Bus Driver, ABT Series, 8-Func, 1-Bit, True Output, BICMOS, CDIP20,
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 包装说明 | DIP, DIP20,.3 |
| Reach Compliance Code | compliant |
| ECCN代码 | EAR99 |
| 控制类型 | ENABLE LOW |
| 系列 | ABT |
| JESD-30 代码 | R-GDIP-T20 |
| JESD-609代码 | e0 |
| 长度 | 24.195 mm |
| 逻辑集成电路类型 | BUS DRIVER |
| 最大I（ol） | 0.048 A |
| 位数 | 1 |
| 功能数量 | 8 |
| 端口数量 | 2 |
| 端子数量 | 20 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 输出特性 | 3-STATE |
| 输出极性 | TRUE |
| 封装主体材料 | CERAMIC, GLASS-SEALED |
| 封装代码 | DIP |
| 封装等效代码 | DIP20,.3 |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 峰值回流温度（摄氏度） | NOT APPLICABLE |
| 电源 | 5 V |
| Prop。Delay @ Nom-Sup | 5.3 ns |
| 传播延迟（tpd） | 5.3 ns |
| 认证状态 | Qualified |
| 筛选级别 | 38535Q/M;38534H;883B |
| 座面最大高度 | 5.08 mm |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | NO |
| 技术 | BICMOS |
| 温度等级 | MILITARY |
| 端子面层 | Tin/Lead (Sn/Pb) - hot dipped |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | NOT APPLICABLE |
| 宽度 | 7.62 mm |
| Base Number Matches | 1 |
| 5962-9214701MRA | 5962-9214701QSA | 5962-9214701M2A | 5962-9214701Q2A | 5962-9214701QRA | 5962-9214701MSA | |
|---|---|---|---|---|---|---|
| 描述 | Bus Driver, ABT Series, 8-Func, 1-Bit, True Output, BICMOS, CDIP20, | Bus Driver, ABT Series, 2-Func, 4-Bit, True Output, BICMOS, CDFP20, CERAMIC, DFP-20 | Bus Driver, ABT Series, 8-Func, 1-Bit, True Output, BICMOS, CQCC20, | Bus Driver, ABT Series, 2-Func, 4-Bit, True Output, BICMOS, CQCC20, CERAMIC, LCC-20 | Bus Driver, ABT Series, 2-Func, 4-Bit, True Output, BICMOS, CDIP20, | Bus Driver, ABT Series, 8-Func, 1-Bit, True Output, BICMOS, CDFP20, |
| 包装说明 | DIP, DIP20,.3 | DFP, FL20,.3 | QCCN, LCC20,.35SQ | CERAMIC, LCC-20 | DIP, DIP20,.3 | DFP, FL20,.3 |
| Reach Compliance Code | compliant | compliant | compliant | compliant | compliant | compliant |
| 控制类型 | ENABLE LOW | ENABLE LOW | ENABLE LOW | ENABLE LOW | ENABLE LOW | ENABLE LOW |
| 系列 | ABT | ABT | ABT | ABT | ABT | ABT |
| JESD-30 代码 | R-GDIP-T20 | R-GDFP-F20 | S-CQCC-N20 | S-CQCC-N20 | R-GDIP-T20 | R-GDFP-F20 |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 |
| 逻辑集成电路类型 | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER |
| 最大I（ol） | 0.048 A | 0.048 A | 0.048 A | 0.048 A | 0.048 A | 0.048 A |
| 位数 | 1 | 4 | 1 | 4 | 4 | 1 |
| 功能数量 | 8 | 2 | 8 | 2 | 2 | 8 |
| 端口数量 | 2 | 2 | 2 | 2 | 2 | 2 |
| 端子数量 | 20 | 20 | 20 | 20 | 20 | 20 |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| 输出极性 | TRUE | TRUE | TRUE | TRUE | TRUE | TRUE |
| 封装主体材料 | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED |
| 封装代码 | DIP | DFP | QCCN | QCCN | DIP | DFP |
| 封装等效代码 | DIP20,.3 | FL20,.3 | LCC20,.35SQ | LCC20,.35SQ | DIP20,.3 | FL20,.3 |
| 封装形状 | RECTANGULAR | RECTANGULAR | SQUARE | SQUARE | RECTANGULAR | RECTANGULAR |
| 封装形式 | IN-LINE | FLATPACK | CHIP CARRIER | CHIP CARRIER | IN-LINE | FLATPACK |
| 电源 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| Prop。Delay @ Nom-Sup | 5.3 ns | 5.3 ns | 5.3 ns | 5.3 ns | 5.3 ns | 5.3 ns |
| 传播延迟（tpd） | 5.3 ns | 5.3 ns | 5.3 ns | 5.3 ns | 5.3 ns | 5.3 ns |
| 认证状态 | Qualified | Qualified | Qualified | Qualified | Qualified | Qualified |
| 筛选级别 | 38535Q/M;38534H;883B | MIL-PRF-38535 Class Q | 38535Q/M;38534H;883B | MIL-PRF-38535 Class Q | 38535Q/M;38534H;883B | 38535Q/M;38534H;883B |
| 座面最大高度 | 5.08 mm | 2.286 mm | 2.03 mm | 1.905 mm | 5.08 mm | 2.54 mm |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | NO | YES | YES | YES | NO | YES |
| 技术 | BICMOS | BICMOS | BICMOS | BICMOS | BICMOS | BICMOS |
| 温度等级 | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY |
| 端子面层 | Tin/Lead (Sn/Pb) - hot dipped | TIN LEAD | Tin/Lead (Sn/Pb) - hot dipped | TIN LEAD | TIN LEAD | Tin/Lead (Sn/Pb) - hot dipped |
| 端子形式 | THROUGH-HOLE | FLAT | NO LEAD | NO LEAD | THROUGH-HOLE | FLAT |
| 端子节距 | 2.54 mm | 1.27 mm | 1.27 mm | 1.27 mm | 2.54 mm | 1.27 mm |
| 端子位置 | DUAL | DUAL | QUAD | QUAD | DUAL | DUAL |
| 宽度 | 7.62 mm | 6.731 mm | 8.89 mm | 8.89 mm | 7.62 mm | 6.92 mm |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 |
| 长度 | 24.195 mm | - | 8.89 mm | 8.89 mm | 24.51 mm | 13.09 mm |
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