OCTAL D-TYPE FLIP FLOP WITH 3 STATE OUTPUT HCT564 INVERTING - HCT574 NON INVERTING
参数名称 | 属性值 |
是否Rohs认证 | 符合 |
厂商名称 | ST(意法半导体) |
零件包装代码 | SOIC |
包装说明 | SOP-20 |
针数 | 20 |
Reach Compliance Code | compli |
Is Samacsys | N |
其他特性 | BROADSIDE VERSION OF 534 |
系列 | HCT |
JESD-30 代码 | R-PDSO-G20 |
JESD-609代码 | e4 |
长度 | 12.8 mm |
负载电容(CL) | 150 pF |
逻辑集成电路类型 | BUS DRIVER |
最大频率@ Nom-Su | 21000000 Hz |
最大I(ol) | 0.006 A |
位数 | 8 |
功能数量 | 1 |
端口数量 | 2 |
端子数量 | 20 |
最高工作温度 | 125 °C |
最低工作温度 | -55 °C |
输出特性 | 3-STATE |
输出极性 | INVERTED |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | SOP |
封装等效代码 | SOP20,.4 |
封装形状 | RECTANGULAR |
封装形式 | SMALL OUTLINE |
包装方法 | TUBE |
电源 | 5 V |
传播延迟(tpd) | 54 ns |
认证状态 | Not Qualified |
座面最大高度 | 2.65 mm |
最大供电电压 (Vsup) | 5.5 V |
最小供电电压 (Vsup) | 4.5 V |
标称供电电压 (Vsup) | 5 V |
表面贴装 | YES |
技术 | CMOS |
温度等级 | MILITARY |
端子面层 | Nickel/Palladium/Gold (Ni/Pd/Au) |
端子形式 | GULL WING |
端子节距 | 1.27 mm |
端子位置 | DUAL |
触发器类型 | POSITIVE EDGE |
宽度 | 7.5 mm |
Base Number Matches | 1 |
M74HCT564M1R | M74HCT574C1R | M74HCT574 | M74HCT564C1R | M74HCT564B1R | M74HCT564 | M54HCT574F1R | M54HCT574 | M54HCT564F1R | M54HCT564 | |
---|---|---|---|---|---|---|---|---|---|---|
描述 | OCTAL D-TYPE FLIP FLOP WITH 3 STATE OUTPUT HCT564 INVERTING - HCT574 NON INVERTING | OCTAL D-TYPE FLIP FLOP WITH 3 STATE OUTPUT HCT564 INVERTING - HCT574 NON INVERTING | OCTAL D-TYPE FLIP FLOP WITH 3 STATE OUTPUT HCT564 INVERTING - HCT574 NON INVERTING | OCTAL D-TYPE FLIP FLOP WITH 3 STATE OUTPUT HCT564 INVERTING - HCT574 NON INVERTING | OCTAL D-TYPE FLIP FLOP WITH 3 STATE OUTPUT HCT564 INVERTING - HCT574 NON INVERTING | OCTAL D-TYPE FLIP FLOP WITH 3 STATE OUTPUT HCT564 INVERTING - HCT574 NON INVERTING | OCTAL D-TYPE FLIP FLOP WITH 3 STATE OUTPUT HCT564 INVERTING - HCT574 NON INVERTING | OCTAL D-TYPE FLIP FLOP WITH 3 STATE OUTPUT HCT564 INVERTING - HCT574 NON INVERTING | OCTAL D-TYPE FLIP FLOP WITH 3 STATE OUTPUT HCT564 INVERTING - HCT574 NON INVERTING | OCTAL D-TYPE FLIP FLOP WITH 3 STATE OUTPUT HCT564 INVERTING - HCT574 NON INVERTING |
是否Rohs认证 | 符合 | 符合 | - | 符合 | 符合 | - | 不符合 | - | 不符合 | - |
厂商名称 | ST(意法半导体) | ST(意法半导体) | - | ST(意法半导体) | ST(意法半导体) | - | ST(意法半导体) | - | ST(意法半导体) | - |
零件包装代码 | SOIC | QLCC | - | QLCC | DIP | - | DIP | - | DIP | - |
包装说明 | SOP-20 | PLASTIC, LCC-20 | - | PLASTIC, LCC-20 | PLASTIC, DIP-20 | - | DIP, DIP20,.3 | - | CERAMIC, DIP-20 | - |
针数 | 20 | 20 | - | 20 | 20 | - | 20 | - | 20 | - |
Reach Compliance Code | compli | compli | - | compli | compli | - | _compli | - | _compli | - |
其他特性 | BROADSIDE VERSION OF 534 | BROADSIDE VERSION OF 374 | - | BROADSIDE VERSION OF 534 | BROADSIDE VERSION OF 534 | - | BROADSIDE VERSION OF 374 | - | BROADSIDE VERSION OF 534 | - |
系列 | HCT | HCT | - | HCT | HCT | - | HCT | - | HCT | - |
JESD-30 代码 | R-PDSO-G20 | S-PQCC-J20 | - | S-PQCC-J20 | R-PDIP-T20 | - | R-GDIP-T20 | - | R-GDIP-T20 | - |
