ACT SERIES, 4-BIT ADDER/SUBTRACTOR, CQCC20, CERAMIC, LCC-20
参数名称 | 属性值 |
包装说明 | QCCN, |
Reach Compliance Code | unknown |
其他特性 | FULL ADDER; INTERNAL CARRY LOOKAHEAD |
系列 | ACT |
JESD-30 代码 | S-CQCC-N20 |
长度 | 8.89 mm |
逻辑集成电路类型 | ADDER/SUBTRACTOR |
位数 | 4 |
功能数量 | 1 |
端子数量 | 20 |
最高工作温度 | 125 °C |
最低工作温度 | -55 °C |
封装主体材料 | CERAMIC, METAL-SEALED COFIRED |
封装代码 | QCCN |
封装形状 | SQUARE |
封装形式 | CHIP CARRIER |
传播延迟(tpd) | 17 ns |
认证状态 | Not Qualified |
座面最大高度 | 1.905 mm |
最大供电电压 (Vsup) | 5.5 V |
最小供电电压 (Vsup) | 4.5 V |
标称供电电压 (Vsup) | 5 V |
表面贴装 | YES |
技术 | CMOS |
温度等级 | MILITARY |
端子形式 | NO LEAD |
端子节距 | 1.27 mm |
端子位置 | QUAD |
宽度 | 8.89 mm |
Base Number Matches | 1 |
54ACT283LM | 54ACT283DMQB/NOPB | 54ACT283FMQB/NOPB | 54ACT283DM | 54ACT283FM | |
---|---|---|---|---|---|
描述 | ACT SERIES, 4-BIT ADDER/SUBTRACTOR, CQCC20, CERAMIC, LCC-20 | ACT SERIES, 4-BIT ADDER/SUBTRACTOR, CDIP16, CERAMIC, DIP-16 | ACT SERIES, 4-BIT ADDER/SUBTRACTOR, CDFP16, CERAMIC, FP-16 | ACT SERIES, 4-BIT ADDER/SUBTRACTOR, CDIP16, CERAMIC, DIP-16 | ACT SERIES, 4-BIT ADDER/SUBTRACTOR, CDFP16, CERAMIC, FP-16 |
包装说明 | QCCN, | DIP, | DFP, | DIP, | DFP, |
Reach Compliance Code | unknown | compliant | compliant | unknown | unknow |
其他特性 | FULL ADDER; INTERNAL CARRY LOOKAHEAD | FULL ADDER; INTERNAL CARRY LOOKAHEAD | FULL ADDER; INTERNAL CARRY LOOKAHEAD | FULL ADDER; INTERNAL CARRY LOOKAHEAD | FULL ADDER; INTERNAL CARRY LOOKAHEAD |
系列 | ACT | ACT | ACT | ACT | ACT |
JESD-30 代码 | S-CQCC-N20 | R-GDIP-T16 | R-GDFP-F16 | R-GDIP-T16 | R-GDFP-F16 |
长度 | 8.89 mm | 19.43 mm | 9.6645 mm | 19.43 mm | 9.6645 mm |
逻辑集成电路类型 | ADDER/SUBTRACTOR | ADDER/SUBTRACTOR | ADDER/SUBTRACTOR | ADDER/SUBTRACTOR | ADDER/SUBTRACTOR |
位数 | 4 | 4 | 4 | 4 | 4 |
功能数量 | 1 | 1 | 1 | 1 | 1 |
端子数量 | 20 | 16 | 16 | 16 | 16 |
最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
最低工作温度 | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C |
封装主体材料 | CERAMIC, METAL-SEALED COFIRED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED |
封装代码 | QCCN | DIP | DFP | DIP | DFP |
封装形状 | SQUARE | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | CHIP CARRIER | IN-LINE | FLATPACK | IN-LINE | FLATPACK |
传播延迟(tpd) | 17 ns | 17 ns | 17 ns | 17 ns | 17 ns |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | 1.905 mm | 5.08 mm | 2.032 mm | 5.08 mm | 2.032 mm |
最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V |
表面贴装 | YES | NO | YES | NO | YES |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY |
端子形式 | NO LEAD | THROUGH-HOLE | FLAT | THROUGH-HOLE | FLAT |
端子节距 | 1.27 mm | 2.54 mm | 1.27 mm | 2.54 mm | 1.27 mm |
端子位置 | QUAD | DUAL | DUAL | DUAL | DUAL |
宽度 | 8.89 mm | 7.62 mm | 6.604 mm | 7.62 mm | 6.604 mm |
Base Number Matches | 1 | 1 | 1 | 1 | - |
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