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5962-9206202MYC

产品描述UV PLD, 45ns, 192-Cell, CMOS, CPGA84,
产品类别可编程逻辑器件    可编程逻辑   
文件大小84KB,共6页
制造商Cypress(赛普拉斯)
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5962-9206202MYC概述

UV PLD, 45ns, 192-Cell, CMOS, CPGA84,

5962-9206202MYC规格参数

参数名称属性值
厂商名称Cypress(赛普拉斯)
包装说明WPGA, PGA84M,11X11
Reach Compliance Codeunknown
ECCN代码3A001.A.2.C
其他特性LABS INTERCONNECTED BY PIA; 12 LABS; 192 MACROCELLS; 1 EXTERNAL CLOCK; SHARED INPUT/CLOCK
最大时钟频率40 MHz
系统内可编程NO
JESD-30 代码S-CPGA-P84
JESD-609代码e4
JTAG BSTNO
长度27.94 mm
专用输入次数7
I/O 线路数量64
宏单元数192
端子数量84
最高工作温度125 °C
最低工作温度-55 °C
组织7 DEDICATED INPUTS, 64 I/O
输出函数MACROCELL
封装主体材料CERAMIC, METAL-SEALED COFIRED
封装代码WPGA
封装等效代码PGA84M,11X11
封装形状SQUARE
封装形式GRID ARRAY, WINDOW
电源5 V
可编程逻辑类型UV PLD
传播延迟45 ns
认证状态Not Qualified
筛选级别38535Q/M;38534H;883B
座面最大高度3.81 mm
最大供电电压5.5 V
最小供电电压4.5 V
标称供电电压5 V
表面贴装NO
技术CMOS
温度等级MILITARY
端子面层GOLD
端子形式PIN/PEG
端子节距2.54 mm
端子位置PERPENDICULAR
宽度27.94 mm
Base Number Matches1

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EPLD
CY7C340 EPLD Family
Multiple Array Matrix High-Density EPLDs
Features
• Erasable, user-configurable CMOS EPLDs capable of
implementing high-density custom logic functions
• 0.8-micron double-metal CMOS EPROM technology
(CY7C34X)
• Advanced 0.65-micron CMOS technology to increase
performance (CY7C34XB)
• Multiple Array MatriX architecture optimized for speed,
density, and straightforward design implementation
— Programmable Interconnect Array (PIA) simplifies
routing
— Flexible macrocells increase utilization
— Programmable clock control
— Expander product terms implement complex logic
functions
CY7C342B. This allows the designer to replace 50 or more
TTL packages with just one MAX EPLD. The family comes in
a range of densities, shown below. By standardizing on a few
MAX building blocks, the designer can replace hundreds of
different 7400 series part numbers currently used in most dig-
ital systems.
The family is based on an architecture of flexible macrocells
grouped together into Logic Array Blocks (LABs). Within the
LAB is a group of additional product terms called expander
product terms. These expanders are used and shared by the
macrocells, allowing complex functions of up to 35 product
terms to be easily implemented in a single macrocell. A Pro-
grammable Interconnect Array (PIA) globally routes all signals
within devices containing more than one LAB. This architec-
ture is fabricated on the Cypress 0.8-micron, double-lay-
er-metal CMOS EPROM process, yielding devices with signif-
icantly higher integration, density and system clock speed than
the largest of previous generation EPLDs. The CY7C34XB de-
vices are 0.65-micron shrinks of the original 0.8-micron family.
The CY7C34XBs offer faster speed bins for each device in the
Cypress MAX family.
The density and performance of the CY7C340 family is ac-
cessed using Cypress’s
Warp™, Warp
Professional™, or
Warp
Enterprise™ design software.
Warp
provides
state-of-the-art synthesis, fitting, simulation and other devel-
opment tools at a very low cost.
Warp
Professional or
Warp
Enterprise are sophisticated CAE tool that include behavior-
al simulation, graphical waveform editing and more. Consult
the datasheets for
Warp, Warp
Professional and
Warp
Enter-
prise™ for more information about these development tools.
General Description
The Cypress Multiple Array Matrix (MAX®) family of EPLDs
provides a user-configurable, high-density solution to gener-
al-purpose logic integration requirements. With the combina-
tion of innovative architecture and state-of-the-art process, the
MAX EPLDs offer LSI density without sacrificing speed.
The MAX architecture makes it ideal for replacing large
amounts of TTL SSI and MSI logic. For example, a 74161
counter utilizes only 3% of the 128 macrocells available in the
CY7C342B. Similarly, a 74151 8-to-1 multiplexer consumes
less than 1% of the over 1,000 product terms in the
Max Family Members
Feature
Macrocells
MAX Flip-Flops
MAX Latches
[1]
MAX Inputs
[2]
MAX Outputs
Packages
CY7C344(B)
32
32
64
23
16
28H,J,W,P
CY7C343(B)
64
64
128
35
28
44H,J
CY7C342B
128
128
256
59
52
68H,J,R
CY7C346(B)
128
128
256
84
64
84H,J 100R,N
CY7C341B
192
192
384
71
64
84H,J,R
Key: P—Plastic DIP; H—Windowed Ceramic Leaded Chip Carrier; J—Plastic J-Lead Chip Carrier; R—Windowed Pin Grid Array;
W—Windowed Ceramic DIP; N—Plastic Quad Flat Pack
Notes:
1. When all expander product terms are used to implement latches.
2. With one output.
PAL is a registered trademark of Advanced Micro Devices.
MAX is a registered trademark of Altera Corporation.
F
LASH
370,
Warp, Warp
Professional, and
Warp
Enterprise are trademarks of Cypress Semiconductor Corporation.
Cypress Semiconductor Corporation
3901 North First Street
San Jose
CA 95134
408-943-2600
July 19, 2000

