F-215
SEAM–30–02.0–L–04–2–A–GP–K–TR
(1,27 mm) .050"
SEAM–20–01–L–06–2–RA–GP–TR
SEAM-RA, SEAM-GP SERIES
HI-DENSITY RIGHT ANGLE OPEN PIN FIELD
SEAM-RA Mates with:
SEAF, SEAF-RA, SEAFP
SEAM-GP Mates with:
SEAF-RA-GP
SEAM
NO. PINS
PER ROW
01
PLATING
OPTION
NO. OF
ROWS
SOLDER
TYPE
RA
OPTION
TR
SPECIFICATIONS
For complete specifications and
recommended PCB layouts see
www.samtec.com?SEAM-RA
or www.samtec.com?SEAM
Insulator Material:
Black LCP
Contact Material:
Copper Alloy
Current Rating:
SEAM-RA = 2.0 A per pin
(6 adjacent pins powered)
Operating Temp Range:
-55°C to +125°C
Plating:
Au or Sn over
50 µ" (1,27 µm) Ni
Contact Resistance:
SEAM-RA = 19 mΩ
SEAM-GP = 5.5 mΩ
Working Voltage:
SEAM-RA = 260 VAC
SEAM-GP = 240 VAC
Mated Cycles:
SEAM-GP = 100
RoHS Compliant:
Yes
Lead-Free Solderable:
Yes
(8,13)
.320
– 20, – 30,
–40, –50
(19,30) .760
(12,32)
.485
(7,91)
.312
(1,60)
.063
(0,64)
.025
–L
= 10 µ" (0,25 µm)
Gold on contact area,
Matte Tin on solder tail
– 04
= Four Rows
–1
= Tin/Lead Alloy
Solder Charge
– GP
= Guide
Post
– TR
=Tape &
Reel
– 06
= Six Rows
–2
= Lead-Free
Solder Charge
–K
= Polyimide
film Pick &
Place Pad
–S
= 30 µ" (0,76 µm)
Gold on contact area,
Matte Tin on solder tail
– 08*
= Eight Rows
NO. PINS
PER ROW
–20
= Ten Rows
–30
* Note:
Fixturing required to
–40
process eight and ten row options,
–50
see www.samtec.com/searayfixture
– 10*
A
(38,94) 1.533
(51,64) 2.033
(64,34) 2.533
(77,04) 3.03
–GP= No. of positions x (1,27) .050 + (19,56) 0.77
Without –GP= No. of positions x (1,27) .050 + (11,18) 0.44
A
(5,36)
.211
(1,27)
.050
TEST DATA*
SEAM-RA/SEAF-05 SEAM-RA/SEAF-RA
Single-Ended
23 Gbps
24 Gbps
Differential Pair
23 Gbps
22 Gbps
*
@ 3dB insertion loss. Test board losses
de-embedded from performance data.
Complete test data available at www.samtec.com?SEAM-RA
or contact sig@samtec.com
(3,05) .120 DIA
RECOGNITIONS
For complete scope of
recognitions see
www.samtec.com/quality
SEAM
NO. PINS
PER ROW
02.0
PLATING
OPTION
NO. OF
ROWS
SOLDER
TYPE
A
GP
K
TR
–K
– 20, – 30,
–40, –50
06
–L
= 10 µ" (0,25 µm)
Gold on contact area,
Matte Tin on solder tail
– 04
=Four Rows
–1
= Tin/Lead Alloy
Solder Charge
= Polyimide
film Pick &
Place Pad
– 06
=Six Rows
–2
= Lead-Free
Solder Charge
– TR
=Tape & Reel
(Not available
with 50
positions)
(5,54)
.218
–S
= 30 µ" (0,76 µm)
Gold on contact area,
Matte Tin on solder tail
01
– 08
=Eight Rows
– 10
=Ten Rows
No. of positions x (1,27) .050 + (19,46) .766
(3,05) .120 DIA
(1,27)
.050
(4,60)
.181
(8,13)
.320
ALSO AVAILABLE
(MOQ Required)
*Note:
–C Plating passes
• Extended Guide Post
10 year MFG testing
(12,65)
.498
Note:
Some lengths, styles
and
Other platings
•
options are non-standard, non-
returnable.
• Guide post Field termination kits
Contact Samtec.
Note:
SEAM-GP Patented
Note:
Some sizes, styles and
options are non-standard,
non-returnable.
(1,27)
.050
(0,86)
(1,12) .044 DIA
.034 DIA
No. of positions x
(1,27) .050 + (3,58) .141
(0,51)
.020 (1,02)
SQ .040
WWW.SAMTEC.COM
Due to technical progress, all designs, specifications and components are subject to change without notice.
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