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MX25L6473EM2R-12G: 产品描述Flash, 16MX4, PDSO8, SOP-8; 产品类别存储存储; 文件大小1MB，共87页; 制造商Macronix; 官网地址http://www.macronix.com/en-us/Pages/default.aspx

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MX25L6473EM2R-12G概述

Flash, 16MX4, PDSO8, SOP-8

MX25L6473EM2R-12G规格参数

参数名称	属性值
厂商名称	Macronix
包装说明	SOP,
Reach Compliance Code	unknown
其他特性	ALSO ORGANISED AS 64M X1
备用内存宽度	2
JESD-30 代码	R-PDSO-G8
长度	5.28 mm
内存密度	67108864 bit
内存集成电路类型	FLASH
内存宽度	4
功能数量	1
端子数量	8
字数	16777216 words
字数代码	16000000
工作模式	SYNCHRONOUS
组织	16MX4
封装主体材料	PLASTIC/EPOXY
封装代码	SOP
封装形状	RECTANGULAR
封装形式	SMALL OUTLINE
并行/串行	SERIAL
编程电压	3 V
座面最大高度	2.16 mm
最大供电电压 (Vsup)	3.6 V
最小供电电压 (Vsup)	2.7 V
标称供电电压 (Vsup)	3 V
表面贴装	YES
技术	CMOS
端子形式	GULL WING
端子节距	1.27 mm
端子位置	DUAL
宽度	5.23 mm
Base Number Matches	1

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MX25L6473E

3V, 64M-BIT [x 1/x 2/x 4]

CMOS MXSMIO

(SERIAL MULTI I/O)

FLASH MEMORY

Key Features

• Multi I/O Support - Single I/O, Dual I/O and Quad I/O

• Auto Erase and Auto Program Algorithms

• Continuous Program mode

• Permanently fixed QE bit, QE=1; and 4 I/O mode is enabled

P/N: PM1907

REV. 1.4, JUN. 16, 2015

MX25L6473E

Contents

1. FEATURES ........................................................................................................................................................ 4

2. GENERAL DESCRIPTION ............................................................................................................................... 6

Table 1. Read Performance ..................................................................................................................6

3. PIN CONFIGURATION ...................................................................................................................................... 7

4. PIN DESCRIPTION ............................................................................................................................................ 7

5. BLOCK DIAGRAM............................................................................................................................................. 8

6. DATA PROTECTION.......................................................................................................................................... 9

Table 2. Protected Area Sizes ..............................................................................................................10

Table 3. 4K-bit Secured OTP Definition

............................................................................................... 11

7. MEMORY ORGANIZATION ............................................................................................................................. 12

Table 4. Memory Organization .............................................................................................................12

8. DEVICE OPERATION ...................................................................................................................................... 13

9. COMMAND DESCRIPTION ............................................................................................................................. 14

Table 5. Command Sets .......................................................................................................................14

9-1. Write Enable (WREN) ..........................................................................................................................17

9-2. Write Disable (WRDI)...........................................................................................................................18

9-3. Read Identification (RDID)

...................................................................................................................19

9-4. Read Status Register (RDSR) .............................................................................................................20

9-5. Write Status Register (WRSR).............................................................................................................23

Table 6. Protection Modes....................................................................................................................24

9-6. Read Data Bytes (READ) ....................................................................................................................26

9-7. Read Data Bytes at Higher Speed (FAST_READ) ..............................................................................27

9-8. Dual Read Mode (DREAD) ..................................................................................................................28

9-9. 2 x I/O Read Mode (2READ) ...............................................................................................................29

9-10. Quad Read Mode (QREAD) ................................................................................................................30

9-11. 4 x I/O Read Mode (4READ) ...............................................................................................................31

9-12. Performance Enhance Mode ...............................................................................................................32

9-13. Performance Enhance Mode Reset (FFh) ...........................................................................................32

9-14. Sector Erase (SE) ................................................................................................................................35

9-15. Block Erase (BE) .................................................................................................................................36

9-16. Block Erase (BE32K) ...........................................................................................................................37

