Uniohm Corporation
Multilayer Ceramic Chip Capacitor
Multilayer Ceramic Chip Capacitor
ARRAY TYPE MLCC
FEATURES
．Reduction
in required real estate (more than 50% ).
．Reduced
Cost,Space and Time for placement on PCB ,reduction in number of solder joints..
．Easier
PCB design , reduced waste from tape and reel packaging process.
．It
protect EMI bypassing digital signal line noise..
APPLICATIONS
．Mother
board , Notebook , Electronic device etc…..
1.Product Identification
MA
1-1
6
1-2
N
1-3
1H
1-4
100
1-5
K
1-6
T
1-7
A
1-8
N
1-9
1-1.
MA
1-2.
6
UWA Capacitor Array Type MLCC
Size
Code
5
6
EIA Code
0805
1206
Length * Width
mm / ( inch )
2.00 * 1.20 / ( 0.08 * 0.05 )
3.20 * 1.60 / ( 0.12 * 0.06 )
1-3.
N
Temperature Characteristic
Code
Temperature Characteristic
N
NPO
X
X7R
Y
Y5V
Operation Temperature Range
-55℃ ~ +125℃
-55℃ ~ +125℃
-30℃ ~ + 85℃
1-4.
1H
Rated Voltage
Code
1C
1E
1H
Rated Voltage
16V
25V
50V
1-5.
100
Capacitance
Code
0R5
010
100
Capacitance ( pF )
0.5
1
10
Code
101
102
104
Capacitance ( pF )
100
1,000
( 1nF )
100,000 ( 100nF )
1-6.
K
Capacitance Tolerance
Code
K
M
Z
Tolerance
± 10 %
± 20 %
- 20 ~ + 80 %
1
Uniohm Corporation
Multilayer Ceramic Chip Capacitor
1-7.
T
Quantity
Code
7〃
A
15K
B
10K
T
4K
U
3K
V
2.5K
W
2K
X
1K
( Unit : pcs )
Y
Z
700
500
1-8.
A
Thickness
Code
Thickness
( Unit : mm )
S
0.6±0.1
A
0.8±0.1
D
0.85±0.1
F
1.15±0.1
G
1.25±0.2
1-9.
N
Material Option
Code
N
X
G
Description Of T he Code
Sn – Pb Plating (Sn 90% , Pb 10%)
Pb – Free Plating (Sn 90% , Pb 10%)
Green Device
(Sn 90% , Pb 10%)
2.Standard Combination of Nominal Capacitance and Tolerance
Class
Class I
Class II
Application Capacitance
E-3
E-6
E-12
E-24
1.0
1.0
1.0
1.0
1.1
1.2
1.2
1.3
1.5
1.5
1.6
1.5
1.8
1.8
2.0
Application Capacitance
2.2
2.2
3.3
2.2
2.7
3.3
3.9
2.2
2.7
3.3
3.9
2.4
3.0
3.6
4.3
4.7
4.7
4.7
4.7
5.1
5.6
5.6
6.2
6.8
6.8
7.5
6.8
8.2
8.2
9.1
Temperature Characteristic
NPO
X7R
Y5V
More Than
10pF
Tolerance
J(±5 %)
Nominal Capacitance
E-24 series
E-12 series
E- 6 series
K(±10 %)
K(±10.0 %) , M(±20 %)
M(±20.0 %) , Z(-20 ~ +80%)
2
DSP 与 ARM 处理器
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