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HM628512BLPI-7

产品描述IC,SRAM,512KX8,CMOS,SOP,32PIN,PLASTIC
产品类别存储    存储   
文件大小92KB,共18页
制造商Hitachi (Renesas )
官网地址http://www.renesas.com/eng/
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HM628512BLPI-7概述

IC,SRAM,512KX8,CMOS,SOP,32PIN,PLASTIC

IC,静态随机存储器,512KX8,CMOS,SOP,32PIN,塑料

HM628512BLPI-7规格参数

参数名称属性值
零件包装代码DIP
包装说明DIP, DIP32,.6
针数32
Reach Compliance Codeunknow
最长访问时间70 ns
I/O 类型COMMON
JESD-30 代码R-PDIP-T32
长度41.9 mm
内存密度4194304 bi
内存集成电路类型STANDARD SRAM
内存宽度8
功能数量1
端子数量32
字数524288 words
字数代码512000
工作模式ASYNCHRONOUS
最高工作温度85 °C
最低工作温度-40 °C
组织512KX8
输出特性3-STATE
封装主体材料PLASTIC/EPOXY
封装代码DIP
封装等效代码DIP32,.6
封装形状RECTANGULAR
封装形式IN-LINE
并行/串行PARALLEL
电源5 V
认证状态Not Qualified
座面最大高度5.08 mm
最小待机电流2 V
最大压摆率0.07 mA
最大供电电压 (Vsup)5.5 V
最小供电电压 (Vsup)4.5 V
标称供电电压 (Vsup)5 V
表面贴装NO
技术CMOS
温度等级INDUSTRIAL
端子形式THROUGH-HOLE
端子节距2.54 mm
端子位置DUAL
宽度15.24 mm
Base Number Matches1

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HM628512BI Series
4 M SRAM (512-kword
×
8-bit)
ADE-203-935C (Z)
Rev. 2.0
Aug. 24, 1999
Description
The Hitachi HM628512BI is a 4-Mbit static RAM organized 512-kword
×
8-bit. HM628512BI Series has
realized higher density, higher performance and low power consumption by employing Hi-CMOS process
technology. The HM628512BI Series offers low power standby power dissipation; therefore, it is suitable for
battery backup systems. It has packaged in 32-pin SOP, 32-pin TSOP II and 32-pin DIP.
Features
Single 5 V supply
Access time: 70/85 ns (max)
Power dissipation
Active: 50 mW/MHz (typ)
Standby: 10
µW
(typ)
Completely static memory. No clock or timing strobe required
Equal access and cycle times
Common data input and output: Three state output
Directly TTL compatible: All inputs and outputs
Battery backup operation
Operating temperature: –40 to +85˚C

