Multiplier Accumulator/Summer, 12-Bit, CMOS, CDIP64, 0.900 INCH, CAVITY DOWN, HERMETIC SEALED, SIDE BRAZED, DIP-64
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 零件包装代码 | DIP |
| 包装说明 | DIP, |
| 针数 | 64 |
| Reach Compliance Code | unknown |
| ECCN代码 | 3A001.A.2.C |
| 其他特性 | 2 X 12 BIT DATA INPUT BUS; ICC SPECIFIED @ 5MHZ |
| 边界扫描 | NO |
| 外部数据总线宽度 | 12 |
| JESD-30 代码 | R-CDIP-T64 |
| JESD-609代码 | e4 |
| 长度 | 81.28 mm |
| 低功率模式 | NO |
| 湿度敏感等级 | 3 |
| 端子数量 | 64 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 输出数据总线宽度 | 27 |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | DIP |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 认证状态 | Not Qualified |
| 筛选级别 | MIL-STD-883 |
| 座面最大高度 | 3.81 mm |
| 最大压摆率 | 25 mA |
| 最大供电电压 | 5.5 V |
| 最小供电电压 | 4.5 V |
| 标称供电电压 | 5 V |
| 表面贴装 | NO |
| 技术 | CMOS |
| 温度等级 | MILITARY |
| 端子面层 | GOLD |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| 宽度 | 22.86 mm |
| uPs/uCs/外围集成电路类型 | DSP PERIPHERAL, MULTIPLIER ACCUMULATOR/SUMMER |
| Base Number Matches | 1 |
| 5962-9099603MXC | 5962-9099602MXC | 5962-9099603MYC | 5962-9099602MYC | 5962-9099604MYC | 5962-9099604MXC | 5962-9099602MUC | 5962-9099604MUC | 5962-9099603MUC | |
|---|---|---|---|---|---|---|---|---|---|
| 描述 | Multiplier Accumulator/Summer, 12-Bit, CMOS, CDIP64, 0.900 INCH, CAVITY DOWN, HERMETIC SEALED, SIDE BRAZED, DIP-64 | Multiplier Accumulator/Summer, 12-Bit, CMOS, CDIP64, 0.900 INCH, CAVITY DOWN, HERMETIC SEALED, SIDE BRAZED, DIP-64 | Multiplier Accumulator/Summer, 12-Bit, CMOS, CQCC68, 0.950 X 0.950 INCH, CERAMIC, LCC-68 | Multiplier Accumulator/Summer, 12-Bit, CMOS, CQCC68, 0.950 X 0.950 INCH, CERAMIC, LCC-68 | Multiplier Accumulator/Summer, 12-Bit, CMOS, CQCC68, 0.950 X 0.950 INCH, CERAMIC, LCC-68 | Multiplier Accumulator/Summer, 12-Bit, CMOS, CDIP64, 0.900 INCH, CAVITY DOWN, HERMETIC SEALED, SIDE BRAZED, DIP-64 | Multiplier Accumulator/Summer, 12-Bit, CMOS, CPGA68, CAVITY-DOWN, CERAMIC, PGA-68 | Multiplier Accumulator/Summer, 12-Bit, CMOS, CPGA68, CAVITY-DOWN, CERAMIC, PGA-68 | Multiplier Accumulator/Summer, 12-Bit, CMOS, CPGA68, CAVITY-DOWN, CERAMIC, PGA-68 |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 零件包装代码 | DIP | DIP | LCC | LCC | LCC | DIP | PGA | PGA | PGA |
| 包装说明 | DIP, | DIP, | QCCN, | QCCN, | QCCN, | DIP, | PGA, | PGA, | PGA, |
| 针数 | 64 | 64 | 68 | 68 | 68 | 64 | 68 | 68 | 68 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
| ECCN代码 | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C |
| 其他特性 | 2 X 12 BIT DATA INPUT BUS; ICC SPECIFIED @ 5MHZ | 2 X 12 BIT DATA INPUT BUS; ICC SPECIFIED @ 5MHZ | 2 X 12 BIT DATA INPUT BUS; ICC SPECIFIED @ 5MHZ | 2 X 12 BIT DATA INPUT BUS; ICC SPECIFIED @ 5MHZ | 2 X 12 BIT DATA INPUT BUS; ICC SPECIFIED @ 5MHZ | 2 X 12 BIT DATA INPUT BUS; ICC SPECIFIED @ 5MHZ | 2 X 12 BIT DATA INPUT BUS; ICC SPECIFIED @ 5MHZ | 2 X 12 BIT DATA INPUT BUS; ICC SPECIFIED @ 5MHZ | 2 X 12 BIT DATA INPUT BUS; ICC SPECIFIED @ 5MHZ |
