2 Lead Metal Package Quartz Crystal, 4.7mm x 11mm
HC49U Series
Product Features:
Low Cost
RoHS Compliant
Compatible with Leadfree Processing
Applications:
Fibre Channel
Server & Storage
Sonet /SDH
802.11 / Wifi
T1/E1, T3/E3
System Clock
Frequency
ESR (Equivalent Series Resistance)
1.300MHz – 1.999MHz
2.000MHz – 2.999MHz
3.000MHz – 3.299MHz
3.300MHz – 3.999MHz
4.000MHz – 4.499MHz
4.500MHz – 4.999MHz
5.000MHz – 5.999MHz
6.000MHz – 6.999MHz
7.000MHz – 7.999MHz
8.000MHz – 9.999MHz
10.000MHz – 35.999MHz
25.000MHz – 100.000MHz (3
rd
OT)
70.000MHz – 160.000MHz (5
th
OT)
Shunt Capacitance
Frequency Tolerance @ +25 C
Frequency Stability over Temperature
Crystal Cut
Load Capacitance
Drive Level
Aging
Operating Temperature Range
Storage Temperature Range
1.300MHz to 160.000MHz
800 Ohms Maximum
500 Ohms Maximum
200 Ohms Maximum
150 Ohms Maximum
100 Ohms Maximum
80 Ohms Maximum
70 Ohms Maximum
50 Ohms Maximum
40 Ohms Maximum
30 Ohms Maximum
25 Ohms Maximum
50 Ohms Maximum
40 Ohms Maximum
7pF Maximum
See Part Number Guide
See Part Number Guide
AT Cut
See Part Number Guide
1mWatts Maximum
5ppm/Year
Maximum
See Part Number Guide
-40°C to +85°C
Dimension Units: mm
Part Number Guide
Package
Tolerance
(ppm) at
Room
Temperature
B = ±50 ppm
F = ±30 ppm
HC49U -
(13.46 mm H)
Sample Part Number:
Stability
(ppm) over Operating
Temperature
B = ±50 ppm
F = ±30 ppm
G = ±25 ppm
H = ±20 ppm
I = ±15 ppm**
J = ±10 ppm**
HC49U - FB1F18 - 20.000 MHz
Operating
Temperature Range
Mode
(overtone)
Load Capacitance
(pF)
Frequency
0 = 0°C to +50°C
1 = 0°C to +70°C
2 = -10°C to +60°C
3 = -20°C to +70°C
5 = -40°C to +85°C
9 = -10°C to +50°C
F = Fundamental
3 = 3
rd
overtone
5 = 5
th
overtone
18 pF or Specify
- 20.000 MHz
G = ±25 ppm
H = ±20 ppm
I = ±15 ppm
J = ±10 ppm*
* Not available at all frequencies. ** Not available for all temperature ranges.
ILSI America Phone 775-851-8880 ● Fax 775-851-8882 ●email: e-mail@ilsiamerica.com ●
www.ilsiamerica.com
Specifications subject to change without notice
Rev: 12/08/17_B
Page 1 of 2
2 Lead Metal Package Quartz Crystal, 4.7mm x 11mm
Pb Free Solder Reflow Profile:
Ts max to T
L
(Ramp-up Rate)
Preheat
Temperature min (Ts min)
Temperature typ (Ts typ)
Temperature max (Ts max)
Time (Ts)
Ramp-up Tate (T
L
to Tp
Time Maintained Above
Temperature (T
L
)
Time (T
L)
Peak Temperature (Tp)
Time within 5ºC to Peak
Temperature (Tp)
Ramp-down Rate
Tune 25ºC to Peak Temperature
HC49U Series
3ºC / second max
150ºC
175ºC
200ºC
60 to180 seconds
3ºC / second max
217ºC
60 to 150 seconds
260ºC max for 10 seconds
20 to 40 seconds
6ºC / second max
8 minutes max
Units are backward compatible with +240°C reflow processes
Package Information:
MSL = 1
Termination = e1 (Sn / Cu / Ag over Ni over Kovar base metal).
Environmental Specifications
Thermal Shock
Moisture Resistance
``Mechanical Shock
Mechanical Vibration
Resistance to Soldering Heat
Hazardous Substance
Solderability
Terminal Strength
Gross Leak
Fine Leak
Solvent Resistance
MIL-STD-883, Method 1011, Condition A
MIL-STD-883, Method 1004
MIL-STD-883, Method 2002, Condition B
MIL-STD-883, Method 2007, Condition A
J-STD-020C, Table 5-2 Pb-free devices (except 2 cycles max)
Pb-Free / RoHS Compliant
JESD22-B102 Method 2 (Preconditioning E)
MIL-STD-883, Method 2004, Test Condition D
MIL-STD-883, Method 1014, Condition C
MIL-STD-883, Method 1014, Condition A1
MIL-STD-202, Method 215
Marking
Line 1: ILSI
Line 2: Frequency
Line 3: Date Code (YWW)
ILSI America Phone 775-851-8880 ● Fax 775-851-8882 ●email: e-mail@ilsiamerica.com ●
www.ilsiamerica.com
Specifications subject to change without notice
Rev: 12/08/17_B
Page 2 of 2
FPGA/CPLD
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