电子工程世界电子工程世界电子工程世界

关键词

搜索

型号

搜索

HDSM3-200SL5A2-0.5

产品描述200 CONTACT(S), FEMALE, STRAIGHT TELECOM AND DATACOM CONNECTOR, SOLDER, RECEPTACLE
产品类别连接器    连接器   
文件大小303KB,共4页
制造商TE Connectivity(泰科)
官网地址http://www.te.com
下载文档 详细参数 全文预览

HDSM3-200SL5A2-0.5概述

200 CONTACT(S), FEMALE, STRAIGHT TELECOM AND DATACOM CONNECTOR, SOLDER, RECEPTACLE

HDSM3-200SL5A2-0.5规格参数

参数名称属性值
厂商名称TE Connectivity(泰科)
Reach Compliance Codeunknown
其他特性STANDRD: MIL-DTL-55302, POLARIZED
主体/外壳类型RECEPTACLE
连接器类型TELECOM AND DATACOM CONNECTOR
联系完成配合GOLD (50) OVER COPPER
联系完成终止GOLD (50) OVER COPPER
触点性别FEMALE
DIN 符合性NO
空壳NO
滤波功能NO
IEC 符合性NO
绝缘体材料LIQUID CRYSTAL POLYMER
JESD-609代码e4
MIL 符合性YES
制造商序列号HDSM
插接信息MULTIPLE MATING PARTS AVAILABLE
混合触点NO
安装方式STRAIGHT
安装类型BOARD AND PANEL
选件GENERAL PURPOSE
外壳面层NICKEL
外壳材料ALUMINUM ALLOY
端接类型SOLDER
触点总数200
Base Number Matches1

