64k SRAM (8-kword x 8-bit) Wide Temperature Range version

| HM6264 | HM6264BI | HM6264BLFPI-10T | HM6264BLPI-12 | HM6264BLFPI-12T | HM6264BLPI-10 | |
|---|---|---|---|---|---|---|
| 描述 | 64k SRAM (8-kword x 8-bit) Wide Temperature Range version | 64k SRAM (8-kword x 8-bit) Wide Temperature Range version | 64k SRAM (8-kword x 8-bit) Wide Temperature Range version | 64k SRAM (8-kword x 8-bit) Wide Temperature Range version | 64k SRAM (8-kword x 8-bit) Wide Temperature Range version | 64k SRAM (8-kword x 8-bit) Wide Temperature Range version |
| 零件包装代码 | - | - | SOIC | DIP | SOIC | DIP |
| 包装说明 | - | - | SOP, SOP28,.45 | DIP, DIP28,.6 | SOP, SOP28,.45 | DIP, DIP28,.6 |
| 针数 | - | - | 28 | 28 | 28 | 28 |
| Reach Compliance Code | - | - | unknow | unknow | unknow | unknow |
| ECCN代码 | - | - | EAR99 | EAR99 | EAR99 | EAR99 |
| 最长访问时间 | - | - | 100 ns | 120 ns | 120 ns | 100 ns |
| I/O 类型 | - | - | COMMON | COMMON | COMMON | COMMON |
| JESD-30 代码 | - | - | R-PDSO-G28 | R-PDIP-T28 | R-PDSO-G28 | R-PDIP-T28 |
| 长度 | - | - | 18 mm | 35.6 mm | 18 mm | 35.6 mm |
| 内存密度 | - | - | 65536 bi | 65536 bi | 65536 bi | 65536 bi |
| 内存集成电路类型 | - | - | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM |
| 内存宽度 | - | - | 8 | 8 | 8 | 8 |
| 功能数量 | - | - | 1 | 1 | 1 | 1 |
| 端子数量 | - | - | 28 | 28 | 28 | 28 |
| 字数 | - | - | 8192 words | 8192 words | 8192 words | 8192 words |
| 字数代码 | - | - | 8000 | 8000 | 8000 | 8000 |
| 工作模式 | - | - | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| 最高工作温度 | - | - | 85 °C | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | - | - | -40 °C | -40 °C | -40 °C | -40 °C |
| 组织 | - | - | 8KX8 | 8KX8 | 8KX8 | 8KX8 |
| 输出特性 | - | - | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| 封装主体材料 | - | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | - | - | SOP | DIP | SOP | DIP |
| 封装等效代码 | - | - | SOP28,.45 | DIP28,.6 | SOP28,.45 | DIP28,.6 |
| 封装形状 | - | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | - | - | SMALL OUTLINE | IN-LINE | SMALL OUTLINE | IN-LINE |
| 并行/串行 | - | - | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| 电源 | - | - | 5 V | 5 V | 5 V | 5 V |
| 认证状态 | - | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | - | - | 3 mm | 5.7 mm | 3 mm | 5.7 mm |
| 最大待机电流 | - | - | 0.0001 A | 0.0001 A | 0.0001 A | 0.0001 A |
| 最小待机电流 | - | - | 2 V | 2 V | 2 V | 2 V |
| 最大压摆率 | - | - | 0.05 mA | 0.05 mA | 0.05 mA | 0.05 mA |
| 最大供电电压 (Vsup) | - | - | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | - | - | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| 标称供电电压 (Vsup) | - | - | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | - | - | YES | NO | YES | NO |
| 技术 | - | - | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | - | - | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子形式 | - | - | GULL WING | THROUGH-HOLE | GULL WING | THROUGH-HOLE |
| 端子节距 | - | - | 1.27 mm | 2.54 mm | 1.27 mm | 2.54 mm |
| 端子位置 | - | - | DUAL | DUAL | DUAL | DUAL |
| 宽度 | - | - | 8.4 mm | 15.24 mm | 8.4 mm | 15.24 mm |
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