MNS Microwave Chip Capacitors
MA4M Series
MA4M Series
MNS Microwave
Chip Capacitors
Features
•
Excellent Repeatability
(Wafer-to-Wafer and Lot-to-Lot)
•
Small Size
•
Low Loss, High Q
•
Available with Round or Square Bonding Pads
Case Style
Description
M/A-COM’s MA4M series of MNS (metal-nitride-silicon) sili-
con chip capacitors is designed specifically for high reliability and
repeatable performance in microwave circuit applications. These
capacitors are made using a low pressure chemical vapor deposi-
tion (LPCVD) that results in dense, uniform nitride layers. These
capacitors exhibit higher capacitance per unit area (resulting in
smaller chip size) than similar MOS, MIS and ceramic capacitors.
Evaporated gold contacts are used to provide an easily bondable
metal pad on the capacitor chip. M/A-COM MNS capacitors have
shown no measurable capacitance change when subjected to the
rated standoff voltage of 150ºC.
The MA4M series of chip capacitors is an excellent choice for use
in hybrid microwave circuits up through Ku-band, where low
loss, high reliability, small size and temperature stability are
prime concerns.
These chip capacitors are suited for applications requiring DC
blocks, coupling capacitors, bypass capacitors, capacitive loads
and tuning elements in oscillators, multipliers and filters.
350
Comparison of M/A-COM MNS Capacitors to Ceramic Chip Capacitors
Characteristics Compared
Operating Temperature Range
Temperature Coefficient
Insertion Loss of a 20 pF Capacitor in a 50
Ω
line at 15 GHz
Chip Size
200 pF, 100V
20 pF, 100V
MNS
-55 to +200°C
180 PPM
0.1 dB
40 x 40 mils
22 x 22 mils
Ceramic
-55 to +125°C
1000 PPM
0.2 dB
70 x 70 mils
50 x 50 mils
V3.00
M/A-COM Division of AMP Incorporated
s
North America: Tel. (800) 366-2266, Fax (800) 618-8883
s
Asia/Pacific: Tel.+85 2 2111 8088, Fax +85 2 2111 8087
s
Europe: Tel. +44 (1344) 869 595, Fax+44 (1344) 300 020
www.macom.com
AMP and Connecting at a Higher Level are trademarks.
Specifications subject to change without notice.
MNS Microwave Chip Capacitors
MA4M Series
Specifications
Chip Capacitors with Round Bonding Pads
Maximum
Standoff
Capactance Voltage
2,5
1,2,3,4
Rating
(pF)
(Volts)
±
10 %
2
5
10
20
20
30
50
80
100
100
200
250
300
300
600
200
200
100
100
200
100
100
100
100
200
100
100
100
200
100
Nominal
Top
Contact
Diameter
(mils)
3.5
6.0
6.0
9.0
11.5
11.0
14.0
18.0
20.0
26.0
28.0
32.0
35.0
45.0
48.0
Chip Capacitors with Square Bonding Pads
Maximum
Standoff
Voltage
2,5
Rating
(Volts)
200
200
200
200
50
50
Model
Number
MA4M2002
MA4M2005
MA4M1010
MA4M1020
MA4M2020
MA4M1030
MA4M1050
MA4M1080
MA4M1100
MA4M2100
MA4M1200
MA4M1250
MA4M1300
MA4M2300
MA4M1600
Chip
Style
132
132
132
132
132
132
132
199
199
200
200
200
201
263
263
Model
Number
MA4M3010
MA4M3020
MA4M3030
MA4M3050
MA4M3100
MA4M3150
Capactance
1,2,3,4
(pF)
±
10 %
10
20
30
50
100
150
Chip
Style
350
351
352
354
358
359
Notes:
1 5% capacitance tolerance is available on request.
2 Other capacitance and standoff voltage values are available on request.
3 Capacitance is measured at 1 MHz.
4 Temperature coefficient of capacitance is nominally 180 PPM/°C.
5 Device failure may occur if standoff voltage ratio is exceeded.
Maximum Ratings
Applied Voltage
Operating Temperature
Storage Temperature
Specified standoff voltage
-55°C to +200°C
-55°C to +200°C
TYPICAL CAPACITANCE CHANGE FOR MNS and
CERAMIC CAPACITOR vs TEMPERATURE
(200 pF CAPACITOR)
+10
+8
+6
+4
%
CAPACITANCE
CHANGE
TEMPERATURE
qC
-75
-25
0
-4
-6
-8
25
50
125
150
200
M/A-COM MA4M1200
CAPACITOR
-10
CERAMIC
CAPACITOR
V3.00
M/A-COM Division of AMP Incorporated
s
North America: Tel. (800) 366-2266, Fax (800) 618-8883
s
Asia/Pacific: Tel.+85 2 2111 8088, Fax +85 2 2111 8087
s
Europe: Tel. +44 (1344) 869 595, Fax+44 (1344) 300 020
www.macom.com
AMP and Connecting at a Higher Level are trademarks.
