Multiplexer, F/FAST Series, 4-Func, 2 Line Input, 1 Line Output, Inverted Output, TTL, CDIP16, CERAMIC, DIP-16
参数名称 | 属性值 |
是否无铅 | 含铅 |
是否Rohs认证 | 不符合 |
厂商名称 | Fairchild |
零件包装代码 | DIP |
包装说明 | CERAMIC, DIP-16 |
针数 | 16 |
Reach Compliance Code | unknown |
系列 | F/FAST |
JESD-30 代码 | R-GDIP-T16 |
JESD-609代码 | e0 |
长度 | 19.43 mm |
逻辑集成电路类型 | MULTIPLEXER |
功能数量 | 4 |
输入次数 | 2 |
输出次数 | 1 |
端子数量 | 16 |
最高工作温度 | 125 °C |
最低工作温度 | -55 °C |
输出极性 | INVERTED |
封装主体材料 | CERAMIC, GLASS-SEALED |
封装代码 | DIP |
封装等效代码 | DIP16,.3 |
封装形状 | RECTANGULAR |
封装形式 | IN-LINE |
峰值回流温度(摄氏度) | NOT SPECIFIED |
电源 | 5 V |
Prop。Delay @ Nom-Sup | 10.5 ns |
传播延迟(tpd) | 8 ns |
认证状态 | Not Qualified |
座面最大高度 | 5.08 mm |
最大供电电压 (Vsup) | 5.5 V |
最小供电电压 (Vsup) | 4.5 V |
标称供电电压 (Vsup) | 5 V |
表面贴装 | NO |
技术 | TTL |
温度等级 | MILITARY |
端子面层 | Tin/Lead (Sn/Pb) |
端子形式 | THROUGH-HOLE |
端子节距 | 2.54 mm |
端子位置 | DUAL |
处于峰值回流温度下的最长时间 | NOT SPECIFIED |
宽度 | 7.62 mm |
Base Number Matches | 1 |
54F158ADM | 54F158AFM | YTW-46-07-T-Q-120-050 | 54F158AFMQB | 54F158ADMQB | 54F158ALM | |
---|---|---|---|---|---|---|
描述 | Multiplexer, F/FAST Series, 4-Func, 2 Line Input, 1 Line Output, Inverted Output, TTL, CDIP16, CERAMIC, DIP-16 | Multiplexer, F/FAST Series, 4-Func, 2 Line Input, 1 Line Output, Inverted Output, TTL, CDFP16, CERPACK-16 | Board Stacking Connector, 184 Contact(s), 4 Row(s), Male, Straight, Solder Terminal, ROHS COMPLIANT | Multiplexer, F/FAST Series, 4-Func, 2 Line Input, 1 Line Output, Inverted Output, TTL, CDFP16, CERPACK-16 | Multiplexer, F/FAST Series, 4-Func, 2 Line Input, 1 Line Output, Inverted Output, TTL, CDIP16, CERAMIC, DIP-16 | Multiplexer, F/FAST Series, 4-Func, 2 Line Input, 1 Line Output, Inverted Output, TTL, CQCC20, CERAMIC, LCC-20 |
包装说明 | CERAMIC, DIP-16 | DFP, | ROHS COMPLIANT | DFP, FL16,.3 | DIP, DIP16,.3 | QCCN, |
Reach Compliance Code | unknown | unknown | compliant | unknown | unknown | unknown |
端子节距 | 2.54 mm | 1.27 mm | 2 mm | 1.27 mm | 2.54 mm | 1.27 mm |
是否无铅 | 含铅 | - | 不含铅 | 含铅 | 含铅 | - |
是否Rohs认证 | 不符合 | - | 符合 | 不符合 | 不符合 | - |
零件包装代码 | DIP | DFP | - | DFP | DIP | QLCC |
针数 | 16 | 16 | - | 16 | 16 | 20 |
系列 | F/FAST | F/FAST | - | F/FAST | F/FAST | F/FAST |
JESD-30 代码 | R-GDIP-T16 | R-GDFP-F16 | - | R-GDFP-F16 | R-GDIP-T16 | S-CQCC-N20 |
JESD-609代码 | e0 | - | e3 | e0 | e0 | - |
长度 | 19.43 mm | 9.6645 mm | - | 9.6645 mm | 19.43 mm | 8.89 mm |
逻辑集成电路类型 | MULTIPLEXER | MULTIPLEXER | - | MULTIPLEXER | MULTIPLEXER | MULTIPLEXER |
功能数量 | 4 | 4 | - | 4 | 4 | 4 |
输入次数 | 2 | 2 | - | 2 | 2 | 2 |
输出次数 | 1 | 1 | - | 1 | 1 | 1 |
端子数量 | 16 | 16 | - | 16 | 16 | 20 |
最高工作温度 | 125 °C | 125 °C | - | 125 °C | 125 °C | 125 °C |
最低工作温度 | -55 °C | -55 °C | - | -55 °C | -55 °C | -55 °C |
输出极性 | INVERTED | INVERTED | - | INVERTED | INVERTED | INVERTED |
封装主体材料 | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | - | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED |
封装代码 | DIP | DFP | - | DFP | DIP | QCCN |
封装形状 | RECTANGULAR | RECTANGULAR | - | RECTANGULAR | RECTANGULAR | SQUARE |
封装形式 | IN-LINE | FLATPACK | - | FLATPACK | IN-LINE | CHIP CARRIER |
传播延迟(tpd) | 8 ns | 8 ns | - | 8 ns | 8 ns | 8 ns |
认证状态 | Not Qualified | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | 5.08 mm | 2.032 mm | - | 2.032 mm | 5.08 mm | 1.905 mm |
最大供电电压 (Vsup) | 5.5 V | 5.5 V | - | 5.5 V | 5.5 V | 5.5 V |
最小供电电压 (Vsup) | 4.5 V | 4.5 V | - | 4.5 V | 4.5 V | 4.5 V |
标称供电电压 (Vsup) | 5 V | 5 V | - | 5 V | 5 V | 5 V |
表面贴装 | NO | YES | - | YES | NO | YES |
技术 | TTL | TTL | - | TTL | TTL | TTL |
温度等级 | MILITARY | MILITARY | - | MILITARY | MILITARY | MILITARY |
端子形式 | THROUGH-HOLE | FLAT | - | FLAT | THROUGH-HOLE | NO LEAD |
端子位置 | DUAL | DUAL | - | DUAL | DUAL | QUAD |
宽度 | 7.62 mm | 6.604 mm | - | 6.604 mm | 7.62 mm | 8.89 mm |
Base Number Matches | 1 | 1 | - | 1 | 1 | - |
电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved