256k EEPROM (32-kword x 8-bit) Ready/Busy and RES function (HN58V257A)
HN58V256A | HN58V256AFP-12 | HN58V256AT-12 | HN58V257AT-12 | |
---|---|---|---|---|
描述 | 256k EEPROM (32-kword x 8-bit) Ready/Busy and RES function (HN58V257A) | 256k EEPROM (32-kword x 8-bit) Ready/Busy and RES function (HN58V257A) | 256k EEPROM (32-kword x 8-bit) Ready/Busy and RES function (HN58V257A) | 256k EEPROM (32-kword x 8-bit) Ready/Busy and RES function (HN58V257A) |
是否Rohs认证 | - | 不符合 | 不符合 | 不符合 |
厂商名称 | - | Hitachi (Renesas ) | Hitachi (Renesas ) | Hitachi (Renesas ) |
零件包装代码 | - | SOIC | TSOP | TSOP |
包装说明 | - | SOP, SOP28,.4 | TSOP1, TSSOP28,.53,22 | TSOP1, TSSOP32,.56,20 |
针数 | - | 28 | 28 | 32 |
Reach Compliance Code | - | unknow | unknow | unknown |
ECCN代码 | - | EAR99 | EAR99 | EAR99 |
最长访问时间 | - | 120 ns | 120 ns | 120 ns |
其他特性 | - | 100000 ERASE/WRITE CYCLES; 10 YEARS DATA RETENTION; SOFTWARE DATA PROTECTION; 64 BYTE PAGE WRITE | 100000 ERASE/WRITE CYCLES; 10 YEARS DATA RETENTION; SOFTWARE DATA PROTECTION; 64 BYTE PAGE WRITE | 100000 ERASE/WRITE CYCLES; 10 YEARS DATA RETENTION; SOFTWARE DATA PROTECTION; 64 BYTE PAGE WRITE |
命令用户界面 | - | NO | NO | NO |
数据轮询 | - | YES | YES | YES |
数据保留时间-最小值 | - | 10 | 10 | 10 |
JESD-30 代码 | - | R-PDSO-G28 | R-PDSO-G28 | R-PDSO-G32 |
长度 | - | 18.3 mm | 11.8 mm | 12.4 mm |
内存密度 | - | 262144 bi | 262144 bi | 262144 bit |
内存集成电路类型 | - | EEPROM | EEPROM | EEPROM |
内存宽度 | - | 8 | 8 | 8 |
功能数量 | - | 1 | 1 | 1 |
端子数量 | - | 28 | 28 | 32 |
字数 | - | 32768 words | 32768 words | 32768 words |
字数代码 | - | 32000 | 32000 | 32000 |
工作模式 | - | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
最高工作温度 | - | 70 °C | 70 °C | 70 °C |
组织 | - | 32KX8 | 32KX8 | 32KX8 |
封装主体材料 | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | - | SOP | TSOP1 | TSOP1 |
封装等效代码 | - | SOP28,.4 | TSSOP28,.53,22 | TSSOP32,.56,20 |
封装形状 | - | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | - | SMALL OUTLINE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE |
页面大小 | - | 64 words | 64 words | 64 words |
并行/串行 | - | PARALLEL | PARALLEL | PARALLEL |
电源 | - | 3/5 V | 3/5 V | 3/5 V |
编程电压 | - | 3 V | 3 V | 3 V |
认证状态 | - | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | - | 2.5 mm | 1.2 mm | 1.2 mm |
最大待机电流 | - | 0.00002 A | 0.00002 A | 0.00002 A |
最大压摆率 | - | 0.03 mA | 0.03 mA | 0.03 mA |
最大供电电压 (Vsup) | - | 5.5 V | 5.5 V | 5.5 V |
最小供电电压 (Vsup) | - | 2.7 V | 2.7 V | 2.7 V |
标称供电电压 (Vsup) | - | 3 V | 3 V | 3 V |
表面贴装 | - | YES | YES | YES |
技术 | - | CMOS | CMOS | CMOS |
温度等级 | - | COMMERCIAL | COMMERCIAL | COMMERCIAL |
端子形式 | - | GULL WING | GULL WING | GULL WING |
端子节距 | - | 1.27 mm | 0.55 mm | 0.5 mm |
端子位置 | - | DUAL | DUAL | DUAL |
切换位 | - | YES | YES | YES |
宽度 | - | 8.4 mm | 8 mm | 8 mm |
最长写入周期时间 (tWC) | - | 10 ms | 10 ms | 10 ms |
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