HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : HE6518
Issued Date : 1993.02.24
Revised Date : 2002.02.20
Page No. : 1/4
HSD471A
NPN EPITAXIAL PLANAR TRANSISTOR
Description
The HSD471A is designed for use in drive and output stage of
frequency amplifier applications.
Absolute Maximum Ratings
TO-92
•
Maximum Temperatures
Storage Temperature ............................................................................................ -55 ~ +150
°C
Junction Temperature ...................................................................................... 150
°C
Maximum
•
Maximum Power Dissipation
Total Power Dissipation (Ta=25°C) ................................................................................ 800 mW
•
Maximum Voltages and Currents (Ta=25°C)
VCBO Collector to Base Voltage ......................................................................................... 40 V
VCEO Collector to Emitter Voltage ...................................................................................... 30 V
VEBO Emitter to Base Voltage .............................................................................................. 5 V
IC Collector Current............................................................................................................... 1 A
Characteristics
(Ta=25°C)
Symbol
BVCBO
BVCEO
BVEBO
ICBO
*VCE(sat)
*VBE(sat)
*hFE
fT
Cob
Min.
40
30
5
-
-
-
70
-
-
Typ.
-
-
-
-
-
-
-
130
16
Max.
-
-
-
100
0.5
1.2
400
-
-
Unit
V
V
V
nA
V
V
MHz
pF
Test Conditions
IC=100uA, IE=0
IC=10mA, IB=0
IE=100uA, IC=0
VCB=30V, IE=0
IC=1A, IB=100mA
IC=1A, IB=100mA
VCE=1V, IC=100mA
VCE=6V, IC=10mA
VCB=6V, f=1MHz, IE=0
*Pulse Test: Pulse Width
≤380us,
Duty Cycle≤2%
Classification of hFE
Rank
Range
O
70-140
Y
120-240
GR
200-400
HSD471A
HSMC Product Specification
HI-SINCERITY
MICROELECTRONICS CORP.
Characteristics Curve
Current Gain & Collector Current
1000
1000
V
CE(s at)
@ I
C
=10I
B
Spec. No. : HE6518
Issued Date : 1993.02.24
Revised Date : 2002.02.20
Page No. : 2/4
Saturation Voltage & Collector Current
125 C
o
Saturation Voltage (mV)
hFE
100
75 C
o
25 C
75 C
o
o
hFE @ V
CE
=1V
125 C
o
25 C
o
100
1
10
100
1000
10
1
10
100
1000
Collector Current-I
C
(mA)
Collector Current-I
C
(mA)
Saturation Voltage & Collector Current
1000
o
Capacitance & Reverse-Biased Voltage
100
25 C
Saturation Voltage (mV)
125 C
o
75 C
o
Capacitance (pF)
10
Cob
V
BE(sat)
@ I
C
=10I
B
100
1
10
100
1000
1
0.1
1
10
100
1000
Collector Current-I
C
(mA)
Reverse Biased Voltage (V)
Cutoff Frequency & Ic
1000
10000
P
T
=1ms
Safe Operating Area
Cutoff Frequency (MHz)
..
.
Collector Current-I
C
(mA)
1000
P
T
=100ms
P
T
=1s
V
CE
=6V
100
100
10
10
1
10
100
1000
1
1
10
100
Collector Current (mA)
Forward Biased Voltage-V
CE
(V)
HSD471A
HSMC Product Specification
HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : HE6518
Issued Date : 1993.02.24
Revised Date : 2002.02.20
Page No. : 3/4
IR Reflow Profile
260
240
220
200
250
10+/-2 sec
300
Temperature Profile for Dip Soldering
10+/-2 sec
Temperature( C)
Temperature( C)
180
160
140
120
100
80
60
40
20
0
0
50
100
150
200
250
300
150+/-30
40+/-20 sec
o
o
200
150
100
120+/-20 sec
50
0
0
50
100
150
200
250
300
350
Time(sec)
Time(sec)
Power Temperature Derating
900
800
PD , Power Dissipation (mW)
700
600
500
400
300
200
100
0
0
20
40
60
80
100
o
120
140
160
Ta , Case Temperature ( C)
HSD471A
HSMC Product Specification
HI-SINCERITY
MICROELECTRONICS CORP.
TO-92 Dimension
A
B
1
2
3
Date Code
Spec. No. : HE6518
Issued Date : 1993.02.24
Revised Date : 2002.02.20
Page No. : 4/4
α
2
Marking:
H
SD
4 7 1 A
Rank
Control Code
α
3
C
Style: Pin 1.Emitter 2.Collector 3.Base
D
H
I
E
F
G
α
1
3-Lead TO-92 Plastic Package
HSMC Package Code: A
*: Typical
DIM
A
B
C
D
E
F
Inches
Min.
Max.
0.1704 0.1902
0.1704 0.1902
0.5000
-
0.0142 0.0220
-
*0.0500
0.1323 0.1480
Millimeters
Min.
Max.
4.33
4.83
4.33
4.83
12.70
-
0.36
0.56
-
*1.27
3.36
3.76
DIM
G
H
I
α1
α2
α3
Inches
Min.
Max.
0.0142 0.0220
-
*0.1000
-
*0.0500
-
*5°
-
*2°
-
*2°
Millimeters
Min.
Max.
0.36
0.56
-
*2.54
-
*1.27
-
*5°
-
*2°
-
*2°
Notes:
1.Dimension and tolerance based on our Spec. dated Apr. 25,1996.
2.Controlling dimension: millimeters.
3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
4.If there is any question with packing specification or packing method, please contact your local HSMC sales office.
Material:
•
Lead: 42 Alloy; solder plating
•
Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0
Important Notice:
•
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.
•
HSMC reserves the right to make changes to its products without notice.
•
HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
•
HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
Head Office And Factory:
•
Head Office
(Hi-Sincerity Microelectronics Corp.): 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C.
Tel: 886-2-25212056 Fax: 886-2-25632712, 25368454
•
Factory 1:
No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C
Tel: 886-3-5983621~5 Fax: 886-3-5982931
HSD471A
HSMC Product Specification
FPGA/CPLD
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