JESD-609代码 | e4 | e3 | - | e3 | e3 | - | e0 | - | e0 | - |
负载电容(CL) | 150 pF | 150 pF | - | 150 pF | 150 pF | - | 150 pF | - | 150 pF | - |
逻辑集成电路类型 | BUS DRIVER | BUS DRIVER | - | BUS DRIVER | BUS DRIVER | - | BUS DRIVER | - | BUS DRIVER | - |
最大频率@ Nom-Su | 21000000 Hz | 25000000 Hz | - | 25000000 Hz | 21000000 Hz | - | 21000000 Hz | - | 21000000 Hz | - |
最大I(ol) | 0.006 A | 0.006 A | - | 0.006 A | 0.006 A | - | 0.006 A | - | 0.006 A | - |
位数 | 8 | 8 | - | 8 | 8 | - | 8 | - | 8 | - |
功能数量 | 1 | 1 | - | 1 | 1 | - | 1 | - | 1 | - |
端口数量 | 2 | 2 | - | 2 | 2 | - | 2 | - | 2 | - |
端子数量 | 20 | 20 | - | 20 | 20 | - | 20 | - | 20 | - |
最高工作温度 | 125 °C | 85 °C | - | 85 °C | 125 °C | - | 125 °C | - | 125 °C | - |
最低工作温度 | -55 °C | -40 °C | - | -40 °C | -55 °C | - | -55 °C | - | -55 °C | - |
输出特性 | 3-STATE | 3-STATE | - | 3-STATE | 3-STATE | - | 3-STATE | - | 3-STATE | - |
输出极性 | INVERTED | TRUE | - | INVERTED | INVERTED | - | TRUE | - | INVERTED | - |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY | - | CERAMIC, GLASS-SEALED | - | CERAMIC, GLASS-SEALED | - |
封装代码 | SOP | QCCJ | - | QCCJ | DIP | - | DIP | - | DIP | - |
封装等效代码 | SOP20,.4 | LDCC20,.4SQ | - | LDCC20,.4SQ | DIP20,.3 | - | DIP20,.3 | - | DIP20,.3 | - |
封装形状 | RECTANGULAR | SQUARE | - | SQUARE | RECTANGULAR | - | RECTANGULAR | - | RECTANGULAR | - |
封装形式 | SMALL OUTLINE | CHIP CARRIER | - | CHIP CARRIER | IN-LINE | - | IN-LINE | - | IN-LINE | - |
电源 | 5 V | 5 V | - | 5 V | 5 V | - | 5 V | - | 5 V | - |
传播延迟(tpd) | 54 ns | 45 ns | - | 45 ns | 54 ns | - | 54 ns | - | 54 ns | - |
认证状态 | Not Qualified | Not Qualified | - | Not Qualified | Not Qualified | - | Not Qualified | - | Not Qualified | - |
座面最大高度 | 2.65 mm | 4.57 mm | - | 4.57 mm | 3.93 mm | - | 5.71 mm | - | 5.71 mm | - |
最大供电电压 (Vsup) | 5.5 V | 5.5 V | - | 5.5 V | 5.5 V | - | 5.5 V | - | 5.5 V | - |
最小供电电压 (Vsup) | 4.5 V | 4.5 V | - | 4.5 V | 4.5 V | - | 4.5 V | - | 4.5 V | - |
标称供电电压 (Vsup) | 5 V | 5 V | - | 5 V | 5 V | - | 5 V | - | 5 V | - |
表面贴装 | YES | YES | - | YES | NO | - | NO | - | NO | - |
技术 | CMOS | CMOS | - | CMOS | CMOS | - | CMOS | - | CMOS | - |
温度等级 | MILITARY | INDUSTRIAL | - | INDUSTRIAL | MILITARY | - | MILITARY | - | MILITARY | - |
端子面层 | Nickel/Palladium/Gold (Ni/Pd/Au) | Matte Tin (Sn) | - | Matte Tin (Sn) | Matte Tin (Sn) | - | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) | - |
端子形式 | GULL WING | J BEND | - | J BEND | THROUGH-HOLE | - | THROUGH-HOLE | - | THROUGH-HOLE | - |
端子节距 | 1.27 mm | 1.27 mm | - | 1.27 mm | 2.54 mm | - | 2.54 mm | - | 2.54 mm | - |
端子位置 | DUAL | QUAD | - | QUAD | DUAL | - | DUAL | - | DUAL | - |
触发器类型 | POSITIVE EDGE | POSITIVE EDGE | - | POSITIVE EDGE | POSITIVE EDGE | - | POSITIVE EDGE | - | POSITIVE EDGE | - |
宽度 | 7.5 mm | 8.965 mm | - | 8.965 mm | 7.62 mm | - | 7.62 mm | - | 7.62 mm | - |
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