5962-9206202MYC相似产品对比

5962-9206202MYC 5962-9314401MZC 5962-9314402MUA 5962-9314402MZC 5962-9314401MUA 5962-9206203MXA 5962-9061102YA 5962-9215802MXA 5962-9061102XA
描述 UV PLD, 45ns, 192-Cell, CMOS, CPGA84, UV PLD, 75ns, 128-Cell, CMOS, CPGA100, WINDOWED, CERAMIC, PGA-100 UV PLD, 59ns, 128-Cell, CMOS, CQCC84, WINDOWED, CERAMIC, LCC-84 UV PLD, 59ns, 128-Cell, CMOS, CPGA100, WINDOWED, CERAMIC, PGA-100 UV PLD, 75ns, 128-Cell, CMOS, CQCC84, WINDOWED, CERAMIC, LCC-84 UV PLD, 75ns, 192-Cell, CMOS, CQCC84, WINDOWED, CERAMIC, LCC-84 UV PLD, 40ns, PAL-Type, CMOS, CQCC28, WINDOWED, CERAMIC, LCC-28 UV PLD, 58ns, 64-Cell, CMOS, CQCC44, WINDOWED, CERAMIC, LCC-44 UV PLD, 40ns, PAL-Type, CMOS, CDIP28, 0.300 INCH, WINDOWED, CERDIP-28
厂商名称 Cypress(赛普拉斯) Cypress(赛普拉斯) Cypress(赛普拉斯) Cypress(赛普拉斯) Cypress(赛普拉斯) Cypress(赛普拉斯) Cypress(赛普拉斯) Cypress(赛普拉斯) Cypress(赛普拉斯)
包装说明 WPGA, PGA84M,11X11 WPGA, PGA100M,13X13 WINDOWED, CERAMIC, LCC-84 WPGA, PGA100M,13X13 WINDOWED, CERAMIC, LCC-84 WQCCJ, LDCC84,1.2SQ WINDOWED, CERAMIC, LCC-28 WINDOWED, CERAMIC, LCC-44 0.300 INCH, WINDOWED, CERDIP-28
Reach Compliance Code unknown unknown not_compliant unknown not_compliant unknown not_compliant not_compliant not_compliant
ECCN代码 3A001.A.2.C 3A001.A.2.C 3A001.A.2.C 3A001.A.2.C 3A001.A.2.C 3A001.A.2.C 3A001.A.2.C 3A001.A.2.C 3A001.A.2.C
其他特性 LABS INTERCONNECTED BY PIA; 12 LABS; 192 MACROCELLS; 1 EXTERNAL CLOCK; SHARED INPUT/CLOCK LABS INTERCONNECTED BY PIA; 8 LABS; 128 MACROCELLS; 1 EXTERNAL CLOCK; SHARED INPUT/CLOCK LABS INTERCONNECTED BY PIA; 8 LABS; 128 MACROCELLS; 1 EXTERNAL CLOCK; SHARED INPUT/CLOCK LABS INTERCONNECTED BY PIA; 8 LABS; 128 MACROCELLS; 1 EXTERNAL CLOCK; SHARED INPUT/CLOCK LABS INTERCONNECTED BY PIA; 8 LABS; 128 MACROCELLS; 1 EXTERNAL CLOCK; SHARED INPUT/CLOCK LABS INTERCONNECTED BY PIA; 12 LABS; 192 MACROCELLS; 1 EXTERNAL CLOCK; SHARED INPUT/CLOCK MACROCELLS INTERCONNECTED BY PIA; 32 MACROCELLS; 1 EXTERNAL CLOCK; SHARED INPUT/CLOCK LABS INTERCONNECTED BY PIA; 4 LABS; 64 MACROCELLS; 1 EXTERNAL CLOCK; SHARED INPUT/CLOCK MACROCELLS INTERCONNECTED BY PIA; 32 MACROCELLS; 1 EXTERNAL CLOCK; SHARED INPUT/CLOCK
最大时钟频率 40 MHz 22.2 MHz 27.7 MHz 27.7 MHz 22.2 MHz 22.2 MHz 27 MHz 27 MHz 27 MHz
JESD-30 代码 S-CPGA-P84 S-CPGA-P100 S-CQCC-J84 S-CPGA-P100 S-CQCC-J84 S-CQCC-J84 S-CQCC-J28 S-CQCC-J44 R-GDIP-T28
JESD-609代码 e4 e4 e0 e4 e0 e0 e0 e0 e0
长度 27.94 mm 33.3375 mm 29.21 mm 33.3375 mm 29.21 mm 29.21 mm 11.43 mm 16.51 mm 37.0205 mm
专用输入次数 7 19 19 19 19 7 7 7 7
I/O 线路数量 64 64 48 64 48 64 16 28 16
端子数量 84 100 84 100 84 84 28 44 28
最高工作温度 125 °C 125 °C 125 °C 125 °C 125 °C 125 °C 125 °C 125 °C 125 °C
最低工作温度 -55 °C -55 °C -55 °C -55 °C -55 °C -55 °C -55 °C -55 °C -55 °C
