SINGLE-CHIP 8-BIT CMOS MICROCOMPUTER
参数名称 | 属性值 |
是否Rohs认证 | 不符合 |
厂商名称 | Mitsubishi(日本三菱) |
零件包装代码 | SSOP |
包装说明 | SSOP, SOP36,.47,32 |
针数 | 36 |
Reach Compliance Code | unknow |
具有ADC | YES |
其他特性 | OPERATES AT 2.2V MIN SUPPLY @ 1MHZ |
地址总线宽度 | |
位大小 | 8 |
CPU系列 | MELPS740 |
最大时钟频率 | 8 MHz |
DAC 通道 | NO |
DMA 通道 | NO |
外部数据总线宽度 | |
JESD-30 代码 | R-PDSO-G36 |
JESD-609代码 | e0 |
长度 | 15 mm |
I/O 线路数量 | 29 |
端子数量 | 36 |
最高工作温度 | 85 °C |
最低工作温度 | -20 °C |
PWM 通道 | NO |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | SSOP |
封装等效代码 | SOP36,.47,32 |
封装形状 | RECTANGULAR |
封装形式 | SMALL OUTLINE, SHRINK PITCH |
电源 | 5 V |
认证状态 | Not Qualified |
RAM(字节) | 768 |
ROM(单词) | 32768 |
ROM可编程性 | OTPROM |
座面最大高度 | 2.4 mm |
速度 | 4 MHz |
最大压摆率 | 10 mA |
最大供电电压 | 5.5 V |
最小供电电压 | 4 V |
标称供电电压 | 5 V |
表面贴装 | YES |
技术 | CMOS |
温度等级 | OTHER |
端子面层 | Tin/Lead (Sn/Pb) |
端子形式 | GULL WING |
端子节距 | 0.8 mm |
端子位置 | DUAL |
宽度 | 8.4 mm |
uPs/uCs/外围集成电路类型 | MICROCONTROLLER |
M37540E8FP | M37540RSS | M37540M4T-XXXFP | M37540M4-XXXGP | M37540M4 | M37540E8GP | M37540M4T-XXXGP | M37540M4-XXXSP | M37540M4-XXXFP | M37540E8SP | |
---|---|---|---|---|---|---|---|---|---|---|
描述 | SINGLE-CHIP 8-BIT CMOS MICROCOMPUTER | SINGLE-CHIP 8-BIT CMOS MICROCOMPUTER | SINGLE-CHIP 8-BIT CMOS MICROCOMPUTER | SINGLE-CHIP 8-BIT CMOS MICROCOMPUTER | SINGLE-CHIP 8-BIT CMOS MICROCOMPUTER | SINGLE-CHIP 8-BIT CMOS MICROCOMPUTER | SINGLE-CHIP 8-BIT CMOS MICROCOMPUTER | SINGLE-CHIP 8-BIT CMOS MICROCOMPUTER | SINGLE-CHIP 8-BIT CMOS MICROCOMPUTER | SINGLE-CHIP 8-BIT CMOS MICROCOMPUTER |
是否Rohs认证 | 不符合 | - | 不符合 | 不符合 | - | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
零件包装代码 | SSOP | - | SSOP | QFP | - | QFP | QFP | DIP | SSOP | DIP |
包装说明 | SSOP, SOP36,.47,32 | - | SSOP, SOP36,.47,32 | LQFP, QFP32,.35SQ,32 | - | LQFP, QFP32,.35SQ,32 | LQFP, QFP32,.35SQ,32 | SDIP, SDIP32,.4 | SSOP, SOP36,.47,32 | SDIP, SDIP32,.4 |
针数 | 36 | - | 36 | 32 | - | 32 | 32 | 32 | 36 | 32 |
Reach Compliance Code | unknow | - | unknow | unknow | - | unknow | unknow | unknow | unknow | unknow |
具有ADC | YES | - | YES | YES | - | YES | YES | YES | YES | YES |
其他特性 | OPERATES AT 2.2V MIN SUPPLY @ 1MHZ | - | OPERATES AT 2.4V MIN SUPPLY @ 1MHZ | OPERATES AT 2.2V MIN SUPPLY @ 1MHZ | - | OPERATES AT 2.2V MIN SUPPLY @ 1MHZ | OPERATES AT 2.4V MIN SUPPLY @ 1MHZ | OPERATES AT 2.2V MIN SUPPLY @ 1MHZ | OPERATES AT 2.2V MIN SUPPLY @ 1MHZ | OPERATES AT 2.2V MIN SUPPLY @ 1MHZ |
位大小 | 8 | - | 8 | 8 | - | 8 | 8 | 8 | 8 | 8 |
CPU系列 | MELPS740 | - | MELPS740 | MELPS740 | - | MELPS740 | MELPS740 | MELPS740 | MELPS740 | MELPS740 |
最大时钟频率 | 8 MHz | - | 8 MHz | 8 MHz | - | 8 MHz | 8 MHz | 8 MHz | 8 MHz | 8 MHz |
DAC 通道 | NO | - | NO | NO | - | NO | NO | NO | NO | NO |
DMA 通道 | NO | - | NO | NO | - | NO | NO | NO | NO | NO |
JESD-30 代码 | R-PDSO-G36 | - | R-PDSO-G36 | S-PQFP-G32 | - | S-PQFP-G32 | S-PQFP-G32 | R-PDIP-T32 | R-PDSO-G36 | R-PDIP-T32 |
