
SINGLE-CHIP 8-BIT CMOS MICROCOMPUTER
| 参数名称 | 属性值 |
| 是否无铅 | 不含铅 |
| 是否Rohs认证 | 符合 |
| 厂商名称 | Renesas(瑞萨电子) |
| 零件包装代码 | SSOP |
| 包装说明 | SSOP, SOP36,.47,32 |
| 针数 | 36 |
| Reach Compliance Code | unknow |
| 具有ADC | YES |
| 地址总线宽度 | |
| 位大小 | 8 |
| CPU系列 | MELPS740 |
| 最大时钟频率 | 6 MHz |
| DAC 通道 | NO |
| DMA 通道 | NO |
| 外部数据总线宽度 | |
| JESD-30 代码 | R-PDSO-G36 |
| 长度 | 15 mm |
| 湿度敏感等级 | 3 |
| I/O 线路数量 | 28 |
| 端子数量 | 36 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -20 °C |
| PWM 通道 | NO |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | SSOP |
| 封装等效代码 | SOP36,.47,32 |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, SHRINK PITCH |
| 峰值回流温度(摄氏度) | 260 |
| 电源 | 5 V |
| 认证状态 | Not Qualified |
| RAM(字节) | 256 |
| ROM(单词) | 8192 |
| ROM可编程性 | MROM |
| 座面最大高度 | 2.4 mm |
| 速度 | 6 MHz |
| 最大压摆率 | 10 mA |
| 最大供电电压 | 5.5 V |
| 最小供电电压 | 4.1 V |
| 标称供电电压 | 5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | OTHER |
| 端子形式 | GULL WING |
| 端子节距 | 0.8 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 8.4 mm |
| uPs/uCs/外围集成电路类型 | MICROCONTROLLER |

| M37534M4-XXXFP | M37534M4-XXXGP | M37534M4-XXXSP | M37534RSS | M37534E8SP | M37534E8FP | M37534E4GP | |
|---|---|---|---|---|---|---|---|
| 描述 | SINGLE-CHIP 8-BIT CMOS MICROCOMPUTER | SINGLE-CHIP 8-BIT CMOS MICROCOMPUTER | SINGLE-CHIP 8-BIT CMOS MICROCOMPUTER | SINGLE-CHIP 8-BIT CMOS MICROCOMPUTER | SINGLE-CHIP 8-BIT CMOS MICROCOMPUTER | SINGLE-CHIP 8-BIT CMOS MICROCOMPUTER | SINGLE-CHIP 8-BIT CMOS MICROCOMPUTER |
| 是否无铅 | 不含铅 | 不含铅 | - | - | - | 不含铅 | 不含铅 |
| 是否Rohs认证 | 符合 | 符合 | - | - | - | 符合 | 符合 |
| 厂商名称 | Renesas(瑞萨电子) | Renesas(瑞萨电子) | Renesas(瑞萨电子) | - | Renesas(瑞萨电子) | - | Renesas(瑞萨电子) |
| 零件包装代码 | SSOP | QFP | DIP | - | DIP | SSOP | QFP |
| 包装说明 | SSOP, SOP36,.47,32 | LQFP, QFP32,.35SQ,32 | 13 X 36.72 MM, 1.78 MM PITCH, PLASTIC, SDIP-42 | - | 13 X 36.72 MM, 1.78 MM PITCH, PLASTIC, SDIP-42 | SSOP, SOP36,.47,32 | LQFP, QFP32,.35SQ,32 |
| 针数 | 36 | 32 | 42 | - | 42 | 36 | 32 |
| Reach Compliance Code | unknow | unknow | compli | - | compli | unknow | compli |
| 具有ADC | YES | YES | YES | - | YES | YES | YES |
| 位大小 | 8 | 8 | 8 | - | 8 | 8 | 8 |
| CPU系列 | MELPS740 | MELPS740 | MELPS740 | - | MELPS740 | MELPS740 | MELPS740 |
| 最大时钟频率 | 6 MHz | 6 MHz | 6 MHz | - | 6 MHz | 6 MHz | 6 MHz |
| DAC 通道 | NO | NO | NO | - | NO | NO | NO |
| DMA 通道 | NO | NO | NO | - | NO | NO | NO |
