类型 | MASK ROM |
内存宽度 | 8 |
功能数量 | 1 |
端子数量 | 40 |
字数 | 524288 words |
字数代码 | 512000 |
工作模式 | ASYNCHRONOUS |
最高工作温度 | 70 °C |
最低工作温度 | |
组织 | 512KX8 |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | DIP |
封装形状 | RECTANGULAR |
封装形式 | IN-LINE |
并行/串行 | PARALLEL |
认证状态 | Not Qualified |
座面最大高度 | 5.4 mm |
最大供电电压 (Vsup) | 5.5 V |
最小供电电压 (Vsup) | 2.6 V |
标称供电电压 (Vsup) | 5 V |
表面贴装 | NO |
技术 | CMOS |
温度等级 | COMMERCIAL |
端子形式 | THROUGH-HOLE |
端子节距 | 2.54 mm |
端子位置 | DUAL |
宽度 | 15.24 mm |
Base Number Matches | 1 |
LH534000B-SD-50 | LH534000B-SN-50 | LH534000B-SM-50 | LH534000B-ST-50 | LH534000B-SZ-50 | |
---|---|---|---|---|---|
描述 | MASK ROM, 512KX8, 200ns, CMOS, PDIP40, 0.600 INCH, PLASTIC, DIP-40 | MASK ROM, 512KX8, 200ns, CMOS, PDSO40, 0.525 INCH, PLASTIC, SOP-40 | MASK ROM, 512KX8, 200ns, CMOS, PQFP44, 14 X 14 MM, PLASTIC, QFP-44 | MASK ROM, 512KX8, 200ns, CMOS, PDSO48, 12 X 18 MM, PLASTIC, TSOP1-48 | MASK ROM, 512KX8, 200ns, CMOS, PQFP44, 10 X 10 MM, PLASTIC, QFP-44 |
厂商名称 | SHARP | SHARP | SHARP | SHARP | SHARP |
包装说明 | 0.600 INCH, PLASTIC, DIP-40 | 0.525 INCH, PLASTIC, SOP-40 | 14 X 14 MM, PLASTIC, QFP-44 | 12 X 18 MM, PLASTIC, TSOP1-48 | 10 X 10 MM, PLASTIC, QFP-44 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown |
最长访问时间 | 200 ns | 200 ns | 200 ns | 200 ns | 200 ns |
备用内存宽度 | 16 | 16 | 16 | 16 | 16 |
JESD-30 代码 | R-PDIP-T40 | R-PDSO-G40 | S-PQFP-G44 | R-PDSO-G48 | S-PQFP-G44 |
长度 | 52 mm | 26.3 mm | 14 mm | 16.4 mm | 10 mm |
内存密度 | 4194304 bit | 4194304 bit | 4194304 bit | 4194304 bit | 4194304 bit |
内存集成电路类型 | MASK ROM | MASK ROM | MASK ROM | MASK ROM | MASK ROM |
内存宽度 | 8 | 8 | 8 | 8 | 8 |
功能数量 | 1 | 1 | 1 | 1 | 1 |
端子数量 | 40 | 40 | 44 | 48 | 44 |
字数 | 524288 words | 524288 words | 524288 words | 524288 words | 524288 words |
字数代码 | 512000 | 512000 | 512000 | 512000 | 512000 |
工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
组织 | 512KX8 | 512KX8 | 512KX8 | 512KX8 | 512KX8 |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | DIP | SOP | QFP | TSOP1 | QFP |
封装形状 | RECTANGULAR | RECTANGULAR | SQUARE | RECTANGULAR | SQUARE |
封装形式 | IN-LINE | SMALL OUTLINE | FLATPACK | SMALL OUTLINE, THIN PROFILE | FLATPACK |
并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | 5.4 mm | 3.1 mm | 2.3 mm | 1.2 mm | 1.85 mm |
最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
最小供电电压 (Vsup) | 2.6 V | 2.6 V | 2.6 V | 2.6 V | 2.6 V |
标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V |
表面贴装 | NO | YES | YES | YES | YES |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
端子形式 | THROUGH-HOLE | GULL WING | GULL WING | GULL WING | GULL WING |
端子节距 | 2.54 mm | 1.27 mm | 0.8 mm | 0.5 mm | 0.8 mm |
端子位置 | DUAL | DUAL | QUAD | DUAL | QUAD |
宽度 | 15.24 mm | 11.3 mm | 14 mm | 12 mm | 10 mm |
Base Number Matches | 1 | 1 | 1 | 1 | 1 |
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