1 CHANNEL(S), 200Mbps, SERIAL COMM CONTROLLER, CQFP100, CERAMIC, QFP-100
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 零件包装代码 | QFP |
| 包装说明 | QFP, QFP100,.9SQ |
| 针数 | 100 |
| Reach Compliance Code | not_compliant |
| 地址总线宽度 | 8 |
| 边界扫描 | NO |
| 最大时钟频率 | 50 MHz |
| 最大数据传输速率 | 25 MBps |
| 外部数据总线宽度 | 16 |
| JESD-30 代码 | S-CQFP-G100 |
| 长度 | 19.05 mm |
| 低功率模式 | NO |
| 串行 I/O 数 | 1 |
| 端子数量 | 100 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | QFP |
| 封装等效代码 | QFP100,.9SQ |
| 封装形状 | SQUARE |
| 封装形式 | FLATPACK |
| 峰值回流温度（摄氏度） | NOT SPECIFIED |
| 电源 | 3.3,5 V |
| 认证状态 | Not Qualified |
| 筛选级别 | MIL-PRF-38535 Class Q |
| 座面最大高度 | 4.07 mm |
| 最大供电电压 | 3.6 V |
| 最小供电电压 | 3 V |
| 标称供电电压 | 3.3 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | MILITARY |
| 端子形式 | GULL WING |
| 端子节距 | 0.65 mm |
| 端子位置 | QUAD |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 19.05 mm |
| uPs/uCs/外围集成电路类型 | SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
| Base Number Matches | 1 |
| 5962-9753001QXA | TSB12LV31MWNB | TSB12LV31IPZ | TSB12LV31MWN | |
|---|---|---|---|---|
| 描述 | 1 CHANNEL(S), 200Mbps, SERIAL COMM CONTROLLER, CQFP100, CERAMIC, QFP-100 | 1 CHANNEL(S), 200Mbps, SERIAL COMM CONTROLLER, CQFP100, CERAMIC, QFP-100 | GPLynx - General Purpose 1394 3.3V Link Layer with 8/16 bit I/F, 200byte FIFOs w/ Isochronous Port 100-LQFP | 1 CHANNEL(S), 200Mbps, SERIAL COMM CONTROLLER, CQFP100, CERAMIC, QFP-100 |
| 零件包装代码 | QFP | QFP | QFP | QFP |
| 包装说明 | QFP, QFP100,.9SQ | QFP, | LFQFP, | QFP, |
| 针数 | 100 | 100 | 100 | 100 |
| Reach Compliance Code | not_compliant | unknown | unknown | unknown |
| 地址总线宽度 | 8 | 8 | 8 | 8 |
| 边界扫描 | NO | NO | NO | NO |
| 最大时钟频率 | 50 MHz | 50 MHz | 50 MHz | 50 MHz |
| 最大数据传输速率 | 25 MBps | 25 MBps | 25 MBps | 25 MBps |
| 外部数据总线宽度 | 16 | 16 | 16 | 16 |
| JESD-30 代码 | S-CQFP-G100 | S-CQFP-G100 | S-PQFP-G100 | S-GQFP-G100 |
| 长度 | 19.05 mm | 19.05 mm | 14 mm | 19.05 mm |
| 低功率模式 | NO | NO | NO | NO |
| 串行 I/O 数 | 1 | 1 | 1 | 1 |
| 端子数量 | 100 | 100 | 100 | 100 |
| 最高工作温度 | 125 °C | 125 °C | 85 °C | 125 °C |
| 最低工作温度 | -55 °C | -55 °C | -40 °C | -55 °C |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | PLASTIC/EPOXY | CERAMIC, GLASS-SEALED |
| 封装代码 | QFP | QFP | LFQFP | QFP |
| 封装形状 | SQUARE | SQUARE | SQUARE | SQUARE |
| 封装形式 | FLATPACK | FLATPACK | FLATPACK, LOW PROFILE, FINE PITCH | FLATPACK |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 4.07 mm | 4.07 mm | 1.6 mm | 4.07 mm |
| 最大供电电压 | 3.6 V | 3.6 V | 3.6 V | 3.6 V |
| 最小供电电压 | 3 V | 3 V | 3 V | 3 V |
| 标称供电电压 | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| 表面贴装 | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | MILITARY | MILITARY | INDUSTRIAL | MILITARY |
| 端子形式 | GULL WING | GULL WING | GULL WING | GULL WING |
| 端子节距 | 0.65 mm | 0.65 mm | 0.5 mm | 0.65 mm |
| 端子位置 | QUAD | QUAD | QUAD | QUAD |
| 宽度 | 19.05 mm | 19.05 mm | 14 mm | 19.05 mm |
| uPs/uCs/外围集成电路类型 | SERIAL IO/COMMUNICATION CONTROLLER, SERIAL | SERIAL IO/COMMUNICATION CONTROLLER, SERIAL | SERIAL IO/COMMUNICATION CONTROLLER, SERIAL | SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
| Brand Name | - | Texas Instruments | Texas Instruments | Texas Instruments |
| 是否无铅 | - | 含铅 | 含铅 | 含铅 |
| 厂商名称 | - | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) |
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