9-17. Chip Erase (CE) ...................................................................................................................................38

9-18. Page Program (PP) .............................................................................................................................39

9-19. 4 x I/O Page Program (4PP) ................................................................................................................40

9-20. Continuous Program mode (CP mode)................................................................................................43

9-21. Deep Power-down (DP) .......................................................................................................................45

9-22. Release from Deep Power-down (RDP), Read Electronic Signature (RES) .......................................46

9-23. Read Electronic Manufacturer ID & Device ID (REMS), (REMS2), (REMS4) .....................................48

9-24. ID Read ................................................................................................................................................49

Table 7. ID Definitions

.........................................................................................................................49

9-25. Enter Secured OTP (ENSO) ................................................................................................................49

9-26. Exit Secured OTP (EXSO) ...................................................................................................................49

9-27. Read Security Register (RDSCUR) .....................................................................................................50

Table 8. Security Register Definition

....................................................................................................51

9-28. Write Security Register (WRSCUR).....................................................................................................52

P/N: PM1907

REV. 1.4, JUN. 16, 2015

MX25L6473E

Write Protection Selection (WPSEL)....................................................................................................52

Single Block Lock/Unlock Protection (SBLK/SBULK) ..........................................................................56

Read Block Lock Status (RDBLOCK) ..................................................................................................59

Gang Block Lock/Unlock (GBLK/GBULK) ...........................................................................................60

Enable SO to Output RY/BY# (ESRY) .................................................................................................61

Disable SO to Output RY/BY# (DSRY) ................................................................................................61

No Operation (NOP) ............................................................................................................................61

Software Reset (Reset-Enable (RSTEN) and Reset (RST)) ...............................................................61

Read SFDP Mode (RDSFDP)..............................................................................................................62

Table 9. Signature and Parameter Identification Data Values

.............................................................63

Table 10. Parameter Table (0): JEDEC Flash Parameter Tables .........................................................64

Table 11. Parameter Table (1): Macronix Flash Parameter Tables.......................................................66

10. POWER-ON STATE ....................................................................................................................................... 68

11. ELECTRICAL SPECIFICATIONS .................................................................................................................. 69

11-1. Absolute Maximum Ratings .................................................................................................................69

11-2. Capacitance .........................................................................................................................................69

Table 12. DC Characteristics................................................................................................................71

Table 13. AC Characteristics ................................................................................................................72

12. TIMING ANALYSIS ........................................................................................................................................ 74

Table 14. Power-Up Timing .................................................................................................................75

12-1. Initial Delivery State .............................................................................................................................75

13. OPERATING CONDITIONS ........................................................................................................................... 76

14. ERASE AND PROGRAMMING PERFORMANCE ........................................................................................ 78

15. DATA RETENTION ........................................................................................................................................ 78

16. LATCH-UP CHARACTERISTICS .................................................................................................................. 78

17. ORDERING INFORMATION .......................................................................................................................... 79

18. PART NAME DESCRIPTION ......................................................................................................................... 80

19. PACKAGE INFORMATION ............................................................................................................................ 81

20. REVISION HISTORY ..................................................................................................................................... 86

9-29.

9-30.

9-31.

9-32.

9-33.

9-34.

9-35.

9-36.

9-37.