JESD-609代码 | e0 | - | e0 | e0 | - | e0 | e0 | e0 | e0 | e0 |
长度 | 15 mm | - | 15 mm | 7 mm | - | 7 mm | 7 mm | 28 mm | 15 mm | 28 mm |
I/O 线路数量 | 29 | - | 29 | 25 | - | 25 | 25 | 25 | 29 | 25 |
端子数量 | 36 | - | 36 | 32 | - | 32 | 32 | 32 | 36 | 32 |
最高工作温度 | 85 °C | - | 85 °C | 85 °C | - | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
最低工作温度 | -20 °C | - | -40 °C | -20 °C | - | -20 °C | -40 °C | -20 °C | -20 °C | -20 °C |
PWM 通道 | NO | - | NO | NO | - | NO | NO | NO | NO | NO |
封装主体材料 | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | SSOP | - | SSOP | LQFP | - | LQFP | LQFP | SDIP | SSOP | SDIP |
封装等效代码 | SOP36,.47,32 | - | SOP36,.47,32 | QFP32,.35SQ,32 | - | QFP32,.35SQ,32 | QFP32,.35SQ,32 | SDIP32,.4 | SOP36,.47,32 | SDIP32,.4 |
封装形状 | RECTANGULAR | - | RECTANGULAR | SQUARE | - | SQUARE | SQUARE | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | SMALL OUTLINE, SHRINK PITCH | - | SMALL OUTLINE, SHRINK PITCH | FLATPACK, LOW PROFILE | - | FLATPACK, LOW PROFILE | FLATPACK, LOW PROFILE | IN-LINE, SHRINK PITCH | SMALL OUTLINE, SHRINK PITCH | IN-LINE, SHRINK PITCH |
电源 | 5 V | - | 5 V | 5 V | - | 5 V | 5 V | 5 V | 5 V | 5 V |
认证状态 | Not Qualified | - | Not Qualified | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
RAM(字节) | 768 | - | 512 | 512 | - | 768 | 512 | 512 | 512 | 768 |
ROM(单词) | 32768 | - | 16384 | 16384 | - | 32768 | 16384 | 16384 | 16384 | 32768 |
ROM可编程性 | OTPROM | - | MROM | MROM | - | OTPROM | MROM | MROM | MROM | OTPROM |
座面最大高度 | 2.4 mm | - | 2.4 mm | 1.7 mm | - | 1.7 mm | 1.7 mm | 5.08 mm | 2.4 mm | 5.08 mm |
速度 | 4 MHz | - | 4 MHz | 4 MHz | - | 4 MHz | 4 MHz | 4 MHz | 4 MHz | 4 MHz |
最大压摆率 | 10 mA | - | 8 mA | 8 mA | - | 10 mA | 8 mA | 8 mA | 8 mA | 10 mA |
最大供电电压 | 5.5 V | - | 5.5 V | 5.5 V | - | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
最小供电电压 | 4 V | - | 4 V | 4 V | - | 4 V | 4 V | 4 V | 4 V | 4 V |
标称供电电压 | 5 V | - | 5 V | 5 V | - | 5 V | 5 V | 5 V | 5 V | 5 V |
表面贴装 | YES | - | YES | YES | - | YES | YES | NO | YES | NO |
技术 | CMOS | - | CMOS | CMOS | - | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | OTHER | - | INDUSTRIAL | OTHER | - | OTHER | INDUSTRIAL | OTHER | OTHER | OTHER |
端子面层 | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
端子形式 | GULL WING | - | GULL WING | GULL WING | - | GULL WING | GULL WING | THROUGH-HOLE | GULL WING | THROUGH-HOLE |
端子节距 | 0.8 mm | - | 0.8 mm | 0.8 mm | - | 0.8 mm | 0.8 mm | 1.778 mm | 0.8 mm | 1.778 mm |
端子位置 | DUAL | - | DUAL | QUAD | - | QUAD | QUAD | DUAL | DUAL | DUAL |
宽度 | 8.4 mm | - | 8.4 mm | 7 mm | - | 7 mm | 7 mm | 10.16 mm | 8.4 mm | 10.16 mm |
uPs/uCs/外围集成电路类型 | MICROCONTROLLER | - | MICROCONTROLLER | MICROCONTROLLER | - | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER |
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