CDIP-16, Tube
参数名称 | 属性值 |
Brand Name | Integrated Device Technology |
是否无铅 | 含铅 |
是否Rohs认证 | 不符合 |
零件包装代码 | CDIP |
包装说明 | DIP, DIP16,.3 |
针数 | 16 |
制造商包装代码 | CD16 |
Reach Compliance Code | not_compliant |
ECCN代码 | EAR99 |
系列 | FCT |
JESD-30 代码 | R-GDIP-T16 |
JESD-609代码 | e0 |
长度 | 20.066 mm |
负载电容(CL) | 50 pF |
逻辑集成电路类型 | OTHER DECODER/DRIVER |
最大I(ol) | 0.032 A |
湿度敏感等级 | 1 |
功能数量 | 2 |
端子数量 | 16 |
最高工作温度 | 125 °C |
最低工作温度 | -55 °C |
输出极性 | INVERTED |
封装主体材料 | CERAMIC, GLASS-SEALED |
封装代码 | DIP |
封装等效代码 | DIP16,.3 |
封装形状 | RECTANGULAR |
封装形式 | IN-LINE |
峰值回流温度(摄氏度) | 240 |
电源 | 5 V |
Prop。Delay @ Nom-Sup | 12 ns |
传播延迟(tpd) | 12 ns |
认证状态 | Not Qualified |
筛选级别 | MIL-STD-883 |
座面最大高度 | 5.08 mm |
最大供电电压 (Vsup) | 5.5 V |
最小供电电压 (Vsup) | 4.5 V |
标称供电电压 (Vsup) | 5 V |
表面贴装 | NO |
技术 | CMOS |
温度等级 | MILITARY |
端子面层 | Tin/Lead (Sn/Pb) |
端子形式 | THROUGH-HOLE |
端子节距 | 2.54 mm |
端子位置 | DUAL |
处于峰值回流温度下的最长时间 | NOT SPECIFIED |
宽度 | 7.62 mm |
Base Number Matches | 1 |
5962-9220202MEA | IDT54FCT139ATDB | 5962-9220206MEA | IDT54FCT139CTDB | IDT54FCT139TDB | IDT54FCT139CTLB | IDT54FCT139TLB | IDT54FCT139CTEB | IDT54FCT139TEB | IDT54FCT139ATLB | |
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描述 | CDIP-16, Tube | Decoder/Driver, FCT Series, Inverted Output, CMOS, CDIP16, CERAMIC, DIP-16 | CDIP-16, Tube | Decoder/Driver, FCT Series, Inverted Output, CMOS, CDIP16, CERAMIC, DIP-16 | Decoder/Driver, FCT Series, Inverted Output, CMOS, CDIP16, CERAMIC, DIP-16 | Decoder/Driver, FCT Series, Inverted Output, CMOS, CQCC20, LCC-20 | Decoder/Driver, FCT Series, Inverted Output, CMOS, CQCC20, LCC-20 | Decoder/Driver, FCT Series, Inverted Output, CMOS, CDFP16, CERAMIC, DFP-16 | Decoder/Driver, FCT Series, Inverted Output, CMOS, CDFP16, CERPACK-16 | Decoder/Driver, FCT Series, Inverted Output, CMOS, CQCC20, LCC-20 |
是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
零件包装代码 | CDIP | DIP | CDIP | DIP | DIP | QLCC | QLCC | DFP | DFP | QLCC |
包装说明 | DIP, DIP16,.3 | DIP, DIP16,.3 | DIP, DIP16,.3 | DIP, DIP16,.3 | DIP, DIP16,.3 | QCCN, LCC20,.35SQ | QCCN, LCC20,.35SQ | DFP, FL16,.3 | DFP, FL16,.3 | QCCN, LCC20,.35SQ |
针数 | 16 | 16 | 16 | 16 | 16 | 20 | 20 | 16 | 16 | 20 |
Reach Compliance Code | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | _compli |
ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
系列 | FCT | FCT | FCT | FCT | FCT | FCT | FCT | FCT | FCT | FCT |
JESD-30 代码 | R-GDIP-T16 | R-GDIP-T16 | R-GDIP-T16 | R-GDIP-T16 | R-GDIP-T16 | S-CQCC-N20 | S-CQCC-N20 | R-GDFP-F16 | R-GDFP-F16 | S-CQCC-N20 |
JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
负载电容(CL) | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF |
逻辑集成电路类型 | OTHER DECODER/DRIVER | OTHER DECODER/DRIVER | OTHER DECODER/DRIVER | OTHER DECODER/DRIVER | OTHER DECODER/DRIVER | OTHER DECODER/DRIVER | OTHER DECODER/DRIVER | OTHER DECODER/DRIVER | OTHER DECODER/DRIVER | OTHER DECODER/DRIVER |
