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5962-9220202MEA

产品描述CDIP-16, Tube
产品类别逻辑    逻辑   
文件大小177KB,共6页
制造商IDT (Integrated Device Technology)
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5962-9220202MEA概述

CDIP-16, Tube

5962-9220202MEA规格参数

参数名称属性值
Brand NameIntegrated Device Technology
是否无铅含铅
是否Rohs认证不符合
零件包装代码CDIP
包装说明DIP, DIP16,.3
针数16
制造商包装代码CD16
Reach Compliance Codenot_compliant
ECCN代码EAR99
系列FCT
JESD-30 代码R-GDIP-T16
JESD-609代码e0
长度20.066 mm
负载电容(CL)50 pF
逻辑集成电路类型OTHER DECODER/DRIVER
最大I(ol)0.032 A
湿度敏感等级1
功能数量2
端子数量16
最高工作温度125 °C
最低工作温度-55 °C
输出极性INVERTED
封装主体材料CERAMIC, GLASS-SEALED
封装代码DIP
封装等效代码DIP16,.3
封装形状RECTANGULAR
封装形式IN-LINE
峰值回流温度(摄氏度)240
电源5 V
Prop。Delay @ Nom-Sup12 ns
传播延迟(tpd)12 ns
认证状态Not Qualified
筛选级别MIL-STD-883
座面最大高度5.08 mm
最大供电电压 (Vsup)5.5 V
最小供电电压 (Vsup)4.5 V
标称供电电压 (Vsup)5 V
表面贴装NO
技术CMOS
温度等级MILITARY
端子面层Tin/Lead (Sn/Pb)
端子形式THROUGH-HOLE
端子节距2.54 mm
端子位置DUAL
处于峰值回流温度下的最长时间NOT SPECIFIED
宽度7.62 mm
Base Number Matches1

