Multi Protocol Controller, 2 Channel(s), 0.107421875MBps, HMOS, CDIP40, DIP-40
| 参数名称 | 属性值 |
| 厂商名称 | Rochester Electronics |
| 包装说明 | DIP, |
| Reach Compliance Code | unknown |
| 地址总线宽度 | 2 |
| 边界扫描 | NO |
| 总线兼容性 | MCS 48; MCS 85; MCS 51; IAPX 86; IAPX 88; IAPX 186; IAPX 188 |
| 通信协议 | ASYNC, BIT; SYNC, BYTE; SYNC, HDLC; SYNC, SDLC; X.25; BISYNC |
| 最大数据传输速率 | 0.107421875 MBps |
| 外部数据总线宽度 | 8 |
| JESD-30 代码 | R-GDIP-T40 |
| 长度 | 52.325 mm |
| 串行 I/O 数 | 2 |
| 端子数量 | 40 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 封装主体材料 | CERAMIC, GLASS-SEALED |
| 封装代码 | DIP |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 座面最大高度 | 5.72 mm |
| 表面贴装 | NO |
| 技术 | HMOS |
| 温度等级 | INDUSTRIAL |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| 宽度 | 15.24 mm |
| uPs/uCs/外围集成电路类型 | SERIAL IO/COMMUNICATION CONTROLLER, MULTI PROTOCOL |
| Base Number Matches | 1 |

| LD8274 | TD8274 | QD8274 | D8274 | P8274 | |
|---|---|---|---|---|---|
| 描述 | Multi Protocol Controller, 2 Channel(s), 0.107421875MBps, HMOS, CDIP40, DIP-40 | Multi Protocol Controller, 2 Channel(s), 0.107421875MBps, HMOS, CDIP40, DIP-40 | Multi Protocol Controller, 2 Channel(s), 0.107421875MBps, NMOS, CDIP40, DIP-40 | Multi Protocol Controller, 2 Channel(s), 0.107421875MBps, NMOS, CDIP40, DIP-40 | Multi Protocol Controller, 2 Channel(s), 0.107421875MBps, NMOS, PDIP40, DIP-40 |
| 厂商名称 | Rochester Electronics | Rochester Electronics | Rochester Electronics | Rochester Electronics | Rochester Electronics |
| 包装说明 | DIP, | DIP, | DIP, | DIP, | DIP, |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown |
| 地址总线宽度 | 2 | 2 | 2 | 2 | 2 |
| 边界扫描 | NO | NO | NO | NO | NO |
| 总线兼容性 | MCS 48; MCS 85; MCS 51; IAPX 86; IAPX 88; IAPX 186; IAPX 188 | MCS 48; MCS 85; MCS 51; IAPX 86; IAPX 88; IAPX 186; IAPX 188 | MCS 48; MCS 85; MCS 51; IAPX 86; IAPX 88; IAPX 186; IAPX 188 | MCS 48; MCS 85; MCS 51; IAPX 86; IAPX 88; IAPX 186; IAPX 188 | MCS 48; MCS 85; MCS 51; IAPX 86; IAPX 88; IAPX 186; IAPX 188 |
| 通信协议 | ASYNC, BIT; SYNC, BYTE; SYNC, HDLC; SYNC, SDLC; X.25; BISYNC | ASYNC, BIT; SYNC, BYTE; SYNC, HDLC; SYNC, SDLC; X.25; BISYNC | ASYNC, BIT; SYNC, BYTE; SYNC, HDLC; SYNC, SDLC; X.25; BISYNC; EXT SYNC; BISYNC TRANSPARENT | ASYNC, BIT; SYNC, BYTE; SYNC, HDLC; SYNC, SDLC; X.25; BISYNC; EXT SYNC; BISYNC TRANSPARENT | ASYNC, BIT; SYNC, BYTE; SYNC, HDLC; SYNC, SDLC; X.25; BISYNC; EXT SYNC; BISYNC TRANSPARENT |
| 最大数据传输速率 | 0.107421875 MBps | 0.107421875 MBps | 0.107421875 MBps | 0.107421875 MBps | 0.107421875 MBps |
| 外部数据总线宽度 | 8 | 8 | 8 | 8 | 8 |
| JESD-30 代码 | R-GDIP-T40 | R-GDIP-T40 | R-GDIP-T40 | R-GDIP-T40 | R-PDIP-T40 |
| 长度 | 52.325 mm | 52.325 mm | 52.325 mm | 52.325 mm | 52.26 mm |
| 串行 I/O 数 | 2 | 2 | 2 | 2 | 2 |
| 端子数量 | 40 | 40 | 40 | 40 | 40 |
| 封装主体材料 | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | PLASTIC/EPOXY |
| 封装代码 | DIP | DIP | DIP | DIP | DIP |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE |
| 座面最大高度 | 5.72 mm | 5.72 mm | 5.72 mm | 5.72 mm | 5.08 mm |
| 表面贴装 | NO | NO | NO | NO | NO |
| 技术 | HMOS | HMOS | NMOS | NMOS | NMOS |
| 端子形式 | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
| 端子节距 | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL |
| 宽度 | 15.24 mm | 15.24 mm | 15.24 mm | 15.24 mm | 15.24 mm |
| uPs/uCs/外围集成电路类型 | SERIAL IO/COMMUNICATION CONTROLLER, MULTI PROTOCOL | SERIAL IO/COMMUNICATION CONTROLLER, MULTI PROTOCOL | SERIAL IO/COMMUNICATION CONTROLLER, MULTI PROTOCOL | SERIAL IO/COMMUNICATION CONTROLLER, MULTI PROTOCOL | SERIAL IO/COMMUNICATION CONTROLLER, MULTI PROTOCOL |
| Base Number Matches | 1 | 1 | 1 | 1 | - |
| 其他特性 | - | - | MODEM CONTROL INPUTS SELECTABLE AS GENERAL PURPOSE I/OS | MODEM CONTROL INPUTS SELECTABLE AS GENERAL PURPOSE I/OS | MODEM CONTROL INPUTS SELECTABLE AS GENERAL PURPOSE I/OS |
| 数据编码/解码方法 | - | - | NRZ | NRZ | NRZ |
| 低功率模式 | - | - | NO | NO | NO |
| 标称供电电压 | - | - | 5 V | 5 V | 5 V |
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