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Datasheet> 器件分类 > 嵌入式处理器和控制器> 微控制器和处理器> TSB80C188EB20

TSB80C188EB20: 产品描述Microprocessor, 16-Bit, 20MHz, CMOS, PQFP80, SHRINK, QFP-80; 产品类别嵌入式处理器和控制器微控制器和处理器; 文件大小776KB，共59页; 制造商Intel(英特尔); 官网地址http://www.intel.com/

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TSB80C188EB20概述

Microprocessor, 16-Bit, 20MHz, CMOS, PQFP80, SHRINK, QFP-80

TSB80C188EB20规格参数

参数名称	属性值
厂商名称	Intel(英特尔)
零件包装代码	QFP
包装说明	LFQFP,
针数	80
Reach Compliance Code	unknown
ECCN代码	3A991.A.2
其他特性	DRAM REFRESH CONTROLLER; 3 PROGRAMMABLE TIMERS; EMULATION HARDWARE
地址总线宽度	20
位大小	16
边界扫描	NO
最大时钟频率	40 MHz
外部数据总线宽度	8
格式	FIXED POINT
集成缓存	NO
JESD-30 代码	S-PQFP-G80
长度	12 mm
低功率模式	YES
DMA 通道数量
外部中断装置数量	6
串行 I/O 数	2
端子数量	80
片上数据RAM宽度
最高工作温度	85 °C
最低工作温度	-40 °C
封装主体材料	PLASTIC/EPOXY
封装代码	LFQFP
封装形状	SQUARE
封装形式	FLATPACK, LOW PROFILE, FINE PITCH
认证状态	Not Qualified
RAM（字数）	0
座面最大高度	1.66 mm
速度	20 MHz
最大压摆率	108 mA
最大供电电压	5.5 V
最小供电电压	4.5 V
标称供电电压	5 V
表面贴装	YES
技术	CMOS
温度等级	INDUSTRIAL
端子形式	GULL WING
端子节距	0.5 mm
端子位置	QUAD
宽度	12 mm
uPs/uCs/外围集成电路类型	MICROPROCESSOR
Base Number Matches	1

