IC 8-BIT, OTPROM, MICROCONTROLLER, CDIP28, 0.600 INCH, DIP-28, Microcontroller
| 参数名称 | 属性值 |
| 零件包装代码 | DIP |
| 包装说明 | WDIP, |
| 针数 | 28 |
| Reach Compliance Code | unknown |
| ECCN代码 | 3A001.A.2.C |
| 具有ADC | YES |
| 地址总线宽度 | 11 |
| 位大小 | 8 |
| 最大时钟频率 | 16 MHz |
| DAC 通道 | NO |
| DMA 通道 | NO |
| 外部数据总线宽度 | 8 |
| JESD-30 代码 | R-GDIP-T28 |
| JESD-609代码 | e0 |
| I/O 线路数量 | 21 |
| 端子数量 | 28 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| PWM 通道 | YES |
| 封装主体材料 | CERAMIC, GLASS-SEALED |
| 封装代码 | WDIP |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE, WINDOW |
| 认证状态 | Not Qualified |
| ROM可编程性 | OTPROM |
| 筛选级别 | MIL-STD-883 |
| 座面最大高度 | 5.8928 mm |
| 最大压摆率 | 24 mA |
| 最大供电电压 | 5.5 V |
| 最小供电电压 | 4.5 V |
| 表面贴装 | NO |
| 技术 | CMOS |
| 温度等级 | MILITARY |
| 端子面层 | TIN LEAD |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| 宽度 | 15.24 mm |
| uPs/uCs/外围集成电路类型 | MICROCONTROLLER |
| Base Number Matches | 1 |
| 5962-9157702MXA | 5962-9157701MXA | 87C752-16/BXA | 87C752-16/BXAOT | 87C752/BXA | 87C752/BXAOT | |
|---|---|---|---|---|---|---|
| 描述 | IC 8-BIT, OTPROM, MICROCONTROLLER, CDIP28, 0.600 INCH, DIP-28, Microcontroller | IC 8-BIT, OTPROM, MICROCONTROLLER, CDIP28, 0.600 INCH, DIP-28, Microcontroller | IC 8-BIT, OTPROM, MICROCONTROLLER, CDIP28, 0.600 INCH, DIP-28, Microcontroller | IC 8-BIT, OTPROM, MICROCONTROLLER, CDIP28, 0.600 INCH, DIP-28, Microcontroller | IC 8-BIT, OTPROM, MICROCONTROLLER, CDIP28, 0.600 INCH, DIP-28, Microcontroller | IC 8-BIT, OTPROM, MICROCONTROLLER, CDIP28, 0.600 INCH, DIP-28, Microcontroller |
| 零件包装代码 | DIP | DIP | DIP | DIP | DIP | DIP |
| 包装说明 | WDIP, | WDIP, | WDIP, | DIP, | WDIP, | DIP, |
| 针数 | 28 | 28 | 28 | 28 | 28 | 28 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown |
| ECCN代码 | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C |
| 具有ADC | YES | YES | YES | YES | YES | YES |
| 地址总线宽度 | 11 | 11 | 11 | 11 | 11 | 11 |
| 位大小 | 8 | 8 | 8 | 8 | 8 | 8 |
| 最大时钟频率 | 16 MHz | 12 MHz | 16 MHz | 16 MHz | 12 MHz | 12 MHz |
| DAC 通道 | NO | NO | NO | NO | NO | NO |
| DMA 通道 | NO | NO | NO | NO | NO | NO |
| 外部数据总线宽度 | 8 | 8 | 8 | 8 | 8 | 8 |
| JESD-30 代码 | R-GDIP-T28 | R-GDIP-T28 | R-GDIP-T28 | R-GDIP-T28 | R-GDIP-T28 | R-GDIP-T28 |
| I/O 线路数量 | 21 | 21 | 21 | 21 | 21 | 21 |
| 端子数量 | 28 | 28 | 28 | 28 | 28 | 28 |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C |
| PWM 通道 | YES | YES | YES | YES | YES | YES |
| 封装主体材料 | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED |
| 封装代码 | WDIP | WDIP | WDIP | DIP | WDIP | DIP |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | IN-LINE, WINDOW | IN-LINE, WINDOW | IN-LINE, WINDOW | IN-LINE | IN-LINE, WINDOW | IN-LINE |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| ROM可编程性 | OTPROM | OTPROM | OTPROM | OTPROM | OTPROM | OTPROM |
| 座面最大高度 | 5.8928 mm | 5.8928 mm | 5.8928 mm | 5.8928 mm | 5.8928 mm | 5.8928 mm |
| 最大压摆率 | 24 mA | 21 mA | 24 mA | 24 mA | 21 mA | 21 mA |
| 最大供电电压 | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| 表面贴装 | NO | NO | NO | NO | NO | NO |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY |
| 端子形式 | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
| 端子节距 | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| 宽度 | 15.24 mm | 15.24 mm | 15.24 mm | 15.24 mm | 15.24 mm | 15.24 mm |
| uPs/uCs/外围集成电路类型 | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | - |
| 厂商名称 | - | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | - | NXP(恩智浦) |
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