MASK ROM, 4MX16, 100ns, CMOS, PDSO44, 0.400 INCH, PLASTIC, TSOP2-44
| 参数名称 | 属性值 |
| 厂商名称 | SK Hynix(海力士) |
| 零件包装代码 | TSOP2 |
| 包装说明 | 0.400 INCH, PLASTIC, TSOP2-44 |
| 针数 | 44 |
| Reach Compliance Code | unknown |
| ECCN代码 | EAR99 |
| 最长访问时间 | 100 ns |
| 备用内存宽度 | 8 |
| JESD-30 代码 | R-PDSO-G44 |
| JESD-609代码 | e6 |
| 长度 | 18.41 mm |
| 内存密度 | 67108864 bit |
| 内存集成电路类型 | MASK ROM |
| 内存宽度 | 16 |
| 功能数量 | 1 |
| 端子数量 | 44 |
| 字数 | 4194304 words |
| 字数代码 | 4000000 |
| 工作模式 | ASYNCHRONOUS |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 组织 | 4MX16 |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | TSOP2 |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, THIN PROFILE |
| 并行/串行 | PARALLEL |
| 认证状态 | Not Qualified |
| 座面最大高度 | 1.2 mm |
| 最大供电电压 (Vsup) | 3.6 V |
| 最小供电电压 (Vsup) | 3 V |
| 标称供电电压 (Vsup) | 3.3 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | COMMERCIAL |
| 端子面层 | TIN BISMUTH |
| 端子形式 | GULL WING |
| 端子节距 | 0.8 mm |
| 端子位置 | DUAL |
| 宽度 | 10.16 mm |
| Base Number Matches | 1 |
| HY23V64200T-100 | HY23V64200S-100 | HY23V64200T-120 | HY23V64200M-100 | HY23V64200F-120 | HY23V64200F-100 | HY23V64200M-120 | HY23V64200S-120 | |
|---|---|---|---|---|---|---|---|---|
| 描述 | MASK ROM, 4MX16, 100ns, CMOS, PDSO44, 0.400 INCH, PLASTIC, TSOP2-44 | MASK ROM, 4MX16, 100ns, CMOS, PDSO44, 0.500 INCH, PLASTIC, SOP-44 | MASK ROM, 4MX16, 120ns, CMOS, PDSO44, 0.400 INCH, PLASTIC, TSOP2-44 | MASK ROM, 4MX16, 100ns, CMOS, PDSO48, 12 X 20 MM, PLASTIC, TSOP1-48 | MASK ROM, 4MX16, 120ns, CMOS, PDSO48, 12 X 20 MM, PLASTIC, TSOP1-48 | MASK ROM, 4MX16, 100ns, CMOS, PDSO48, 12 X 20 MM, PLASTIC, TSOP1-48 | MASK ROM, 4MX16, 120ns, CMOS, PDSO48, 12 X 20 MM, PLASTIC, TSOP1-48 | MASK ROM, 4MX16, 120ns, CMOS, PDSO44, 0.500 INCH, PLASTIC, SOP-44 |
| 厂商名称 | SK Hynix(海力士) | SK Hynix(海力士) | SK Hynix(海力士) | SK Hynix(海力士) | SK Hynix(海力士) | SK Hynix(海力士) | SK Hynix(海力士) | SK Hynix(海力士) |
| 零件包装代码 | TSOP2 | SOIC | TSOP2 | TSOP1 | TSOP1 | TSOP1 | TSOP1 | SOIC |
| 包装说明 | 0.400 INCH, PLASTIC, TSOP2-44 | 0.500 INCH, PLASTIC, SOP-44 | TSOP2, | TSOP1, | TSOP1, | TSOP1, | TSOP1, | SOP, |
| 针数 | 44 | 44 | 44 | 48 | 48 | 48 | 48 | 44 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| 最长访问时间 | 100 ns | 100 ns | 120 ns | 100 ns | 120 ns | 100 ns | 120 ns | 120 ns |
| 备用内存宽度 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| JESD-30 代码 | R-PDSO-G44 | R-PDSO-G44 | R-PDSO-G44 | R-PDSO-G48 | R-PDSO-G48 | R-PDSO-G48 | R-PDSO-G48 | R-PDSO-G44 |
| 长度 | 18.41 mm | 28.5 mm | 18.41 mm | 18.4 mm | 18.4 mm | 18.4 mm | 18.4 mm | 28.5 mm |
| 内存密度 | 67108864 bit | 67108864 bit | 67108864 bit | 67108864 bit | 67108864 bit | 67108864 bit | 67108864 bit | 67108864 bit |
| 内存集成电路类型 | MASK ROM | MASK ROM | MASK ROM | MASK ROM | MASK ROM | MASK ROM | MASK ROM | MASK ROM |
| 内存宽度 | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 44 | 44 | 44 | 48 | 48 | 48 | 48 | 44 |
| 字数 | 4194304 words | 4194304 words | 4194304 words | 4194304 words | 4194304 words | 4194304 words | 4194304 words | 4194304 words |
| 字数代码 | 4000000 | 4000000 | 4000000 | 4000000 | 4000000 | 4000000 | 4000000 | 4000000 |
| 工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| 最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
| 组织 | 4MX16 | 4MX16 | 4MX16 | 4MX16 | 4MX16 | 4MX16 | 4MX16 | 4MX16 |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | TSOP2 | SOP | TSOP2 | TSOP1 | TSOP1 | TSOP1 | TSOP1 | SOP |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE |
| 并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 1.2 mm | 3.2 mm | 1.2 mm | 1.2 mm | 1.2 mm | 1.2 mm | 1.2 mm | 3.2 mm |
| 最大供电电压 (Vsup) | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V |
| 最小供电电压 (Vsup) | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V |
| 标称供电电压 (Vsup) | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| 表面贴装 | YES | YES | YES | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| 端子形式 | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING |
| 端子节距 | 0.8 mm | 1.27 mm | 0.8 mm | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm | 1.27 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| 宽度 | 10.16 mm | 12.6 mm | 10.16 mm | 12 mm | 12 mm | 12 mm | 12 mm | 12.6 mm |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| JESD-609代码 | e6 | - | e6 | e6 | e6 | e6 | e6 | - |
| 端子面层 | TIN BISMUTH | - | TIN BISMUTH | TIN BISMUTH | TIN BISMUTH | TIN BISMUTH | TIN BISMUTH | - |
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