5962-9220202MEA相似产品对比

5962-9220202MEA IDT54FCT139ATDB 5962-9220206MEA IDT54FCT139CTDB IDT54FCT139TDB IDT54FCT139CTLB IDT54FCT139TLB IDT54FCT139CTEB IDT54FCT139TEB IDT54FCT139ATLB
描述 CDIP-16, Tube Decoder/Driver, FCT Series, Inverted Output, CMOS, CDIP16, CERAMIC, DIP-16 CDIP-16, Tube Decoder/Driver, FCT Series, Inverted Output, CMOS, CDIP16, CERAMIC, DIP-16 Decoder/Driver, FCT Series, Inverted Output, CMOS, CDIP16, CERAMIC, DIP-16 Decoder/Driver, FCT Series, Inverted Output, CMOS, CQCC20, LCC-20 Decoder/Driver, FCT Series, Inverted Output, CMOS, CQCC20, LCC-20 Decoder/Driver, FCT Series, Inverted Output, CMOS, CDFP16, CERAMIC, DFP-16 Decoder/Driver, FCT Series, Inverted Output, CMOS, CDFP16, CERPACK-16 Decoder/Driver, FCT Series, Inverted Output, CMOS, CQCC20, LCC-20
是否Rohs认证 不符合 不符合 不符合 不符合 不符合 不符合 不符合 不符合 不符合 不符合
零件包装代码 CDIP DIP CDIP DIP DIP QLCC QLCC DFP DFP QLCC
包装说明 DIP, DIP16,.3 DIP, DIP16,.3 DIP, DIP16,.3 DIP, DIP16,.3 DIP, DIP16,.3 QCCN, LCC20,.35SQ QCCN, LCC20,.35SQ DFP, FL16,.3 DFP, FL16,.3 QCCN, LCC20,.35SQ
针数 16 16 16 16 16 20 20 16 16 20
Reach Compliance Code not_compliant not_compliant not_compliant not_compliant not_compliant not_compliant not_compliant not_compliant not_compliant _compli
ECCN代码 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99
系列 FCT FCT FCT FCT FCT FCT FCT FCT FCT FCT
JESD-30 代码 R-GDIP-T16 R-GDIP-T16 R-GDIP-T16 R-GDIP-T16 R-GDIP-T16 S-CQCC-N20 S-CQCC-N20 R-GDFP-F16 R-GDFP-F16 S-CQCC-N20
JESD-609代码 e0 e0 e0 e0 e0 e0 e0 e0 e0 e0
负载电容(CL) 50 pF 50 pF 50 pF 50 pF 50 pF 50 pF 50 pF 50 pF 50 pF 50 pF
逻辑集成电路类型 OTHER DECODER/DRIVER OTHER DECODER/DRIVER OTHER DECODER/DRIVER OTHER DECODER/DRIVER OTHER DECODER/DRIVER OTHER DECODER/DRIVER OTHER DECODER/DRIVER OTHER DECODER/DRIVER OTHER DECODER/DRIVER OTHER DECODER/DRIVER
最大I(ol) 0.032 A 0.032 A 0.032 A 0.032 A 0.032 A 0.032 A 0.032 A 0.032 A 0.032 A 0.032 A
功能数量 2 2 2 2 2 2 2 2 2 2
端子数量 16 16 16 16 16 20 20 16 16 20
最高工作温度 125 °C 125 °C 125 °C 125 °C 125 °C 125 °C 125 °C 125 °C 125 °C 125 °C
最低工作温度 -55 °C -55 °C -55 °C -55 °C -55 °C -55 °C -55 °C -55 °C -55 °C -55 °C
输出极性 INVERTED INVERTED INVERTED INVERTED INVERTED INVERTED INVERTED INVERTED INVERTED INVERTED
封装主体材料 CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED CERAMIC, METAL-SEALED COFIRED
封装代码 DIP DIP DIP DIP DIP QCCN QCCN DFP DFP QCCN
封装等效代码 DIP16,.3 DIP16,.3 DIP16,.3 DIP16,.3 DIP16,.3 LCC20,.35SQ LCC20,.35SQ FL16,.3 FL16,.3 LCC20,.35SQ
封装形状 RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR SQUARE SQUARE RECTANGULAR RECTANGULAR SQUARE
封装形式 IN-LINE IN-LINE IN-LINE IN-LINE IN-LINE CHIP CARRIER CHIP CARRIER FLATPACK FLATPACK CHIP CARRIER
峰值回流温度(摄氏度) 240 225 240 NOT SPECIFIED 225 NOT SPECIFIED 225 NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
电源 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V
传播延迟(tpd) 12 ns 7.8 ns 6.2 ns 6.2 ns 12 ns 6.2 ns 12 ns 6.2 ns 12 ns 7.8 ns
认证状态 Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
筛选级别 MIL-STD-883 MIL-STD-883 Class B MIL-STD-883 MIL-STD-883 Class B MIL-STD-883 Class B MIL-STD-883 Class B MIL-STD-883 Class B MIL-STD-883 Class B MIL-STD-883 Class B MIL-STD-883 Class B
最大供电电压 (Vsup) 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V
最小供电电压 (Vsup) 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V
标称供电电压 (Vsup) 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V
表面贴装 NO NO NO NO NO YES YES YES YES YES
技术 CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS
温度等级 MILITARY MILITARY MILITARY MILITARY MILITARY MILITARY MILITARY MILITARY MILITARY MILITARY
端子面层 Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
端子形式 THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE NO LEAD NO LEAD FLAT FLAT NO LEAD
端子节距 2.54 mm 2.54 mm 2.54 mm 2.54 mm 2.54 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm
端子位置 DUAL DUAL DUAL DUAL DUAL QUAD QUAD DUAL DUAL QUAD
处于峰值回流温度下的最长时间 NOT SPECIFIED 20 NOT SPECIFIED NOT SPECIFIED 20 NOT SPECIFIED 30 NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
长度 20.066 mm 20.066 mm 20.066 mm 20.066 mm 20.066 mm 8.89 mm 8.89 mm - - 8.89 mm
Prop。Delay @ Nom-Sup 12 ns 7.8 ns 6.2 ns 6.2 ns 12 ns 6.2 ns 12 ns 6.2 ns 12 ns -
座面最大高度 5.08 mm 5.08 mm 5.08 mm 5.08 mm 5.08 mm 2.54 mm 2.54 mm - - 2.54 mm
宽度 7.62 mm 7.62 mm 7.62 mm 7.62 mm 7.62 mm 8.89 mm 8.89 mm - - 8.89 mm
Base Number Matches 1 1 1 1 1 1 - - - -
输入调节 - STANDARD - STANDARD STANDARD STANDARD STANDARD - - STANDARD
厂商名称 - - - - IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology)

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