文档预览

下载PDF文档
Rectangular Connectors
High Density Standard Module (HDSM) Connectors
Features
I
Designed for surface
mounting on both daughter
board and mother board for
increased circuit density
Basic design offers 38, 78,
120, 152, 200, 304, and 400
contact designs
High reliability twist pin and
socket per MIL-DTL-83513
and MIL-DTL-55302
Connector permits lateral
movement of daughter
board to accommodate
clamping of the heatsink
Plated through-hole
mounting available
Available with flying leads
Extender card option
available
Typical mating force for 304
contacts is 38 pounds
Designed to withstand vapor
phase soldering
Two rotatable (six position)
polarizing keys are provided
accommodating 36 possible
combinations
Jackscrew hardware
available; consult
Tyco Electronics
Different modular inserts
may be specified to include
coax (Pixi/Con), fiber optic
or other special contacts
Inserts may be partially or
fully loaded and installed in
the connector shell in
various configurations
The MICRODOT HDSM
connector is designed for
4 row .050 [1.27] pitch
density with a special low
force twist pin that meets
all requirements of MIL-
DTL-55302 and MIL-DTL-
83513. This high density
connector allows the use of
construction to double the
packaging density with
surface mount capability.
I
I
I
Rectangular
Connectors
I
I
I
I
I
I
2
I
I
Performance Data Summary
Electrical
Contacts
— Pin 24 AWG twist pin,
Socket #24 AWG, Wire range 24 AWG to
32 AWG solid and stranded.
Contact Resistance (voltage drop)
25 millivolts max. at 3 amps, 25° ± 3° C.
Current Rating
— 3 amps max. per
contact
Dielectric Withstanding Voltage
Volts RMS 60 Hz at room ambient:
600 V for solder pots at sea level.
150 V for solder pots at 70,000 ft.
[21,336m]
500 V for wire terminations at sea level.
200 V for wire terminations at 70,000 ft.
Insulation Resistance
— 5,000
megohms min. at room ambient.
Magnetic Permeability
— 2 mµ max.
Materials and Finishes
Contacts
— Copper alloy plated with
.000050 [0.00127] gold over copper
flash per MIL-G-45204, Type II.
Metal Shell
Insulator — Liquid Crystal Polymer
(LCP) per ASTM D5138 or
Polyphenylene Sulfide per
MIL-M-24519
Body Shell — Aluminum alloy plated
Nickel, electroless per MIL-C-26074.
I
Environmental
Temperature Range
-67°F to 257°F [-55° C to +125° C].
Vibration
— No discontinuity in
excess of 1 micro sec. when tested in
accordance with MIL-STD-1344,
Method 2005, test Condition IV.
Insulator Retention
— Inserts will
withstand a 50 lb. per square inch load
in either direction.
Shock
— No discontinuity in excess of
1 micro sec. when tested in accordance
with MIL-STD-1344, Method 2004, test
Condition E.
Mechanical
Contact Spacing
— .050 [1.27] centers
Contact Engagement &
Separation
— 5.0 oz max. [1.39N]
(eng.) 0.5 oz. min. [.14N] 3.5 oz. typ.
[.97N] (sep.) force.
Durability
— No mechanical or electri-
cal defects detrimental to the function of
the connectors after 500 cycles of mat-
ing and unmating. (Caution: Mating
force increases during durability cycling
may be noted).
Humidity
— After exposure to humidi-
ty as specified by MIL-STD-1344,
Method 1002, Type II, IR shall be 1
megohm min. immediately following
step 7a of Method 1002 and 1000
megohms min. after 24 hours of condi-
tioning per Method 1002.
Salt Spray
— Connectors shall meet
the performance requirements of contact
resistance, mating and unmating forces,
and contact retention after being subject-
ed to the 48-hour 5% solution salt spray
test per MIL-STD-1344, Method 1001,
Condition B.
Crimp Termination Tensile
Strength
— *Unassembled contacts
with crimped stranded wire terminations.
Wires will not pull out of contacts when
the following axial loads are applied:
24 AWG, 5 lbs., 26 AWG, 4 lbs.,
28 AWG, 3 lbs.
51
Catalog 1308638
Revised 8-05
www.tycoelectronics.com
Dimensions are in inches and
millimeters unless otherwise
specified. Values in brackets
are metric equivalents.
Dimensions are shown for
reference purposes only.
Specifications subject
to change.
USA: 1-800-522-6752
Canada: 1-905-470-4425
Mexico: 01-800-733-8926
C. America: 52-55-5-729-0425
South America: 55-11-3611-1514
Hong Kong: 852-2735-1628
Japan: 81-44-844-8013
UK: 44-141-810-8967
急救!关于protel 99se的仿真
当我在对一个电路进行仿真时总是出现这些错误,但我又不知道什么意思,请各位高手指点一下。 非常感谢!:):):):):):):):):):):):):) C3 Error: Pin order d ......
yang_swust PCB设计
【TI毫米波雷达测评】传感器管理模块介绍
本帖最后由 a736015 于 2019-12-27 15:50 编辑 IWR1443BOOST开箱测试:https://bbs.eeworld.com.cn/thread-1101610-1-1.html SDK及例程下载:https://bbs.eeworld.com.cn/thread-1102315- ......
a736015 TI技术论坛
尋找 ARM SoC 內嵌 BT4.0 + WiFi 跑 Linux 的平台的方案
最近有個案子要開發 要做一個體積相當小的Linux系統 且內需含BT4.0及WiFi功能 扣掉核心線路必須的DDRx及Nand Flash, 鋰電池, 電源管理及其它必須的周邊元器件連接器等 真的也沒多少空間可以 ......
william77 ARM技术
nRF24L01无线数据传输电路
芯片适用,nRF24L01无线数据传输电路,nRF24L01引脚说明及封装图。 资源连接: https://download.eeworld.com.cn/detail/lbk747/948...
lbk747 无线连接
IPCWorks Asia 2008十月引领绿色制造潮流
从无铅、RoHS到无卤素,再到PoHS,业界对环保材料的“门槛”越设越高,未来的绿色之路将走向何处?今年10月15-16日高交会电子展期间,品牌研讨会"IPCWorks Asia"将再次在深圳举办,本届会议的主 ......
clj2004000 PCB设计
运放做跟随器用
本帖最后由 dontium 于 2015-1-23 12:53 编辑 还是来说说跟随器吧,我是采用AD转换,把模拟信号采取回来,后用了个跟随器。但是跟随回来的电压不稳定,在数码管上有斗动。运放是LM358 ......
649631964 模拟与混合信号

 
EEWorld订阅号

 
EEWorld服务号

 
汽车开发圈

 
机器人开发圈

About Us 关于我们 客户服务 联系方式 器件索引 网站地图 最新更新 手机版

站点相关: 大学堂 TI培训 Datasheet 电子工程 索引文件: 2727  1010  1861  680  1073  55  21  38  14  22 

器件索引   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

北京市海淀区中关村大街18号B座15层1530室 电话:(010)82350740 邮编:100190

电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved