OCTAL D-TYPE FLIP FLOP WITH 3 STATE OUTPUT HCT564 INVERTING - HCT574 NON INVERTING
| 参数名称 | 属性值 |
| 是否Rohs认证 | 符合 |
| 厂商名称 | ST(意法半导体) |
| 零件包装代码 | DIP |
| 包装说明 | PLASTIC, DIP-20 |
| 针数 | 20 |
| Reach Compliance Code | compli |
| 其他特性 | BROADSIDE VERSION OF 534 |
| 系列 | HCT |
| JESD-30 代码 | R-PDIP-T20 |
| JESD-609代码 | e3 |
| 负载电容（CL） | 150 pF |
| 逻辑集成电路类型 | BUS DRIVER |
| 最大频率@ Nom-Su | 21000000 Hz |
| 最大I（ol） | 0.006 A |
| 位数 | 8 |
| 功能数量 | 1 |
| 端口数量 | 2 |
| 端子数量 | 20 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 输出特性 | 3-STATE |
| 输出极性 | INVERTED |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | DIP |
| 封装等效代码 | DIP20,.3 |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 包装方法 | TUBE |
| 电源 | 5 V |
| 传播延迟（tpd） | 54 ns |
| 认证状态 | Not Qualified |
| 座面最大高度 | 3.93 mm |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | NO |
| 技术 | CMOS |
| 温度等级 | MILITARY |
| 端子面层 | Matte Tin (Sn) |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| 触发器类型 | POSITIVE EDGE |
| 宽度 | 7.62 mm |
| M74HCT564B1R | M74HCT574C1R | M74HCT574 | M74HCT564M1R | M74HCT564C1R | M74HCT564 | M54HCT574F1R | M54HCT574 | M54HCT564F1R | M54HCT564 | |
|---|---|---|---|---|---|---|---|---|---|---|
| 描述 | OCTAL D-TYPE FLIP FLOP WITH 3 STATE OUTPUT HCT564 INVERTING - HCT574 NON INVERTING | OCTAL D-TYPE FLIP FLOP WITH 3 STATE OUTPUT HCT564 INVERTING - HCT574 NON INVERTING | OCTAL D-TYPE FLIP FLOP WITH 3 STATE OUTPUT HCT564 INVERTING - HCT574 NON INVERTING | OCTAL D-TYPE FLIP FLOP WITH 3 STATE OUTPUT HCT564 INVERTING - HCT574 NON INVERTING | OCTAL D-TYPE FLIP FLOP WITH 3 STATE OUTPUT HCT564 INVERTING - HCT574 NON INVERTING | OCTAL D-TYPE FLIP FLOP WITH 3 STATE OUTPUT HCT564 INVERTING - HCT574 NON INVERTING | OCTAL D-TYPE FLIP FLOP WITH 3 STATE OUTPUT HCT564 INVERTING - HCT574 NON INVERTING | OCTAL D-TYPE FLIP FLOP WITH 3 STATE OUTPUT HCT564 INVERTING - HCT574 NON INVERTING | OCTAL D-TYPE FLIP FLOP WITH 3 STATE OUTPUT HCT564 INVERTING - HCT574 NON INVERTING | OCTAL D-TYPE FLIP FLOP WITH 3 STATE OUTPUT HCT564 INVERTING - HCT574 NON INVERTING |
| 是否Rohs认证 | 符合 | 符合 | - | 符合 | 符合 | - | 不符合 | - | 不符合 | - |
| 厂商名称 | ST(意法半导体) | ST(意法半导体) | - | ST(意法半导体) | ST(意法半导体) | - | ST(意法半导体) | - | ST(意法半导体) | - |
| 零件包装代码 | DIP | QLCC | - | SOIC | QLCC | - | DIP | - | DIP | - |
| 包装说明 | PLASTIC, DIP-20 | PLASTIC, LCC-20 | - | SOP-20 | PLASTIC, LCC-20 | - | DIP, DIP20,.3 | - | CERAMIC, DIP-20 | - |
| 针数 | 20 | 20 | - | 20 | 20 | - | 20 | - | 20 | - |
| Reach Compliance Code | compli | compli | - | compli | compli | - | _compli | - | _compli | - |
| 其他特性 | BROADSIDE VERSION OF 534 | BROADSIDE VERSION OF 374 | - | BROADSIDE VERSION OF 534 | BROADSIDE VERSION OF 534 | - | BROADSIDE VERSION OF 374 | - | BROADSIDE VERSION OF 534 | - |
| 系列 | HCT | HCT | - | HCT | HCT | - | HCT | - | HCT | - |
| JESD-30 代码 | R-PDIP-T20 | S-PQCC-J20 | - | R-PDSO-G20 | S-PQCC-J20 | - | R-GDIP-T20 | - | R-GDIP-T20 | - |
