1MX18 STANDARD SRAM, 2.3ns, PBGA165, 13 X 15 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165
| 参数名称 | 属性值 |
| 是否无铅 | 不含铅 |
| 是否Rohs认证 | 符合 |
| 厂商名称 | GSI Technology |
| 零件包装代码 | BGA |
| 包装说明 | LBGA, |
| 针数 | 165 |
| Reach Compliance Code | compliant |
| 最长访问时间 | 2.3 ns |
| 其他特性 | PIPELINED ARCHITECTURE |
| JESD-30 代码 | R-PBGA-B165 |
| JESD-609代码 | e1 |
| 长度 | 15 mm |
| 内存密度 | 18874368 bit |
| 内存集成电路类型 | STANDARD SRAM |
| 内存宽度 | 18 |
| 湿度敏感等级 | 3 |
| 功能数量 | 1 |
| 端子数量 | 165 |
| 字数 | 1048576 words |
| 字数代码 | 1000000 |
| 工作模式 | SYNCHRONOUS |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 组织 | 1MX18 |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | LBGA |
| 封装形状 | RECTANGULAR |
| 封装形式 | GRID ARRAY, LOW PROFILE |
| 并行/串行 | PARALLEL |
| 峰值回流温度（摄氏度） | 260 |
| 认证状态 | Not Qualified |
| 座面最大高度 | 1.4 mm |
| 最大供电电压 (Vsup) | 2.6 V |
| 最小供电电压 (Vsup) | 2.4 V |
| 标称供电电压 (Vsup) | 2.5 V |
| 表面贴装 | YES |
| 温度等级 | INDUSTRIAL |
| 端子面层 | Tin/Silver/Copper (Sn/Ag/Cu) |
| 端子形式 | BALL |
| 端子节距 | 1 mm |
| 端子位置 | BOTTOM |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 13 mm |
| Base Number Matches | 1 |
| GS8180QV18BGD-200TI | GS8180QV18BD-200TI | GS8180QV18BGD-167TI | GS8180QV36BD-200TI | GS8180QV36BGD-200TI | GS8180QV36BD-167TI | GS8180QV36BGD-167TI | GS8180QV18BD-167TI | |
|---|---|---|---|---|---|---|---|---|
| 描述 | 1MX18 STANDARD SRAM, 2.3ns, PBGA165, 13 X 15 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165 | 1MX18 STANDARD SRAM, 2.3ns, PBGA165, 13 X 15 MM, 1 MM PITCH, FPBGA-165 | 1MX18 STANDARD SRAM, 2.5ns, PBGA165, 13 X 15 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165 | 512KX36 STANDARD SRAM, 2.3ns, PBGA165, 13 X 15 MM, 1 MM PITCH, FPBGA-165 | 512KX36 STANDARD SRAM, 2.3ns, PBGA165, 13 X 15 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165 | 512KX36 STANDARD SRAM, 2.5ns, PBGA165, 13 X 15 MM, 1 MM PITCH, FPBGA-165 | 512KX36 STANDARD SRAM, 2.5ns, PBGA165, 13 X 15 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165 | 1MX18 STANDARD SRAM, 2.5ns, PBGA165, 13 X 15 MM, 1 MM PITCH, FPBGA-165 |
| 是否无铅 | 不含铅 | 含铅 | 不含铅 | 含铅 | 不含铅 | 含铅 | 不含铅 | 含铅 |
| 是否Rohs认证 | 符合 | 不符合 | 符合 | 不符合 | 符合 | 不符合 | 符合 | 不符合 |
| 零件包装代码 | BGA | BGA | BGA | BGA | BGA | BGA | BGA | BGA |
| 包装说明 | LBGA, | LBGA, | LBGA, | LBGA, | LBGA, | LBGA, | LBGA, | LBGA, |
| 针数 | 165 | 165 | 165 | 165 | 165 | 165 | 165 | 165 |
| Reach Compliance Code | compliant | compliant | compliant | compliant | compliant | compliant | compliant | compli |
| 最长访问时间 | 2.3 ns | 2.3 ns | 2.5 ns | 2.3 ns | 2.3 ns | 2.5 ns | 2.5 ns | 2.5 ns |
| 其他特性 | PIPELINED ARCHITECTURE | PIPELINED ARCHITECTURE | PIPELINED ARCHITECTURE | PIPELINED ARCHITECTURE | PIPELINED ARCHITECTURE | PIPELINED ARCHITECTURE | PIPELINED ARCHITECTURE | PIPELINED ARCHITECTURE |
