SINGLE-CHIP 4-BIT CMOS MICRCOMPUTERl
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | Mitsubishi(日本三菱) |
| 包装说明 | SDIP, SDIP30,.4 |
| Reach Compliance Code | unknow |
| 位大小 | 4 |
| JESD-30 代码 | R-PDIP-T30 |
| JESD-609代码 | e0 |
| 端子数量 | 30 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -20 °C |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | SDIP |
| 封装等效代码 | SDIP30,.4 |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE, SHRINK PITCH |
| 电源 | 5 V |
| 认证状态 | Not Qualified |
| RAM(字节) | 64 |
| ROM(单词) | 2048 |
| ROM可编程性 | MROM |
| 速度 | 4 MHz |
| 最大压摆率 | 7.5 mA |
| 标称供电电压 | 5 V |
| 表面贴装 | NO |
| 技术 | CMOS |
| 温度等级 | OTHER |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 1.78 mm |
| 端子位置 | DUAL |
| Base Number Matches | 1 |
| M34225M2-XXXSP | M34225M1-XXXSP | M34225M2-XXXFP | M34225M1 | M34225M1-XXXFP | |
|---|---|---|---|---|---|
| 描述 | SINGLE-CHIP 4-BIT CMOS MICRCOMPUTERl | SINGLE-CHIP 4-BIT CMOS MICRCOMPUTERl | SINGLE-CHIP 4-BIT CMOS MICRCOMPUTERl | SINGLE-CHIP 4-BIT CMOS MICRCOMPUTERl | SINGLE-CHIP 4-BIT CMOS MICRCOMPUTERl |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | - | 不符合 |
| 厂商名称 | Mitsubishi(日本三菱) | Mitsubishi(日本三菱) | Mitsubishi(日本三菱) | - | Mitsubishi(日本三菱) |
| 包装说明 | SDIP, SDIP30,.4 | SDIP, SDIP30,.4 | SSOP, SOP36,.47,32 | - | SSOP, SOP36,.47,32 |
| Reach Compliance Code | unknow | unknow | unknow | - | unknow |
| 位大小 | 4 | 4 | 4 | - | 4 |
| JESD-30 代码 | R-PDIP-T30 | R-PDIP-T30 | R-PDSO-G36 | - | R-PDSO-G36 |
| JESD-609代码 | e0 | e0 | e0 | - | e0 |
| 端子数量 | 30 | 30 | 36 | - | 36 |
| 最高工作温度 | 85 °C | 85 °C | 85 °C | - | 85 °C |
| 最低工作温度 | -20 °C | -20 °C | -20 °C | - | -20 °C |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | - | PLASTIC/EPOXY |
| 封装代码 | SDIP | SDIP | SSOP | - | SSOP |
| 封装等效代码 | SDIP30,.4 | SDIP30,.4 | SOP36,.47,32 | - | SOP36,.47,32 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | - | RECTANGULAR |
| 封装形式 | IN-LINE, SHRINK PITCH | IN-LINE, SHRINK PITCH | SMALL OUTLINE, SHRINK PITCH | - | SMALL OUTLINE, SHRINK PITCH |
| 电源 | 5 V | 5 V | 5 V | - | 5 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | - | Not Qualified |
| RAM(字节) | 64 | 32 | 64 | - | 32 |
| ROM(单词) | 2048 | 1024 | 2048 | - | 1024 |
| ROM可编程性 | MROM | MROM | MROM | - | MROM |
| 速度 | 4 MHz | 4 MHz | 4 MHz | - | 4 MHz |
| 最大压摆率 | 7.5 mA | 7.5 mA | 7.5 mA | - | 7.5 mA |
| 标称供电电压 | 5 V | 5 V | 5 V | - | 5 V |
| 表面贴装 | NO | NO | YES | - | YES |
| 技术 | CMOS | CMOS | CMOS | - | CMOS |
| 温度等级 | OTHER | OTHER | OTHER | - | OTHER |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE | THROUGH-HOLE | GULL WING | - | GULL WING |
| 端子节距 | 1.78 mm | 1.78 mm | 0.8 mm | - | 0.8 mm |
| 端子位置 | DUAL | DUAL | DUAL | - | DUAL |
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