Specifications subject to change without notice.
MNS Microwave Chip Capacitors
MA4M Series
Case Style
Chip
Style
132
DIM.
A
B
199
A
B
200
A
B
201
A
B
263
A
B
INCHES
MIN.
0.020
0.003
0.027
0.004
0.037
0.004
0.047
0.004
—
0.004
MAX.
0.024
0.008
0.031
0.008
0.041
0.008
0.051
0.008
0.060
0.008
MILLIMETERS
MIN.
0.51
0.08
0.69
0.10
0.94
0.10
1.19
0.10
—
0.10
MAX.
0.61
0.203
0.79
0.203
1.04
0.203
1.30
0.203
1.52
0.203
C
A
B
Note:
For “C” dimension on above case styles, see specifications.
Chip
Style
350
DIM.
A
B
C
351
A
B
C
C
A
INCHES
MIN.
0.018
—
—
0.018
—
—
0.018
—
—
0.020
—
—
0.018
—
—
0.018
—
—
MAX.
0.021
0.008
0.009
0.021
0.008
0.012
0.021
0.008
0.015
0.023
0.008
0.018
0.021
0.008
0.013
0.021
0.008
0.016
MILLIMETERS
MIN.
0.46
—
—
0.46
—
—
0.46
—
—
0.51
—
—
0.46
—
—
0.46
—
—
MAX.
0.53
0.203
0.23
0.53
0.203
0.30
0.53
0.203
0.38
0.58
0.203
0.46
0.53
0.203
0.33
0.53
0.203
0.41
352
A
B
C
354
A
B
C
B
358
A
B
C
359
A
B
C
V3.00
M/A-COM Division of AMP Incorporated
s
North America: Tel. (800) 366-2266, Fax (800) 618-8883
s
Asia/Pacific: Tel.+85 2 2111 8088, Fax +85 2 2111 8087
s
Europe: Tel. +44 (1344) 869 595, Fax+44 (1344) 300 020
www.macom.com
AMP and Connecting at a Higher Level are trademarks.
Specifications subject to change without notice.
MNS Microwave Chip Capacitors
MA4M Series
Bonding and Handling Considerations for
MNS Chip Capacitors
Handling
Normal precautions that are common to the handling of hybrid
semiconductors also apply to MNS chip capacitors. Removal of
chips from waffle packs and subsequent handling should be
done with a vacuum pencil. Pencils equipped with either metal-
lic or nonmetallic tips are acceptable.
Conductive Epoxy
Any of the conductive epoxies that are available for semicon-
ductor die attachment are acceptable for MNS chip capacitor
attachment. Follow the manufacturer’s recommendations for
mixing and application carefully. Take care to seat the capacitor
on the substrate using a soft implement.
Surface Preparation
Each MNS chip and substrate should be free of oils and other
surface contamination. Such contaminants may result in poor
solder wetting. Cleansing can be done with acetone, alcohol,
freon, TMS or other common microelectronic solvents. Bur-
nishing of MNS capacitor chips is not necessary or recom-
mended.
Lead Bonding
Ball, ultrasonic, TC or pulse bonding of the wire or ribbon leads
are all acceptable methods. Temperature for the pulse bonder
should not exceed 300ºC. Maximum pressure applied to the
MNS capacitor chips should not exceed 25 grams for any of the
methods used. Proper procedure will result in bond strength that
exceeds MIL-STD-883B Method 2011.2 for gold wire or gold
ribbon.
Solder
Soldering temperatures up to 300ºC are acceptable for a duration
not greater than 5 seconds for MNS chip capacitors. Any of the
common tin-lead-silver, lead-indium, or higher temperature gold
alloy solders are acceptable provided that the 300ºC temperature
is not exceeded. Pure tin or tin-antimony solders are not
recommended. Cleaning of residual flux is required and can be
accomplished with a fluorinated or chlorinated solvent.
V3.00
M/A-COM Division of AMP Incorporated
s
North America: Tel. (800) 366-2266, Fax (800) 618-8883
s
Asia/Pacific: Tel.+85 2 2111 8088, Fax +85 2 2111 8087
s
Europe: Tel. +44 (1344) 869 595, Fax+44 (1344) 300 020
www.macom.com
AMP and Connecting at a Higher Level are trademarks.
Specifications subject to change without notice.
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