| 边界扫描 | NO | NO | NO | NO | NO | NO | NO | NO | NO |
| 外部数据总线宽度 | 12 | 12 | 12 | 12 | 12 | 12 | 12 | 12 | 12 |
| JESD-30 代码 | R-CDIP-T64 | R-CDIP-T64 | S-CQCC-N68 | S-CQCC-N68 | S-CQCC-N68 | R-CDIP-T64 | S-CPGA-P68 | S-CPGA-P68 | S-CPGA-P68 |
| JESD-609代码 | e4 | e4 | e4 | e4 | e4 | e4 | e4 | e4 | e4 |
| 长度 | 81.28 mm | 81.28 mm | 24.1935 mm | 24.1935 mm | 24.1935 mm | 81.28 mm | 29.4386 mm | 29.4386 mm | 29.4386 mm |
| 低功率模式 | NO | NO | NO | NO | NO | NO | NO | NO | NO |
| 湿度敏感等级 | 3 | 3 | 3 | 3 | 3 | 3 | 3 | 3 | 3 |
| 端子数量 | 64 | 64 | 68 | 68 | 68 | 64 | 68 | 68 | 68 |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C |
| 输出数据总线宽度 | 27 | 27 | 27 | 27 | 27 | 27 | 27 | 27 | 27 |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | DIP | DIP | QCCN | QCCN | QCCN | DIP | PGA | PGA | PGA |
| 封装形状 | RECTANGULAR | RECTANGULAR | SQUARE | SQUARE | SQUARE | RECTANGULAR | SQUARE | SQUARE | SQUARE |
| 封装形式 | IN-LINE | IN-LINE | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER | IN-LINE | GRID ARRAY | GRID ARRAY | GRID ARRAY |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 筛选级别 | MIL-STD-883 | MIL-STD-883 | MIL-STD-883 | MIL-STD-883 | MIL-STD-883 | MIL-STD-883 | MIL-STD-883 | MIL-STD-883 | MIL-STD-883 |
| 座面最大高度 | 3.81 mm | 3.81 mm | 3.048 mm | 3.048 mm | 3.048 mm | 3.81 mm | 3.81 mm | 3.81 mm | 3.81 mm |
| 最大压摆率 | 25 mA | 25 mA | 25 mA | 25 mA | 25 mA | 25 mA | 25 mA | 25 mA | 25 mA |
| 最大供电电压 | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| 标称供电电压 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | NO | NO | YES | YES | YES | NO | NO | NO | NO |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY |
| 端子面层 | GOLD | GOLD | GOLD | GOLD | GOLD | GOLD | GOLD | GOLD | GOLD |
| 端子形式 | THROUGH-HOLE | THROUGH-HOLE | NO LEAD | NO LEAD | NO LEAD | THROUGH-HOLE | PIN/PEG | PIN/PEG | PIN/PEG |
| 端子节距 | 2.54 mm | 2.54 mm | 1.27 mm | 1.27 mm | 1.27 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm |
| 端子位置 | DUAL | DUAL | QUAD | QUAD | QUAD | DUAL | PERPENDICULAR | PERPENDICULAR | PERPENDICULAR |
| 宽度 | 22.86 mm | 22.86 mm | 24.1935 mm | 24.1935 mm | 24.1935 mm | 22.86 mm | 29.4386 mm | 29.4386 mm | 29.4386 mm |
| uPs/uCs/外围集成电路类型 | DSP PERIPHERAL, MULTIPLIER ACCUMULATOR/SUMMER | DSP PERIPHERAL, MULTIPLIER ACCUMULATOR/SUMMER | DSP PERIPHERAL, MULTIPLIER ACCUMULATOR/SUMMER | DSP PERIPHERAL, MULTIPLIER ACCUMULATOR/SUMMER | DSP PERIPHERAL, MULTIPLIER ACCUMULATOR/SUMMER | DSP PERIPHERAL, MULTIPLIER ACCUMULATOR/SUMMER | DSP PERIPHERAL, MULTIPLIER ACCUMULATOR/SUMMER | DSP PERIPHERAL, MULTIPLIER ACCUMULATOR/SUMMER | DSP PERIPHERAL, MULTIPLIER ACCUMULATOR/SUMMER |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 厂商名称 | - | - | LOGIC Devices | - | - | LOGIC Devices | LOGIC Devices | LOGIC Devices | LOGIC Devices |
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