10-Bit, 40Msps, TTL-Output ADC
MAX1161 | MAX1161BCWI | MAX1161BCPI | MAX1161ACWI | MAX1161ACPI | |
---|---|---|---|---|---|
描述 | 10-Bit, 40Msps, TTL-Output ADC | 10-Bit, 40Msps, TTL-Output ADC | 10-Bit, 40Msps, TTL-Output ADC | 10-Bit, 40Msps, TTL-Output ADC | 10-Bit, 40Msps, TTL-Output ADC |
是否Rohs认证 | - | 不符合 | 不符合 | 不符合 | 不符合 |
厂商名称 | - | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) |
零件包装代码 | - | SOIC | DIP | SOIC | DIP |
包装说明 | - | 0.300 INCH, PLASTIC, MS-013AE, SOIC-28 | 0.600 INCH, PLASTIC, DIP-28 | 0.300 INCH, PLASTIC, MS-013AE, SOIC-28 | 0.600 INCH, PLASTIC, DIP-28 |
针数 | - | 28 | 28 | 28 | 28 |
Reach Compliance Code | - | _compli | _compli | _compli | _compli |
ECCN代码 | - | EAR99 | EAR99 | EAR99 | EAR99 |
最大模拟输入电压 | - | 2 V | 2 V | 2 V | 2 V |
最小模拟输入电压 | - | -2 V | -2 V | -2 V | -2 V |
转换器类型 | - | ADC, PROPRIETARY METHOD | ADC, PROPRIETARY METHOD | ADC, PROPRIETARY METHOD | ADC, PROPRIETARY METHOD |
JESD-30 代码 | - | R-PDSO-G28 | R-PDIP-T28 | R-PDSO-G28 | R-PDIP-T28 |
JESD-609代码 | - | e0 | e0 | e0 | e0 |
长度 | - | 17.9 mm | 36.83 mm | 17.9 mm | 36.83 mm |
标称负供电电压 | - | -5.2 V | -5.2 V | -5.2 V | -5.2 V |
模拟输入通道数量 | - | 1 | 1 | 1 | 1 |
位数 | - | 10 | 10 | 10 | 10 |
功能数量 | - | 1 | 1 | 1 | 1 |
端子数量 | - | 28 | 28 | 28 | 28 |
最高工作温度 | - | 70 °C | 70 °C | 70 °C | 70 °C |
输出位码 | - | BINARY | BINARY | BINARY | BINARY |
输出格式 | - | PARALLEL, WORD | PARALLEL, WORD | PARALLEL, WORD | PARALLEL, WORD |
封装主体材料 | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | - | SOP | DIP | SOP | DIP |
封装等效代码 | - | SOP28,.4 | DIP28,.6 | SOP28,.4 | DIP28,.6 |
封装形状 | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | - | SMALL OUTLINE | IN-LINE | SMALL OUTLINE | IN-LINE |
峰值回流温度(摄氏度) | - | 240 | NOT SPECIFIED | 240 | NOT SPECIFIED |
电源 | - | 5,-5.2 V | 5,-5.2 V | 5,-5.2 V | 5,-5.2 V |
认证状态 | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
采样速率 | - | 40 MHz | 40 MHz | 40 MHz | 40 MHz |
采样并保持/跟踪并保持 | - | TRACK | TRACK | TRACK | TRACK |
座面最大高度 | - | 2.65 mm | 5.08 mm | 2.65 mm | 5.08 mm |
最大压摆率 | - | 145 mA | 145 mA | 145 mA | 145 mA |
标称供电电压 | - | 5 V | 5 V | 5 V | 5 V |
表面贴装 | - | YES | NO | YES | NO |
技术 | - | CMOS | CMOS | CMOS | CMOS |
温度等级 | - | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
端子面层 | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
端子形式 | - | GULL WING | THROUGH-HOLE | GULL WING | THROUGH-HOLE |
端子节距 | - | 1.27 mm | 2.54 mm | 1.27 mm | 2.54 mm |
端子位置 | - | DUAL | DUAL | DUAL | DUAL |
处于峰值回流温度下的最长时间 | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
宽度 | - | 7.5 mm | 15.24 mm | 7.5 mm | 15.24 mm |
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