SDRAM Unbuffered Module 168pin Unbuffered Module based on 512Mb B-die 62/72-bit Non ECC/ECC
M366S3354BTS | M374S6553BTS-C7A | M374S2953BTS-C7A | M366S6553BTS-C7A | M366S3354BTS-C7A | M366S2953BTS-C7A | |
---|---|---|---|---|---|---|
描述 | SDRAM Unbuffered Module 168pin Unbuffered Module based on 512Mb B-die 62/72-bit Non ECC/ECC | SDRAM Unbuffered Module 168pin Unbuffered Module based on 512Mb B-die 62/72-bit Non ECC/ECC | SDRAM Unbuffered Module 168pin Unbuffered Module based on 512Mb B-die 62/72-bit Non ECC/ECC | SDRAM Unbuffered Module 168pin Unbuffered Module based on 512Mb B-die 62/72-bit Non ECC/ECC | SDRAM Unbuffered Module 168pin Unbuffered Module based on 512Mb B-die 62/72-bit Non ECC/ECC | SDRAM Unbuffered Module 168pin Unbuffered Module based on 512Mb B-die 62/72-bit Non ECC/ECC |
是否无铅 | - | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 |
是否Rohs认证 | - | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
零件包装代码 | - | DIMM | DIMM | DIMM | DIMM | DIMM |
包装说明 | - | DIMM, | DIMM, DIMM168 | DIMM, DIMM168 | DIMM, DIMM168 | DIMM, DIMM168 |
针数 | - | 168 | 168 | 168 | 168 | 168 |
Reach Compliance Code | - | compli | compli | compliant | compli | compli |
ECCN代码 | - | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
访问模式 | - | FOUR BANK PAGE BURST | FOUR BANK PAGE BURST | FOUR BANK PAGE BURST | FOUR BANK PAGE BURST | FOUR BANK PAGE BURST |
最长访问时间 | - | 5.4 ns | 5.4 ns | 5.4 ns | 5.4 ns | 5.4 ns |
其他特性 | - | AUTO/SELF REFRESH | AUTO/SELF REFRESH | AUTO/SELF REFRESH | AUTO/SELF REFRESH | AUTO/SELF REFRESH |
JESD-30 代码 | - | R-XDMA-N168 | R-XDMA-N168 | R-XDMA-N168 | R-XDMA-N168 | R-XDMA-N168 |
内存密度 | - | 4831838208 bi | 9663676416 bi | 4294967296 bit | 2147483648 bi | 8589934592 bi |
内存集成电路类型 | - | SYNCHRONOUS DRAM MODULE | SYNCHRONOUS DRAM MODULE | SYNCHRONOUS DRAM MODULE | SYNCHRONOUS DRAM MODULE | SYNCHRONOUS DRAM MODULE |
内存宽度 | - | 72 | 72 | 64 | 64 | 64 |
湿度敏感等级 | - | 1 | 1 | 1 | 1 | 1 |
功能数量 | - | 1 | 1 | 1 | 1 | 1 |
端口数量 | - | 1 | 1 | 1 | 1 | 1 |
端子数量 | - | 168 | 168 | 168 | 168 | 168 |
字数 | - | 67108864 words | 134217728 words | 67108864 words | 33554432 words | 134217728 words |
字数代码 | - | 64000000 | 128000000 | 64000000 | 32000000 | 128000000 |
工作模式 | - | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
最高工作温度 | - | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
组织 | - | 64MX72 | 128MX72 | 64MX64 | 32MX64 | 128MX64 |
封装主体材料 | - | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED |
封装代码 | - | DIMM | DIMM | DIMM | DIMM | DIMM |
封装形状 | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | - | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY |
峰值回流温度(摄氏度) | - | 225 | 225 | 225 | 225 | 225 |
认证状态 | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
自我刷新 | - | YES | YES | YES | YES | YES |
最大供电电压 (Vsup) | - | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V |
最小供电电压 (Vsup) | - | 3 V | 3 V | 3 V | 3 V | 3 V |
标称供电电压 (Vsup) | - | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
表面贴装 | - | NO | NO | NO | NO | NO |
技术 | - | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | - | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
端子形式 | - | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD |
端子位置 | - | DUAL | DUAL | DUAL | DUAL | DUAL |
处于峰值回流温度下的最长时间 | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
厂商名称 | - | - | SAMSUNG(三星) | SAMSUNG(三星) | SAMSUNG(三星) | SAMSUNG(三星) |
最大时钟频率 (fCLK) | - | - | 133 MHz | 133 MHz | 133 MHz | 133 MHz |
I/O 类型 | - | - | COMMON | COMMON | COMMON | COMMON |
输出特性 | - | - | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
封装等效代码 | - | - | DIMM168 | DIMM168 | DIMM168 | DIMM168 |
电源 | - | - | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
刷新周期 | - | - | 8192 | 8192 | 8192 | 8192 |
最大待机电流 | - | - | 0.036 A | 0.016 A | 0.008 A | 0.032 A |
最大压摆率 | - | - | 2.07 mA | 1.6 mA | 0.8 mA | 1.84 mA |
端子节距 | - | - | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm |
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