组织 7 DEDICATED INPUTS, 64 I/O 19 DEDICATED INPUTS, 64 I/O 19 DEDICATED INPUTS, 48 I/O 19 DEDICATED INPUTS, 64 I/O 19 DEDICATED INPUTS, 48 I/O 7 DEDICATED INPUTS, 64 I/O 7 DEDICATED INPUTS, 16 I/O 7 DEDICATED INPUTS, 28 I/O 7 DEDICATED INPUTS, 16 I/O
输出函数 MACROCELL MACROCELL MACROCELL MACROCELL MACROCELL MACROCELL MACROCELL MACROCELL MACROCELL
封装主体材料 CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, GLASS-SEALED
封装代码 WPGA WPGA WQCCJ WPGA WQCCJ WQCCJ WQCCJ WQCCJ WDIP
封装等效代码 PGA84M,11X11 PGA100M,13X13 LDCC84,1.2SQ PGA100M,13X13 LDCC84,1.2SQ LDCC84,1.2SQ LDCC28,.5SQ LDCC44,.7SQ DIP28,.3
封装形状 SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE RECTANGULAR
封装形式 GRID ARRAY, WINDOW GRID ARRAY, WINDOW CHIP CARRIER, WINDOW GRID ARRAY, WINDOW CHIP CARRIER, WINDOW CHIP CARRIER, WINDOW CHIP CARRIER, WINDOW CHIP CARRIER, WINDOW IN-LINE, WINDOW
电源 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V
可编程逻辑类型 UV PLD UV PLD UV PLD UV PLD UV PLD UV PLD UV PLD UV PLD UV PLD
传播延迟 45 ns 75 ns 59 ns 59 ns 75 ns 75 ns 40 ns 58 ns 40 ns
认证状态 Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
筛选级别 38535Q/M;38534H;883B MIL-STD-883 MIL-STD-883 MIL-STD-883 MIL-STD-883 MIL-STD-883 38535Q/M;38534H;883B MIL-STD-883 38535Q/M;38534H;883B
座面最大高度 3.81 mm 5.207 mm 5.08 mm 5.207 mm 5.08 mm 5.08 mm 4.572 mm 4.572 mm 5.08 mm
最大供电电压 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V
最小供电电压 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V
标称供电电压 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V
表面贴装 NO NO YES NO YES YES YES YES NO
技术 CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS
温度等级 MILITARY MILITARY MILITARY MILITARY MILITARY MILITARY MILITARY MILITARY MILITARY
端子面层 GOLD GOLD Tin/Lead (Sn/Pb) - hot dipped GOLD Tin/Lead (Sn/Pb) - hot dipped TIN LEAD Tin/Lead (Sn/Pb) - hot dipped Tin/Lead (Sn/Pb) - hot dipped Tin/Lead (Sn/Pb) - hot dipped
端子形式 PIN/PEG PIN/PEG J BEND PIN/PEG J BEND J BEND J BEND J BEND THROUGH-HOLE
端子节距 2.54 mm 2.54 mm 1.27 mm 2.54 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm 2.54 mm
端子位置 PERPENDICULAR PERPENDICULAR QUAD PERPENDICULAR QUAD QUAD QUAD QUAD DUAL
宽度 27.94 mm 33.3375 mm 29.21 mm 33.3375 mm 29.21 mm 29.21 mm 11.43 mm 16.51 mm 7.62 mm
Base Number Matches 1 1 1 1 1 1 1 1 1
系统内可编程 NO NO NO NO NO NO - NO -
JTAG BST NO NO NO NO NO NO - NO -
宏单元数 192 128 128 128 128 192 - 64 -
零件包装代码 - PGA LCC PGA LCC LCC QLCC LCC DIP
针数 - 100 84 100 84 84 28 44 28
是否Rohs认证 - - 不符合 - 不符合 - 不符合 不符合 不符合
峰值回流温度(摄氏度) - - NOT SPECIFIED - NOT SPECIFIED - 225 225 NOT SPECIFIED
处于峰值回流温度下的最长时间 - - NOT SPECIFIED - NOT SPECIFIED - 30 30 NOT SPECIFIED

 
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