最大I(ol) | 0.032 A | 0.032 A | 0.032 A | 0.032 A | 0.032 A | 0.032 A | 0.032 A | 0.032 A | 0.032 A | 0.032 A |
功能数量 | 2 | 2 | 2 | 2 | 2 | 2 | 2 | 2 | 2 | 2 |
端子数量 | 16 | 16 | 16 | 16 | 16 | 20 | 20 | 16 | 16 | 20 |
最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
最低工作温度 | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C |
输出极性 | INVERTED | INVERTED | INVERTED | INVERTED | INVERTED | INVERTED | INVERTED | INVERTED | INVERTED | INVERTED |
封装主体材料 | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED |
封装代码 | DIP | DIP | DIP | DIP | DIP | QCCN | QCCN | DFP | DFP | QCCN |
封装等效代码 | DIP16,.3 | DIP16,.3 | DIP16,.3 | DIP16,.3 | DIP16,.3 | LCC20,.35SQ | LCC20,.35SQ | FL16,.3 | FL16,.3 | LCC20,.35SQ |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | SQUARE | SQUARE | RECTANGULAR | RECTANGULAR | SQUARE |
封装形式 | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | CHIP CARRIER | CHIP CARRIER | FLATPACK | FLATPACK | CHIP CARRIER |
峰值回流温度(摄氏度) | 240 | 225 | 240 | NOT SPECIFIED | 225 | NOT SPECIFIED | 225 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
电源 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
传播延迟(tpd) | 12 ns | 7.8 ns | 6.2 ns | 6.2 ns | 12 ns | 6.2 ns | 12 ns | 6.2 ns | 12 ns | 7.8 ns |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
筛选级别 | MIL-STD-883 | MIL-STD-883 Class B | MIL-STD-883 | MIL-STD-883 Class B | MIL-STD-883 Class B | MIL-STD-883 Class B | MIL-STD-883 Class B | MIL-STD-883 Class B | MIL-STD-883 Class B | MIL-STD-883 Class B |
最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
表面贴装 | NO | NO | NO | NO | NO | YES | YES | YES | YES | YES |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY |
端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
端子形式 | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | NO LEAD | NO LEAD | FLAT | FLAT | NO LEAD |
端子节距 | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm |
端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | QUAD | QUAD | DUAL | DUAL | QUAD |
处于峰值回流温度下的最长时间 | NOT SPECIFIED | 20 | NOT SPECIFIED | NOT SPECIFIED | 20 | NOT SPECIFIED | 30 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
长度 | 20.066 mm | 20.066 mm | 20.066 mm | 20.066 mm | 20.066 mm | 8.89 mm | 8.89 mm | - | - | 8.89 mm |
Prop。Delay @ Nom-Sup | 12 ns | 7.8 ns | 6.2 ns | 6.2 ns | 12 ns | 6.2 ns | 12 ns | 6.2 ns | 12 ns | - |
座面最大高度 | 5.08 mm | 5.08 mm | 5.08 mm | 5.08 mm | 5.08 mm | 2.54 mm | 2.54 mm | - | - | 2.54 mm |
宽度 | 7.62 mm | 7.62 mm | 7.62 mm | 7.62 mm | 7.62 mm | 8.89 mm | 8.89 mm | - | - | 8.89 mm |
Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 | - | - | - | - |
输入调节 | - | STANDARD | - | STANDARD | STANDARD | STANDARD | STANDARD | - | - | STANDARD |
厂商名称 | - | - | - | - | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) |
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