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HM6264

产品描述64k SRAM (8-kword x 8-bit) Wide Temperature Range version
文件大小78KB,共17页
制造商Hitachi (Renesas )
官网地址http://www.renesas.com/eng/
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HM6264概述

64k SRAM (8-kword x 8-bit) Wide Temperature Range version

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HM6264BI Series
64k SRAM (8-kword
×
8-bit)
Wide Temperature Range version
ADE-203-492C (Z)
Rev. 3.0
May. 8, 2000
Description
The Hitachi HM6264BI is 64k-bit static RAM organized 8-kword
×
8-bit. It realizes higher performance and
low power consumption by 1.5
µm
CMOS process technology. The device, packaged in 450 mil SOP (foot
print pitch width), 600 mil plastic DIP, is available for high density mounting.
Features
Single 5 V supply: 5 V
±
10%
Access time: 100/120 ns (max)
Power dissipation:
Standby: 10
µW
(typ)
Operation: 15 mW (typ) (f = 1 MHz)
Completely static memory
No clock or timing strobe required
Equal access and cycle times
Common data input and output
Three state output
Directly TTL compatible
All inputs and outputs
Battery backup operation capability
Operating temperature range: –40˚C to +85˚C

HM6264相似产品对比

HM6264 HM6264BI HM6264BLFPI-10T HM6264BLPI-12 HM6264BLFPI-12T HM6264BLPI-10
描述 64k SRAM (8-kword x 8-bit) Wide Temperature Range version 64k SRAM (8-kword x 8-bit) Wide Temperature Range version 64k SRAM (8-kword x 8-bit) Wide Temperature Range version 64k SRAM (8-kword x 8-bit) Wide Temperature Range version 64k SRAM (8-kword x 8-bit) Wide Temperature Range version 64k SRAM (8-kword x 8-bit) Wide Temperature Range version
零件包装代码 - - SOIC DIP SOIC DIP
包装说明 - - SOP, SOP28,.45 DIP, DIP28,.6 SOP, SOP28,.45 DIP, DIP28,.6
针数 - - 28 28 28 28
Reach Compliance Code - - unknow unknow unknow unknow
ECCN代码 - - EAR99 EAR99 EAR99 EAR99
最长访问时间 - - 100 ns 120 ns 120 ns 100 ns
I/O 类型 - - COMMON COMMON COMMON COMMON
JESD-30 代码 - - R-PDSO-G28 R-PDIP-T28 R-PDSO-G28 R-PDIP-T28
长度 - - 18 mm 35.6 mm 18 mm 35.6 mm
内存密度 - - 65536 bi 65536 bi 65536 bi 65536 bi
内存集成电路类型 - - STANDARD SRAM STANDARD SRAM STANDARD SRAM STANDARD SRAM
内存宽度 - - 8 8 8 8
功能数量 - - 1 1 1 1
端子数量 - - 28 28 28 28
字数 - - 8192 words 8192 words 8192 words 8192 words
字数代码 - - 8000 8000 8000 8000
工作模式 - - ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
最高工作温度 - - 85 °C 85 °C 85 °C 85 °C
最低工作温度 - - -40 °C -40 °C -40 °C -40 °C
组织 - - 8KX8 8KX8 8KX8 8KX8
输出特性 - - 3-STATE 3-STATE 3-STATE 3-STATE
封装主体材料 - - PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 - - SOP DIP SOP DIP
封装等效代码 - - SOP28,.45 DIP28,.6 SOP28,.45 DIP28,.6
封装形状 - - RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
封装形式 - - SMALL OUTLINE IN-LINE SMALL OUTLINE IN-LINE
并行/串行 - - PARALLEL PARALLEL PARALLEL PARALLEL
电源 - - 5 V 5 V 5 V 5 V
认证状态 - - Not Qualified Not Qualified Not Qualified Not Qualified
座面最大高度 - - 3 mm 5.7 mm 3 mm 5.7 mm
最大待机电流 - - 0.0001 A 0.0001 A 0.0001 A 0.0001 A
最小待机电流 - - 2 V 2 V 2 V 2 V
最大压摆率 - - 0.05 mA 0.05 mA 0.05 mA 0.05 mA
最大供电电压 (Vsup) - - 5.5 V 5.5 V 5.5 V 5.5 V
最小供电电压 (Vsup) - - 4.5 V 4.5 V 4.5 V 4.5 V
标称供电电压 (Vsup) - - 5 V 5 V 5 V 5 V
表面贴装 - - YES NO YES NO
技术 - - CMOS CMOS CMOS CMOS
温度等级 - - INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL
端子形式 - - GULL WING THROUGH-HOLE GULL WING THROUGH-HOLE
端子节距 - - 1.27 mm 2.54 mm 1.27 mm 2.54 mm
端子位置 - - DUAL DUAL DUAL DUAL
宽度 - - 8.4 mm 15.24 mm 8.4 mm 15.24 mm

 
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