SINGLE-CHIP 4-BIT CMOS MICRCOMPUTERl
| M34225M1 | M34225M2-XXXSP | M34225M1-XXXSP | M34225M2-XXXFP | M34225M1-XXXFP | |
|---|---|---|---|---|---|
| 描述 | SINGLE-CHIP 4-BIT CMOS MICRCOMPUTERl | SINGLE-CHIP 4-BIT CMOS MICRCOMPUTERl | SINGLE-CHIP 4-BIT CMOS MICRCOMPUTERl | SINGLE-CHIP 4-BIT CMOS MICRCOMPUTERl | SINGLE-CHIP 4-BIT CMOS MICRCOMPUTERl |
| 是否Rohs认证 | - | 不符合 | 不符合 | 不符合 | 不符合 |
| 厂商名称 | - | Mitsubishi(日本三菱) | Mitsubishi(日本三菱) | Mitsubishi(日本三菱) | Mitsubishi(日本三菱) |
| 包装说明 | - | SDIP, SDIP30,.4 | SDIP, SDIP30,.4 | SSOP, SOP36,.47,32 | SSOP, SOP36,.47,32 |
| Reach Compliance Code | - | unknow | unknow | unknow | unknow |
| 位大小 | - | 4 | 4 | 4 | 4 |
| JESD-30 代码 | - | R-PDIP-T30 | R-PDIP-T30 | R-PDSO-G36 | R-PDSO-G36 |
| JESD-609代码 | - | e0 | e0 | e0 | e0 |
| 端子数量 | - | 30 | 30 | 36 | 36 |
| 最高工作温度 | - | 85 °C | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | - | -20 °C | -20 °C | -20 °C | -20 °C |
| 封装主体材料 | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | - | SDIP | SDIP | SSOP | SSOP |
| 封装等效代码 | - | SDIP30,.4 | SDIP30,.4 | SOP36,.47,32 | SOP36,.47,32 |
| 封装形状 | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | - | IN-LINE, SHRINK PITCH | IN-LINE, SHRINK PITCH | SMALL OUTLINE, SHRINK PITCH | SMALL OUTLINE, SHRINK PITCH |
| 电源 | - | 5 V | 5 V | 5 V | 5 V |
| 认证状态 | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| RAM（字节） | - | 64 | 32 | 64 | 32 |
| ROM（单词） | - | 2048 | 1024 | 2048 | 1024 |
| ROM可编程性 | - | MROM | MROM | MROM | MROM |
| 速度 | - | 4 MHz | 4 MHz | 4 MHz | 4 MHz |
| 最大压摆率 | - | 7.5 mA | 7.5 mA | 7.5 mA | 7.5 mA |
| 标称供电电压 | - | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | - | NO | NO | YES | YES |
| 技术 | - | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | - | OTHER | OTHER | OTHER | OTHER |
| 端子面层 | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | - | THROUGH-HOLE | THROUGH-HOLE | GULL WING | GULL WING |
| 端子节距 | - | 1.78 mm | 1.78 mm | 0.8 mm | 0.8 mm |
| 端子位置 | - | DUAL | DUAL | DUAL | DUAL |
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嵌入式系统
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