| JESD-30 代码 | R-PBGA-B165 | R-PBGA-B165 | R-PBGA-B165 | R-PBGA-B165 | R-PBGA-B165 | R-PBGA-B165 | R-PBGA-B165 | R-PBGA-B165 |
| JESD-609代码 | e1 | e0 | e1 | e0 | e1 | e0 | e1 | e0 |
| 长度 | 15 mm | 15 mm | 15 mm | 15 mm | 15 mm | 15 mm | 15 mm | 15 mm |
| 内存密度 | 18874368 bit | 18874368 bit | 18874368 bit | 18874368 bit | 18874368 bit | 18874368 bit | 18874368 bit | 18874368 bi |
| 内存集成电路类型 | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM |
| 内存宽度 | 18 | 18 | 18 | 36 | 36 | 36 | 36 | 18 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 165 | 165 | 165 | 165 | 165 | 165 | 165 | 165 |
| 字数 | 1048576 words | 1048576 words | 1048576 words | 524288 words | 524288 words | 524288 words | 524288 words | 1048576 words |
| 字数代码 | 1000000 | 1000000 | 1000000 | 512000 | 512000 | 512000 | 512000 | 1000000 |
| 工作模式 | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
| 最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
| 组织 | 1MX18 | 1MX18 | 1MX18 | 512KX36 | 512KX36 | 512KX36 | 512KX36 | 1MX18 |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | LBGA | LBGA | LBGA | LBGA | LBGA | LBGA | LBGA | LBGA |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | GRID ARRAY, LOW PROFILE | GRID ARRAY, LOW PROFILE | GRID ARRAY, LOW PROFILE | GRID ARRAY, LOW PROFILE | GRID ARRAY, LOW PROFILE | GRID ARRAY, LOW PROFILE | GRID ARRAY, LOW PROFILE | GRID ARRAY, LOW PROFILE |
| 并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| 峰值回流温度（摄氏度） | 260 | NOT SPECIFIED | 260 | NOT SPECIFIED | 260 | NOT SPECIFIED | 260 | NOT SPECIFIED |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 1.4 mm | 1.4 mm | 1.4 mm | 1.4 mm | 1.4 mm | 1.4 mm | 1.4 mm | 1.4 mm |
| 最大供电电压 (Vsup) | 2.6 V | 2.6 V | 2.6 V | 2.6 V | 2.6 V | 2.6 V | 2.6 V | 2.6 V |
| 最小供电电压 (Vsup) | 2.4 V | 2.4 V | 2.4 V | 2.4 V | 2.4 V | 2.4 V | 2.4 V | 2.4 V |
| 标称供电电压 (Vsup) | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V |
| 表面贴装 | YES | YES | YES | YES | YES | YES | YES | YES |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子面层 | Tin/Silver/Copper (Sn/Ag/Cu) | Tin/Lead (Sn/Pb) | Tin/Silver/Copper (Sn/Ag/Cu) | Tin/Lead (Sn/Pb) | Tin/Silver/Copper (Sn/Ag/Cu) | Tin/Lead (Sn/Pb) | Tin/Silver/Copper (Sn/Ag/Cu) | Tin/Lead (Sn/Pb) |
| 端子形式 | BALL | BALL | BALL | BALL | BALL | BALL | BALL | BALL |
| 端子节距 | 1 mm | 1 mm | 1 mm | 1 mm | 1 mm | 1 mm | 1 mm | 1 mm |
| 端子位置 | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 宽度 | 13 mm | 13 mm | 13 mm | 13 mm | 13 mm | 13 mm | 13 mm | 13 mm |
| 厂商名称 | GSI Technology | - | GSI Technology | GSI Technology | GSI Technology | GSI Technology | GSI Technology | GSI Technology |
电子工程世界版权所有
京B2-20211791
京ICP备10001474号-1
电信业务审批[2006]字第258号函
京公网安备 11010802033920号
Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