TSB80C188EB20相似产品对比

	TSB80C188EB20	TSB80C188EB13	SB80L186EB8	TSB80L186EB8	TSB80L188EB8	TSB80C186EB20	TSB80C186EB13	TSB80L186EB13	TN80L188EB8	TSB80L188EB13
描述	Microprocessor, 16-Bit, 20MHz, CMOS, PQFP80, SHRINK, QFP-80	Microprocessor, 16-Bit, 13MHz, CMOS, PQFP80, SHRINK, QFP-80	Microprocessor, 16-Bit, 8MHz, CMOS, PQFP80, SHRINK, QFP-80	Microprocessor, 16-Bit, 8MHz, CMOS, PQFP80, SHRINK, QFP-80	Microprocessor, 16-Bit, 8MHz, CMOS, PQFP80, SHRINK, QFP-80	Microprocessor, 16-Bit, 20MHz, CMOS, PQFP80, SHRINK, QFP-80	Microprocessor, 16-Bit, 13MHz, CMOS, PQFP80, SHRINK, QFP-80	Microprocessor, 16-Bit, 13MHz, CMOS, PQFP80, SHRINK, QFP-80	Microprocessor, 16-Bit, 8MHz, CMOS, PQCC84, PLASTIC, LCC-84	Microprocessor, 16-Bit, 13MHz, CMOS, PQFP80, SHRINK, QFP-80
零件包装代码	QFP	QFP	QFP	QFP	QFP	QFP	QFP	QFP	LCC	QFP
包装说明	LFQFP,	LFQFP,	LFQFP,	LFQFP,	LFQFP,	LFQFP,	LFQFP,	LFQFP,	QCCJ, LDCC84,1.2SQ	LFQFP,
针数	80	80	80	80	80	80	80	80	84	80
Reach Compliance Code	unknown	unknown	compliant	unknown	unknown	unknown	unknown	unknown	compliant	unknown
地址总线宽度	20	20	20	20	20	20	20	20	20	20
位大小	16	16	16	16	16	16	16	16	16	16
边界扫描	NO	NO	NO	NO	NO	NO	NO	NO	NO	NO
最大时钟频率	40 MHz	26 MHz	16 MHz	16 MHz	16 MHz	40 MHz	26 MHz	26 MHz	16 MHz	26 MHz
外部数据总线宽度	8	8	16	16	8	16	16	16	8	8
格式	FIXED POINT	FIXED POINT	FIXED POINT	FIXED POINT	FIXED POINT	FIXED POINT	FIXED POINT	FIXED POINT	FIXED POINT	FIXED POINT
集成缓存	NO	NO	NO	NO	NO	NO	NO	NO	NO	NO
JESD-30 代码	S-PQFP-G80	S-PQFP-G80	S-PQFP-G80	S-PQFP-G80	S-PQFP-G80	S-PQFP-G80	S-PQFP-G80	S-PQFP-G80	S-PQCC-J84	S-PQFP-G80
长度	12 mm	12 mm	12 mm	12 mm	12 mm	12 mm	12 mm	12 mm	29.3116 mm	12 mm
低功率模式	YES	YES	YES	YES	YES	YES	YES	YES	YES	YES
端子数量	80	80	80	80	80	80	80	80	84	80
最高工作温度	85 °C	85 °C	70 °C	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C
最低工作温度	-40 °C	-40 °C	-	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C
封装主体材料	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
封装代码	LFQFP	LFQFP	LFQFP	LFQFP	LFQFP	LFQFP	LFQFP	LFQFP	QCCJ	LFQFP
封装形状	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE
封装形式	FLATPACK, LOW PROFILE, FINE PITCH	FLATPACK, LOW PROFILE, FINE PITCH	FLATPACK, LOW PROFILE, FINE PITCH	FLATPACK, LOW PROFILE, FINE PITCH	FLATPACK, LOW PROFILE, FINE PITCH	FLATPACK, LOW PROFILE, FINE PITCH	FLATPACK, LOW PROFILE, FINE PITCH	FLATPACK, LOW PROFILE, FINE PITCH	CHIP CARRIER	FLATPACK, LOW PROFILE, FINE PITCH
认证状态	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
座面最大高度	1.66 mm	1.66 mm	1.66 mm	1.66 mm	1.66 mm	1.66 mm	1.66 mm	1.66 mm	4.83 mm	1.66 mm
速度	20 MHz	13 MHz	8 MHz	8 MHz	8 MHz	20 MHz	13 MHz	13 MHz	8 MHz	13 MHz
最大供电电压	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V
最小供电电压	4.5 V	4.5 V	2.7 V	2.7 V	2.7 V	4.5 V	4.5 V	2.7 V	2.7 V	2.7 V
标称供电电压	5 V	5 V	3 V	3 V	3 V	5 V	5 V	3 V	3 V	3 V
表面贴装	YES	YES	YES	YES	YES	YES	YES	YES	YES	YES
技术	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
温度等级	INDUSTRIAL	INDUSTRIAL	COMMERCIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
端子形式	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING	J BEND	GULL WING
端子节距	0.5 mm	0.5 mm	0.5 mm	0.5 mm	0.5 mm	0.5 mm	0.5 mm	0.5 mm	1.27 mm	0.5 mm
端子位置	QUAD	QUAD	QUAD	QUAD	QUAD	QUAD	QUAD	QUAD	QUAD	QUAD
宽度	12 mm	12 mm	12 mm	12 mm	12 mm	12 mm	12 mm	12 mm	29.3116 mm	12 mm
uPs/uCs/外围集成电路类型	MICROPROCESSOR	MICROPROCESSOR	MICROPROCESSOR	MICROPROCESSOR	MICROPROCESSOR	MICROPROCESSOR	MICROPROCESSOR	MICROPROCESSOR	MICROPROCESSOR	MICROPROCESSOR
厂商名称	Intel(英特尔)	Intel(英特尔)	Intel(英特尔)	Intel(英特尔)	-	Intel(英特尔)	Intel(英特尔)	Intel(英特尔)	Intel(英特尔)	Intel(英特尔)
ECCN代码	3A991.A.2	3A991.A.2	3A001.A.2.C	-	-	3A991.A.2	3A991.A.2	3A991.A.2	-	3A991.A.2
其他特性	DRAM REFRESH CONTROLLER; 3 PROGRAMMABLE TIMERS; EMULATION HARDWARE	DRAM REFRESH CONTROLLER; 3 PROGRAMMABLE TIMERS; EMULATION HARDWARE	-	DRAM REFRESH CONTROLLER; 3 PROGRAMMABLE TIMERS; EMULATION HARDWARE	DRAM REFRESH CONTROLLER; 3 PROGRAMMABLE TIMERS; EMULATION HARDWARE	DRAM REFRESH CONTROLLER; 3 PROGRAMMABLE TIMERS; EMULATION HARDWARE	DRAM REFRESH CONTROLLER; 3 PROGRAMMABLE TIMERS; EMULATION HARDWARE	DRAM REFRESH CONTROLLER; 3 PROGRAMMABLE TIMERS; EMULATION HARDWARE	DRAM REFRESH CONTROLLER; 3 PROGRAMMABLE TIMERS; EMULATION HARDWARE	DRAM REFRESH CONTROLLER; 3 PROGRAMMABLE TIMERS; EMULATION HARDWARE
外部中断装置数量	6	6	-	6	6	6	6	6	6	6
串行 I/O 数	2	2	-	2	2	2	2	2	2	2
最大压摆率	108 mA	73 mA	-	45 mA	45 mA	108 mA	73 mA	73 mA	45 mA	73 mA
Base Number Matches	1	1	1	1	1	1	-	-	-	-

TSB80C188EB20

TSB80C188EB20概述

TSB80C188EB20规格参数

TSB80C188EB20相似产品对比

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