P/N: PM1907

REV. 1.4, JUN. 16, 2015

MX25L6473EM2R-12G相似产品对比

	MX25L6473EM2R-12G	MX25L6473EM2I-10G	MX25L6473EBBI-10G	MX25L6473EMBI-10G	MX25L6473EZNI-10G
描述	Flash, 16MX4, PDSO8, SOP-8	IC FLASH 64MBIT	IC FLASH 64MBIT	IC FLASH 64MBIT	IC FLASH 64MBIT
厂商名称	Macronix	Macronix	Macronix	Macronix	Macronix
包装说明	SOP,	SOP, SOP8,.3	VFBGA,	VSOP, TSOP8,.3	HVSON, SOLCC8,.25
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown
其他特性	ALSO ORGANISED AS 64M X1	CAN BE ORGNISED AS 64 MBIT X 1	ALSO CONFIGURABLE AS 64M X 1	CAN BE ORGNISED AS 64 MBIT X 1	CAN BE ORGNISED AS 64 MBIT X 1
备用内存宽度	2	2	2	2	2
JESD-30 代码	R-PDSO-G8	R-PDSO-G8	R-PBGA-B12	S-PDSO-G8	R-PDSO-N8
内存密度	67108864 bit	67108864 bit	67108864 bit	67108864 bit	67108864 bit
内存集成电路类型	FLASH	FLASH	FLASH	FLASH	FLASH
内存宽度	4	4	4	4	4
功能数量	1	1	1	1	1
端子数量	8	8	12	8	8
字数	16777216 words	16777216 words	16777216 words	16777216 words	16777216 words
字数代码	16000000	16000000	16000000	16000000	16000000
工作模式	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS
组织	16MX4	16MX4	16MX4	16MX4	16MX4
封装主体材料	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
封装代码	SOP	SOP	VFBGA	VSOP	HVSON
封装形状	RECTANGULAR	RECTANGULAR	RECTANGULAR	SQUARE	RECTANGULAR
封装形式	SMALL OUTLINE	SMALL OUTLINE	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	SMALL OUTLINE, VERY THIN PROFILE	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
并行/串行	SERIAL	SERIAL	SERIAL	SERIAL	SERIAL
编程电压	3 V	2.7 V	2.7 V	2.7 V	2.7 V
座面最大高度	2.16 mm	2.16 mm	0.52 mm	1 mm	0.8 mm
最大供电电压 (Vsup)	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V
最小供电电压 (Vsup)	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V
标称供电电压 (Vsup)	3 V	3 V	3 V	3 V	3 V
表面贴装	YES	YES	YES	YES	YES
技术	CMOS	CMOS	CMOS	CMOS	CMOS
端子形式	GULL WING	GULL WING	BALL	GULL WING	NO LEAD
端子节距	1.27 mm	1.27 mm	0.5 mm	1.27 mm	1.27 mm
端子位置	DUAL	DUAL	BOTTOM	DUAL	DUAL
长度	5.28 mm	5.28 mm	-	5.28 mm	6 mm
宽度	5.23 mm	5.23 mm	-	5.28 mm	5 mm
是否Rohs认证	-	符合	符合	符合	符合
零件包装代码	-	SOIC	-	SOIC	QFN
针数	-	8	-	8	8
Factory Lead Time	-	16 weeks	16 weeks	16 weeks	16 weeks
最大时钟频率 (fCLK)	-	104 MHz	104 MHz	104 MHz	104 MHz
数据保留时间-最小值	-	20	-	20	20
耐久性	-	100000 Write/Erase Cycles	-	100000 Write/Erase Cycles	100000 Write/Erase Cycles
最高工作温度	-	85 °C	85 °C	85 °C	85 °C
最低工作温度	-	-40 °C	-40 °C	-40 °C	-40 °C
封装等效代码	-	SOP8,.3	-	TSOP8,.3	SOLCC8,.25
峰值回流温度（摄氏度）	-	NOT SPECIFIED	260	NOT SPECIFIED	NOT SPECIFIED
电源	-	3/3.3 V	-	3/3.3 V	3/3.3 V
认证状态	-	Not Qualified	-	Not Qualified	Not Qualified
串行总线类型	-	SPI	-	SPI	SPI
最大待机电流	-	0.00004 A	-	0.00004 A	0.00004 A
最大压摆率	-	0.035 mA	-	0.035 mA	0.035 mA
温度等级	-	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
处于峰值回流温度下的最长时间	-	NOT SPECIFIED	40	NOT SPECIFIED	NOT SPECIFIED
类型	-	NOR TYPE	NOR TYPE	NOR TYPE	NOR TYPE
写保护	-	SOFTWARE	-	SOFTWARE	SOFTWARE
ECCN代码	-	-	EAR99	EAR99	EAR99

MX25L6473EM2R-12G

MX25L6473EM2R-12G概述

MX25L6473EM2R-12G规格参数

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