HM628512BLPI-7相似产品对比

HM628512BLPI-7 HM628512BI HM628512BLFPI-8 HM628512BLFPI-7 HM628512BLRRI-8 HM628512BLPI-8 HM628512BLTTI-8 HM628512BLRRI-7 HM628512BLTTI-7
描述 IC,SRAM,512KX8,CMOS,SOP,32PIN,PLASTIC IC,SRAM,512KX8,CMOS,SOP,32PIN,PLASTIC IC,SRAM,512KX8,CMOS,SOP,32PIN,PLASTIC IC,SRAM,512KX8,CMOS,SOP,32PIN,PLASTIC IC,SRAM,512KX8,CMOS,SOP,32PIN,PLASTIC IC,SRAM,512KX8,CMOS,SOP,32PIN,PLASTIC IC,SRAM,512KX8,CMOS,SOP,32PIN,PLASTIC IC,SRAM,512KX8,CMOS,SOP,32PIN,PLASTIC IC,SRAM,512KX8,CMOS,SOP,32PIN,PLASTIC
零件包装代码 DIP - SOIC SOIC TSOP2 DIP TSOP2 TSOP2 TSOP2
包装说明 DIP, DIP32,.6 - SOP, SOP32,.56 SOP, SOP32,.56 TSOP2, TSOP32,.46 DIP, DIP32,.6 TSOP2, TSOP32,.46 TSOP2, TSOP32,.46 TSOP2, TSOP32,.46
针数 32 - 32 32 32 32 32 32 32
Reach Compliance Code unknow - unknow unknow unknow unknow unknow unknow unknow
最长访问时间 70 ns - 85 ns 70 ns 85 ns 85 ns 85 ns 70 ns 70 ns
I/O 类型 COMMON - COMMON COMMON COMMON COMMON COMMON COMMON COMMON
JESD-30 代码 R-PDIP-T32 - R-PDSO-G32 R-PDSO-G32 R-PDSO-G32 R-PDIP-T32 R-PDSO-G32 R-PDSO-G32 R-PDSO-G32
长度 41.9 mm - 20.45 mm 20.45 mm 20.95 mm 41.9 mm 20.95 mm 20.95 mm 20.95 mm
内存密度 4194304 bi - 4194304 bi 4194304 bi 4194304 bi 4194304 bi 4194304 bi 4194304 bi 4194304 bi
内存集成电路类型 STANDARD SRAM - STANDARD SRAM STANDARD SRAM STANDARD SRAM STANDARD SRAM STANDARD SRAM STANDARD SRAM STANDARD SRAM
内存宽度 8 - 8 8 8 8 8 8 8
功能数量 1 - 1 1 1 1 1 1 1
端子数量 32 - 32 32 32 32 32 32 32
字数 524288 words - 524288 words 524288 words 524288 words 524288 words 524288 words 524288 words 524288 words
字数代码 512000 - 512000 512000 512000 512000 512000 512000 512000
工作模式 ASYNCHRONOUS - ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
最高工作温度 85 °C - 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C
最低工作温度 -40 °C - -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C
组织 512KX8 - 512KX8 512KX8 512KX8 512KX8 512KX8 512KX8 512KX8
输出特性 3-STATE - 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE
封装主体材料 PLASTIC/EPOXY - PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 DIP - SOP SOP TSOP2 DIP TSOP2 TSOP2 TSOP2
封装等效代码 DIP32,.6 - SOP32,.56 SOP32,.56 TSOP32,.46 DIP32,.6 TSOP32,.46 TSOP32,.46 TSOP32,.46
封装形状 RECTANGULAR - RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
封装形式 IN-LINE - SMALL OUTLINE SMALL OUTLINE SMALL OUTLINE, THIN PROFILE IN-LINE SMALL OUTLINE, THIN PROFILE SMALL OUTLINE, THIN PROFILE SMALL OUTLINE, THIN PROFILE
并行/串行 PARALLEL - PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL
电源 5 V - 5 V 5 V 5 V 5 V 5 V 5 V 5 V
认证状态 Not Qualified - Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
座面最大高度 5.08 mm - 3 mm 3 mm 1.2 mm 5.08 mm 1.2 mm 1.2 mm 1.2 mm
最小待机电流 2 V - 2 V 2 V 2 V 2 V 2 V 2 V 2 V
最大压摆率 0.07 mA - 0.07 mA 0.07 mA 0.07 mA 0.07 mA 0.07 mA 0.07 mA 0.07 mA
最大供电电压 (Vsup) 5.5 V - 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V
最小供电电压 (Vsup) 4.5 V - 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V
标称供电电压 (Vsup) 5 V - 5 V 5 V 5 V 5 V 5 V 5 V 5 V
表面贴装 NO - YES YES YES NO YES YES YES
技术 CMOS - CMOS CMOS CMOS CMOS CMOS CMOS CMOS
温度等级 INDUSTRIAL - INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL
端子形式 THROUGH-HOLE - GULL WING GULL WING GULL WING THROUGH-HOLE GULL WING GULL WING GULL WING
端子节距 2.54 mm - 1.27 mm 1.27 mm 1.27 mm 2.54 mm 1.27 mm 1.27 mm 1.27 mm
端子位置 DUAL - DUAL DUAL DUAL DUAL DUAL DUAL DUAL
宽度 15.24 mm - 11.3 mm 11.3 mm 10.16 mm 15.24 mm 10.16 mm 10.16 mm 10.16 mm
是否Rohs认证 - - 不符合 - 不符合 不符合 不符合 不符合 -
JESD-609代码 - - e0 - e0 e0 e0 e0 -
峰值回流温度(摄氏度) - - NOT SPECIFIED - NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED -
端子面层 - - Tin/Lead (Sn/Pb) - Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) -
处于峰值回流温度下的最长时间 - - NOT SPECIFIED - NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED -

 
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