| JESD-609代码 | e3 | e3 | - | e4 | e3 | - | e0 | - | e0 | - |
| 负载电容（CL） | 150 pF | 150 pF | - | 150 pF | 150 pF | - | 150 pF | - | 150 pF | - |
| 逻辑集成电路类型 | BUS DRIVER | BUS DRIVER | - | BUS DRIVER | BUS DRIVER | - | BUS DRIVER | - | BUS DRIVER | - |
| 最大频率@ Nom-Su | 21000000 Hz | 25000000 Hz | - | 21000000 Hz | 25000000 Hz | - | 21000000 Hz | - | 21000000 Hz | - |
| 最大I（ol） | 0.006 A | 0.006 A | - | 0.006 A | 0.006 A | - | 0.006 A | - | 0.006 A | - |
| 位数 | 8 | 8 | - | 8 | 8 | - | 8 | - | 8 | - |
| 功能数量 | 1 | 1 | - | 1 | 1 | - | 1 | - | 1 | - |
| 端口数量 | 2 | 2 | - | 2 | 2 | - | 2 | - | 2 | - |
| 端子数量 | 20 | 20 | - | 20 | 20 | - | 20 | - | 20 | - |
| 最高工作温度 | 125 °C | 85 °C | - | 125 °C | 85 °C | - | 125 °C | - | 125 °C | - |
| 最低工作温度 | -55 °C | -40 °C | - | -55 °C | -40 °C | - | -55 °C | - | -55 °C | - |
| 输出特性 | 3-STATE | 3-STATE | - | 3-STATE | 3-STATE | - | 3-STATE | - | 3-STATE | - |
| 输出极性 | INVERTED | TRUE | - | INVERTED | INVERTED | - | TRUE | - | INVERTED | - |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY | - | CERAMIC, GLASS-SEALED | - | CERAMIC, GLASS-SEALED | - |
| 封装代码 | DIP | QCCJ | - | SOP | QCCJ | - | DIP | - | DIP | - |
| 封装等效代码 | DIP20,.3 | LDCC20,.4SQ | - | SOP20,.4 | LDCC20,.4SQ | - | DIP20,.3 | - | DIP20,.3 | - |
| 封装形状 | RECTANGULAR | SQUARE | - | RECTANGULAR | SQUARE | - | RECTANGULAR | - | RECTANGULAR | - |
| 封装形式 | IN-LINE | CHIP CARRIER | - | SMALL OUTLINE | CHIP CARRIER | - | IN-LINE | - | IN-LINE | - |
| 电源 | 5 V | 5 V | - | 5 V | 5 V | - | 5 V | - | 5 V | - |
| 传播延迟（tpd） | 54 ns | 45 ns | - | 54 ns | 45 ns | - | 54 ns | - | 54 ns | - |
| 认证状态 | Not Qualified | Not Qualified | - | Not Qualified | Not Qualified | - | Not Qualified | - | Not Qualified | - |
| 座面最大高度 | 3.93 mm | 4.57 mm | - | 2.65 mm | 4.57 mm | - | 5.71 mm | - | 5.71 mm | - |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | - | 5.5 V | 5.5 V | - | 5.5 V | - | 5.5 V | - |
| 最小供电电压 (Vsup) | 4.5 V | 4.5 V | - | 4.5 V | 4.5 V | - | 4.5 V | - | 4.5 V | - |
| 标称供电电压 (Vsup) | 5 V | 5 V | - | 5 V | 5 V | - | 5 V | - | 5 V | - |
| 表面贴装 | NO | YES | - | YES | YES | - | NO | - | NO | - |
| 技术 | CMOS | CMOS | - | CMOS | CMOS | - | CMOS | - | CMOS | - |
| 温度等级 | MILITARY | INDUSTRIAL | - | MILITARY | INDUSTRIAL | - | MILITARY | - | MILITARY | - |
| 端子面层 | Matte Tin (Sn) | Matte Tin (Sn) | - | Nickel/Palladium/Gold (Ni/Pd/Au) | Matte Tin (Sn) | - | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) | - |
| 端子形式 | THROUGH-HOLE | J BEND | - | GULL WING | J BEND | - | THROUGH-HOLE | - | THROUGH-HOLE | - |
| 端子节距 | 2.54 mm | 1.27 mm | - | 1.27 mm | 1.27 mm | - | 2.54 mm | - | 2.54 mm | - |
| 端子位置 | DUAL | QUAD | - | DUAL | QUAD | - | DUAL | - | DUAL | - |
| 触发器类型 | POSITIVE EDGE | POSITIVE EDGE | - | POSITIVE EDGE | POSITIVE EDGE | - | POSITIVE EDGE | - | POSITIVE EDGE | - |
| 宽度 | 7.62 mm | 8.965 mm | - | 7.5 mm | 8.965 mm | - | 7.62 mm | - | 7.62 mm | - |
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