| JESD-30 代码 | R-PDSO-G36 | S-PQFP-G32 | R-PDIP-T42 | - | R-PDIP-T42 | R-PDSO-G36 | S-PQFP-G32 |
| 长度 | 15 mm | 7 mm | 36.7 mm | - | 36.7 mm | 15 mm | 7 mm |
| 湿度敏感等级 | 3 | 3 | - | - | - | 3 | 3 |
| I/O 线路数量 | 28 | 24 | 33 | - | 33 | 28 | 24 |
| 端子数量 | 36 | 32 | 42 | - | 42 | 36 | 32 |
| 最高工作温度 | 85 °C | 85 °C | 85 °C | - | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | -20 °C | -20 °C | -20 °C | - | -20 °C | -20 °C | -20 °C |
| PWM 通道 | NO | NO | NO | - | NO | NO | NO |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | SSOP | LQFP | SDIP | - | SDIP | SSOP | LQFP |
| 封装等效代码 | SOP36,.47,32 | QFP32,.35SQ,32 | SDIP42,.6 | - | SDIP42,.6 | SOP36,.47,32 | QFP32,.35SQ,32 |
| 封装形状 | RECTANGULAR | SQUARE | RECTANGULAR | - | RECTANGULAR | RECTANGULAR | SQUARE |
| 封装形式 | SMALL OUTLINE, SHRINK PITCH | FLATPACK, LOW PROFILE | IN-LINE, SHRINK PITCH | - | IN-LINE, SHRINK PITCH | SMALL OUTLINE, SHRINK PITCH | FLATPACK, LOW PROFILE |
| 峰值回流温度(摄氏度) | 260 | 260 | - | - | - | 260 | 260 |
| 电源 | 5 V | 5 V | 5 V | - | 5 V | 5 V | 5 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified |
| RAM(字节) | 256 | 256 | 256 | - | 384 | 384 | 256 |
| ROM(单词) | 8192 | 8192 | 8192 | - | 16384 | 16384 | 8192 |
| ROM可编程性 | MROM | MROM | MROM | - | OTPROM | OTPROM | OTPROM |
| 座面最大高度 | 2.4 mm | 1.7 mm | 5.5 mm | - | 5.5 mm | 2.4 mm | 1.7 mm |
| 速度 | 6 MHz | 6 MHz | 6 MHz | - | 6 MHz | 6 MHz | 6 MHz |
| 最大压摆率 | 10 mA | 10 mA | 10 mA | - | 10 mA | 10 mA | 10 mA |
| 最大供电电压 | 5.5 V | 5.5 V | 5.5 V | - | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 | 4.1 V | 4.1 V | 4.1 V | - | 4.1 V | 4.1 V | 4.1 V |
| 标称供电电压 | 5 V | 5 V | 5 V | - | 5 V | 5 V | 5 V |
| 表面贴装 | YES | YES | NO | - | NO | YES | YES |
| 技术 | CMOS | CMOS | CMOS | - | CMOS | CMOS | CMOS |
| 温度等级 | OTHER | OTHER | OTHER | - | OTHER | OTHER | OTHER |
| 端子形式 | GULL WING | GULL WING | THROUGH-HOLE | - | THROUGH-HOLE | GULL WING | GULL WING |
| 端子节距 | 0.8 mm | 0.8 mm | 1.778 mm | - | 1.778 mm | 0.8 mm | 0.8 mm |
| 端子位置 | DUAL | QUAD | DUAL | - | DUAL | DUAL | QUAD |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | - | - | - | NOT SPECIFIED | NOT SPECIFIED |
| 宽度 | 8.4 mm | 7 mm | 15.24 mm | - | 15.24 mm | 8.4 mm | 7 mm |
| uPs/uCs/外围集成电路类型 | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER | - | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER |
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